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公开(公告)号：US10833591B2
公开(公告)日：2020-11-10
申请号：US15657786
申请日：2017-07-24
Applicant: ABB Power Electronics Inc.
Inventor： Arturo Silva , Loc Ngo , Richard Yeager , Jouni Uusitalo
Abstract: A power converter is provided. The power converter includes an input side having a first input winding and a second input winding coupled in electrical series to the first input winding. The power converter also includes an output side having a first output winding and a second output winding coupled in electrical parallel to the first output winding.
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公开(公告)号：US10826405B1
公开(公告)日：2020-11-03
申请号：US16428879
申请日：2019-05-31
Applicant: ABB Power Electronics Inc.
Inventor： Sandeep Bala , Liming Liu , Jing Xu
Abstract: According to an aspect of this disclosure, a circuit includes a voltage source and an output load, first and second resonant modules disposed between the voltage source and the output load, and first and second transformers. The circuit is further arranged such that the first transformer is disposed between the first resonant module and the output load, and the second transformer is disposed between the second resonant module and the output load. The circuit also includes a plurality of half-bridges coupled between the first and second resonant modules and the voltage source. The circuit further includes a voltage divider disposed between the voltage source and the plurality of half-bridges.
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公开(公告)号：US11439013B2
公开(公告)日：2022-09-06
申请号：US17209591
申请日：2021-03-23
Applicant: ABB Power Electronics, Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may be positioned at a third height orthogonal to the surface, where the third height is greater than the first height.
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公开(公告)号：US20210037649A1
公开(公告)日：2021-02-04
申请号：US16528510
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
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公开(公告)号：US20210037648A1
公开(公告)日：2021-02-04
申请号：US16528505
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board having a surface, an electrical component mounted on the surface, a pin mounted on the surface, and an interposer printed circuit board mounted on the surface. The electrical component may have a first height orthogonal to the surface. The pin may have a second height orthogonal to the surface, where the second height is greater than the first height. The interposer printed circuit board may comprise a pad and an outer solder bump positioned on the pad. The outer solder bump may have a third height orthogonal to the surface, where the third height is greater than the first height.
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Patent Agency Ranking
公开(公告)号：US20240106355A1
公开(公告)日：2024-03-28
申请号：US18468157
申请日：2023-09-15
Applicant: ABB Power Electronics Inc.
Inventor： Qixue Yu , Ting He , Juan Zhang , Kun Dou
IPC: H02M7/5395 , H02M1/08 , H02M1/12
CPC classification number: H02M7/5395 , H02M1/081 , H02M1/123 , H02M1/126
Abstract: Embodiments of the present disclosure provide a method for controlling a converter and a converter system. The method includes obtaining voltage signals indicating phase voltages of three phases at AC side of a converter, determining, based on the voltage signals, carrier signals of a three-phase switching branches of the converter, wherein carrier signals of two of three phases have the same phase with each other and have a different phase from a carrier signal of the rest phase of the three phases, and magnitude of a phase voltage of the rest phase is between the phase voltages of the two phases, and generating, based on the determined carrier signals and modulation wave signals of the three-phase switching branches, control signals of the three-phase switching branch.
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公开(公告)号：US11490517B2
公开(公告)日：2022-11-01
申请号：US16528510
申请日：2019-07-31
Applicant: ABB Power Electronics Inc.
Inventor： John Andrew Trelford , Richard John Yeager , Alok Kumar Lohia , Thang Danh Truong
IPC: H05K1/02 , H05K1/11 , H05K1/14 , H01L23/00 , H01L23/34 , H01L23/48 , H01L23/58 , H01L23/64 , H01L23/66 , H01L23/498 , H01Q1/22 , H01Q1/24 , H01Q9/04
Abstract: Interposer printed circuit boards for power modules and associated methods are disclosed. In at least one illustrative embodiment, a printed circuit board assembly may comprise a printed circuit board, an electrical component mounted on a surface of the printed circuit board, and an interposer printed circuit board mounted on the surface of the printed circuit board. The interposer printed circuit board may comprise a first signal path to transmit a first electrical signal and a second signal path to transmit a second electrical signal that is different from the first electrical signal. The interposer printed circuit board may be configured to provide a standoff to prevent the electrical component from contacting a motherboard when the printed circuit board assembly is mounted to the motherboard.
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公开(公告)号：US20220099389A1
公开(公告)日：2022-03-31
申请号：US17031963
申请日：2020-09-25
Applicant: ABB Power Electronics Inc.
Inventor： Pedro Angel Fernandez , Evan Cosentino
IPC: F28F13/06
Abstract: Systems and methods for thermal management using matrix coldplates are disclosed. One illustrative method may comprise directing a flow of coolant through a coldplate comprising a plurality of parallel passages by selectively connecting portions of the parallel passages to one another to create one or more regions of parallel flow, serial flow, or blocked flow in the coldplate. Selectively connecting portions of the parallel passages may comprise machining a plurality of transverse passages into the cold plate such that each of the transverse passages intersects at least some of the parallel passages. Valves may be installed to interact between the parallel and transverse passages to create and modify the different flow regions.
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公开(公告)号：US20210175795A1
公开(公告)日：2021-06-10
申请号：US16705209
申请日：2019-12-05
Applicant: ABB Power Electronics Inc.
Inventor： Sanbao Zheng
Abstract: Technologies for controlling AC-to-DC converters are disclosed. In one illustrative embodiment, a controller of an AC-to-DC converter measures two voltage levels of a split voltage bus of a power factor correction (PFC) circuit. The controller controls current drawn from the positive and negative terminals of the PFC circuit by a DC-to-DC converter. By controlling the current drawn from the two terminals, the controller can control the voltages on the terminals to be equal (but opposite).
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公开(公告)号：US20210050793A1
公开(公告)日：2021-02-18
申请号：US17087795
申请日：2020-11-03
Applicant: ABB Power Electronics Inc.
Inventor： Sandeep BALA , Liming LIU , Jing XU
Abstract: According to an aspect of this disclosure, a circuit includes a voltage source and an output load, first and second resonant modules disposed between the voltage source and the output load, and first and second transformers. The circuit is further arranged such that the first transformer is disposed between the first resonant module and the output load, and the second transformer is disposed between the second resonant module and the output load. The circuit also includes a plurality of half-bridges coupled between the first and second resonant modules and the voltage source. The circuit further includes a voltage divider disposed between the voltage source and the plurality of half-bridges.
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