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公开(公告)号：US12249960B2
公开(公告)日：2025-03-11
申请号：US18300069
申请日：2023-04-13
Applicant: Analog Devices, Inc.
Inventor： Song Lin , Xudong Wang , Jinzhou Cao , Christopher Eugene Hay
Abstract: The present subject matter relates to active balun circuits. An active balun circuit includes a plurality of transistors; an output transmission line connected to output terminals of the transistors; an input transmission line; and a plurality of serial capacitors coupled to an input terminal of the transistors and the input transmission line.
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公开(公告)号：US12249631B2
公开(公告)日：2025-03-11
申请号：US18206974
申请日：2023-06-07
Applicant: Analog Devices, Inc.
Inventor： Puneet Srivastava , James G. Fiorenza
IPC: H01L29/40 , H01L21/02 , H01L29/20 , H01L29/205 , H01L29/66 , H01L29/778
Abstract: A semiconductor device includes a layer of a first semiconducting material, where the first semiconducting material is epitaxially grown to have a crystal structure of a first substrate. The semiconductor device further includes a layer of a second semiconducting material disposed adjacent to the layer of the first semiconducting material to form a heterojunction with the layer of the first semiconducting material. The semiconductor device further includes a first component that is electrically coupled to the heterojunction, and a second substrate that is bonded to the layer of the first semiconducting material.
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公开(公告)号：US12241689B2
公开(公告)日：2025-03-04
申请号：US16777654
申请日：2020-01-30
Applicant: Analog Devices, Inc.
Inventor： Marc T. Dunham , Baoxing Chen
Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.
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公开(公告)号：US20250061911A1
公开(公告)日：2025-02-20
申请号：US18450784
申请日：2023-08-16
Applicant: Analog Devices, Inc.
Inventor： Johannes TRAA , Atulya YELLEPEDDI , Donald F. PORGES
IPC: G10L21/0224 , G10L21/0216
Abstract: Aspects of the present disclosure provided a method for voice control that includes transforming, using a short-time Fourier transform (STFT) applied to data in each window aligned across each input channel of the multichannel audio stream, the multichannel audio stream into a complex valued frequency-domain representation. For a current window, the method further includes: updating a first complex-valued covariance matrix corresponding to a slowly-adapting beamformer and forming a single-channel denoised estimate for each frequency band in the STFT; calculating a voice activity detection (VAD) estimate for each frequency band in the STFT by comparing a magnitude of the single-channel denoised estimate to a magnitude of each input channel of the multichannel audio stream; and selectively updating or refraining from updating, responsive to the VAD estimate respectively indicating a presence or an absence of speech, a second complex-valued covariance matrix corresponding to a quickly-adapting beamformer.
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公开(公告)号：US12230699B2
公开(公告)日：2025-02-18
申请号：US17067988
申请日：2020-10-12
Applicant: Analog Devices, Inc.
Inventor： Daniel Piedra , James G. Fiorenza , Puneet Srivastava
IPC: H01L29/778 , H01L29/10 , H01L29/16 , H01L29/20 , H01L29/66
Abstract: Integrated circuits can include semiconductor devices with back-side field plates. The semiconductor devices can be formed on substrates that have conductive layers located within the substrates. The conductive layers can include at least one of a conducting material or a semi-conducting material that modifies an electric field produced by the semiconductor devices. The semiconductor devices can include one or more semiconductor layers that include one or more materials having a compound material that includes at least one Group 13 element and at least one Group 15 element.
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Patent Agency Ranking
公开(公告)号：US12216164B2
公开(公告)日：2025-02-04
申请号：US17904935
申请日：2021-02-24
Applicant: Analog Devices, Inc.
IPC: G01R31/28 , G01R31/319 , H03F1/52 , H03F3/04 , H03F3/16
Abstract: A clamp circuit comprises an output transistor and a replica transistor coupled as a current minor pair, wherein the replica transistor is scaled in size to the output transistor by a size ratio; a first current source configured to set a current in the replica transistor, wherein the output current is set at a clamped output current value that is a sum of current of the first current source and a scaled value of the current of the first current source determined according to the size ratio; and a register circuit, wherein a register value stored in the register circuit sets the clamped output current value.
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公开(公告)号：US20250036842A1
公开(公告)日：2025-01-30
申请号：US18781029
申请日：2024-07-23
Applicant: Analog Devices, Inc.
Inventor： Christopher Mayer , Sudhir Desai , Arash Azizimazreah
IPC: G06F30/347 , G06F13/40 , H04L49/101
Abstract: Apparatus and methods for facilitating data movement among circuit blocks are disclosed. In certain embodiments, dataflow gaskets with circular buffers are deployed in any number or arrangement to achieve efficient on-chip data movement among different circuit blocks of the die. Each dataflow gasket can be attached to a corresponding circuit block using tightly coupled memories to provide low latency and fast access to incoming and outgoing data streams. Furthermore, memory allocation and buffer management can be handled by the internal logic in the dataflow gasket to reduce or eliminate software development efforts. For example, the dataflow gasket can use circular buffers to allow the circuit block to access the dataflow gasket's memories without needing to understand the internal memory addressing of the dataflow gasket.
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公开(公告)号：US12184298B2
公开(公告)日：2024-12-31
申请号：US18614206
申请日：2024-03-22
Applicant: Analog Devices, Inc.
Inventor： Jesper Steensgaard-Madsen
Abstract: Herein disclosed are multiple embodiments of a signal-processing circuit that may be utilized in various circuits, including conversion circuitry. The signal-processing circuit may receive an input and produce charges on multiple different capacitors during different phases of operation based on the input. The charges stored on two or more of the multiple different capacitors may be utilized for producing an output of the signal-processing circuit, such as by combing the charges stored on two or more of the multiple different capacitors. Utilizing the charges on the multiple different capacitors may provide for a high level of accuracy and robustness to variations of environmental factors, and/or a low noise level and power consumption when producing the output.
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公开(公告)号：US12120819B2
公开(公告)日：2024-10-15
申请号：US18143460
申请日：2023-05-04
Applicant: Analog Devices, Inc.
Inventor： Albert Rooyakkers , James G. Calvin , Craig Markovic , Ken Doucette , Brian Anderson
CPC classification number: H05K1/117 , H01R13/5841 , H04L63/062 , H04L63/0869 , H04L63/20
Abstract: A cable includes a wiring assembly with a knuckle and wires bundled together. The cable also includes a connector assembly with a connector having connections for the wires, where the connections are arranged along a longitudinal axis. In some embodiments, the connector assembly captures an end of the wiring assembly, and the knuckle of the wiring assembly is pivotally connected to the connector assembly. In some embodiments, the cable includes circuitry configured to authenticate the cable to a device connected to the cable by the connector and/or to authenticate the device connected to the cable. A control system includes control elements and/or subsystems coupled with a backplane adjacent to one another and cables configured to connect to the control elements and/or subsystems. Wiring assemblies of the cables can articulate to be parallel to each respective connector. Further, each cable can authenticate the cables and/or the control elements or subsystems.
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公开(公告)号：US12119853B2
公开(公告)日：2024-10-15
申请号：US17824899
申请日：2022-05-26
Applicant: Analog Devices, Inc.
Inventor： Xiao Yu Wang , Milutin Pajovic , Omer Tanovic , Tao Yu , Nevena Rakuljic , Gregory Patrick Davis
CPC classification number: H04B1/10 , H04L25/03878
Abstract: Non-idealities of input circuitry of a receiver signal chain can significantly degrade the overall performance of the receiver signal chain. A digital nonlinearity correction (NLC) can be implemented in a receiver signal chain having an ADC. Digital NLC can be designed as a drop in signal preconditioner for existing RF ADC wideband receiver signal chains. A unique equalizer can compensate for a variety of mixer spurs. Accordingly, digital NLC can correct nonlinearities due to mixers and any amplifiers preceding or following the ADC, potentially improving receive chains performance by 15-25 dB. Such a digital NLC solution can be particularly beneficial in defense and instrumentation applications which demand the greatest performance.
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