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公开(公告)号：US20100202097A1
公开(公告)日：2010-08-12
申请号：US12719547
申请日：2010-03-08
Applicant: Gerhard Bisplinghoff , Axel Pecina
Inventor： Gerhard Bisplinghoff , Axel Pecina
CPC classification number: H01G4/30 , H01C1/148 , H01C7/18 , H01G4/0085 , H01G4/232 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T156/10
Abstract: A method for producing a multilayer component is described. A stack of green foils, to which inner electrodes including palladium oxide are applied, is sintered. The sintered stack is provided with a silver paste on two or more sides for outer electrodes that are burned into the sintered stack in a further temperature step.
Abstract translation: 对多层成分的制造方法进行说明。 施加了包括氧化钯的内部电极的一叠绿色箔片被烧结。 烧结叠层在两个或多个侧面上设置有用于外部电极的银膏，其在另外的温度步骤中被烧结到烧结叠层中。
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12.发明授权Electronic component assembly comprising a varistor and a semiconductor component 有权包括变阻器和半导体部件的电子部件组件公开(公告)号：US09196402B2
公开(公告)日：2015-11-24
申请号：US12994143
申请日：2009-05-22
Applicant: Thomas Feichtinger , Guenter Engel , Axel Pecina
Inventor： Thomas Feichtinger , Guenter Engel , Axel Pecina
CPC classification number: H01C1/084 , H01C7/10 , H01C7/12 , H01L2224/48091 , H05K1/0203 , H05K1/181 , H05K2201/10022 , H05K2201/10106 , H05K2201/10515 , H05K2201/1053 , H05K2201/10674 , Y02P70/611 , H01L2924/00014
Abstract: An electric component assembly comprising a semiconductor component (1) and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier (3) by means of the varistor body.
Abstract translation: 规定了包括半导体部件（1）和载体的电气部件组件，其中所述载体包含高导热性陶瓷，并连接到可变压敏电阻体。 来自半导体部件的热可以通过可变电阻体至少部分地耗散到载体（3）。
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公开(公告)号：US08730645B2
公开(公告)日：2014-05-20
申请号：US12650206
申请日：2009-12-30
Applicant: Thomas Feichtinger , Axel Pecina
Inventor： Thomas Feichtinger , Axel Pecina
IPC: H01G4/30
Abstract: A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element.
Abstract translation: 提供了具有至少一个基体的多层电气部件，该基体包括彼此叠置的介电层和电极层的叠层，其中所述多层部件另外具有电阻器和解耦层，其中所述去耦层将所述电阻器 来自多层元件的至少一部分。
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公开(公告)号：US08214984B2
公开(公告)日：2012-07-10
申请号：US12719547
申请日：2010-03-08
Applicant: Gerhard Bisplinghoff , Axel Pecina
Inventor： Gerhard Bisplinghoff , Axel Pecina
IPC: H01G7/00
CPC classification number: H01G4/30 , H01C1/148 , H01C7/18 , H01G4/0085 , H01G4/232 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T156/10
Abstract: A method for producing a multilayer component is described. A stack of green foils, to which inner electrodes including palladium oxide are applied, is sintered. The sintered stack is provided with a silver paste on two or more sides for outer electrodes that are burned into the sintered stack in a further temperature step.
Abstract translation: 对多层成分的制造方法进行说明。 施加了包括氧化钯的内部电极的一叠绿色箔片被烧结。 烧结叠层在两个或多个侧面上设置有用于外部电极的银膏，其在另外的温度步骤中被烧结到烧结叠层中。
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15.发明授权公开(公告)号：US08134447B2
公开(公告)日：2012-03-13
申请号：US12732641
申请日：2010-03-26
Applicant: Axel Pecina , Zeljko Maric
Inventor： Axel Pecina , Zeljko Maric
IPC: H01C1/012
CPC classification number: H01G4/40 , H01C7/18 , H01C17/2416 , H01C17/242 , H01G4/30 , Y10T156/10
Abstract: An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. Electrode layers of identical electrical polarity are jointly contacted to an external contact arranged at a side face of the stack. A resistor sintered to the stack and containing ceramic resistance material is arranged on an end face of the stack.
Abstract translation: 电气多层组件具有一层介电层和彼此排列的电极层。 具有相同电极性的电极层与布置在叠层的侧面的外部触头共同接触。 烧结到堆叠并且包含陶瓷电阻材料的电阻器布置在堆叠的端面上。
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Patent Agency Ranking
16.发明授权Electric component comprising external electrodes and method for the production of an electric component comprising external electrodes 有权包括外部电极的电气部件和用于制造包括外部电极的电气部件的方法公开(公告)号：US08194388B2
公开(公告)日：2012-06-05
申请号：US11659439
申请日：2005-08-03
Applicant: Harald Köppel , Robert Krumphals , Axel Pecina
Inventor： Harald Köppel , Robert Krumphals , Axel Pecina
IPC: H01G4/06
CPC classification number: H01C17/06533 , H01C1/034 , H01C1/1413 , H01C7/041 , H01C17/281 , H01L2924/0002 , Y10T428/24802 , H01L2924/00
Abstract: An electrical component includes a ceramic base body that includes a surface that is partially ceramic, electrodes in the ceramic base body that have ends that form parts of the surface of the ceramic base body, and a bonding layer on the surface of the ceramic base body. The bonding layer has a composition such that, when the bonding layer is heated, the bonding layer is less adhesive to the ends of the electrodes than when not heated.
Abstract translation: 电气部件包括：陶瓷基体，其包括部分陶瓷的表面;陶瓷基体中的电极，其形成有形成陶瓷基体的表面的一部分的陶瓷基体;以及陶瓷基体的表面的接合层 。 接合层具有这样的组成，即当接合层被加热时，与没有加热的接合层相比，接合层对电极的端部粘合性较小。
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17.发明申请Electronic Component Assembly Comprising a Varistor and a Semiconductor Component 有权包括压敏电阻和半导体元件的电子元件组件公开(公告)号：US20110261536A1
公开(公告)日：2011-10-27
申请号：US12994143
申请日：2009-05-22
Applicant: Thomas Feichtinger , Guenter Engel , Axel Pecina
Inventor： Thomas Feichtinger , Guenter Engel , Axel Pecina
IPC: H05K7/20
CPC classification number: H01C1/084 , H01C7/10 , H01C7/12 , H01L2224/48091 , H05K1/0203 , H05K1/181 , H05K2201/10022 , H05K2201/10106 , H05K2201/10515 , H05K2201/1053 , H05K2201/10674 , Y02P70/611 , H01L2924/00014
Abstract: An electric component assembly comprising a semiconductor component (1) and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier (3) by means of the varistor body.
Abstract translation: 规定了包括半导体部件（1）和载体的电气部件组件，其中所述载体包含高导热性陶瓷，并连接到可变压敏电阻体。 来自半导体部件的热可以通过可变电阻体至少部分地耗散到载体（3）。
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公开(公告)号：US20110188161A1
公开(公告)日：2011-08-04
申请号：US12994146
申请日：2009-05-22
Applicant: Thomas Feichtinger , Guenter Engel , Axel Pecina
Inventor： Thomas Feichtinger , Guenter Engel , Axel Pecina
CPC classification number: H01C7/12 , H01C7/10 , H01C7/102 , H01C7/105 , H01L2224/48091 , H01L2224/48465 , H01L2224/4848 , H01L2924/00014 , H01L2924/00
Abstract: An electric component arrangement is described, comprising a semiconductor component (1) mounted on a varistor body (2). The varistor body is contact-connected to the semiconductor component for the protection thereof against electrostatic discharges and contains a composite material having as matrix a varistor ceramic and as filler a highly thermally conductive material being different from the varistor ceramic.
Abstract translation: 描述了一种电气部件布置，包括安装在变阻器主体（2）上的半导体部件（1）。 变阻器主体与半导体元件接触，用于保护其免受静电放电，并且包含具有变阻器陶瓷作为矩阵的复合材料和作为不可变电阻陶瓷的高导热材料的填料。
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19.发明申请公开(公告)号：US20100245031A1
公开(公告)日：2010-09-30
申请号：US12732641
申请日：2010-03-26
Applicant: Axel Pecina , Zeljko Maric
Inventor： Axel Pecina , Zeljko Maric
CPC classification number: H01G4/40 , H01C7/18 , H01C17/2416 , H01C17/242 , H01G4/30 , Y10T156/10
Abstract: An electrical multilayer component has a stack of dielectric layers and electrode layers arranged one above another. Electrode layers of identical electrical polarity are jointly contacted to an external contact arranged at a side face of the stack. A resistor sintered to the stack and containing ceramic resistance material is arranged on an end face of the stack.
Abstract translation: 电气多层组件具有一层介电层和彼此排列的电极层。 具有相同电极性的电极层与布置在叠层的侧面的外部触头共同接触。 烧结到堆叠并且包含陶瓷电阻材料的电阻器布置在堆叠的端面上。
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公开(公告)号：US20100157505A1
公开(公告)日：2010-06-24
申请号：US12650206
申请日：2009-12-30
Applicant: Thomas Feichtinger , Axel Pecina
Inventor： Thomas Feichtinger , Axel Pecina
Abstract: A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element.
Abstract translation: 提供了具有至少一个基体的多层电气部件，该基体包括彼此叠置的介电层和电极层的叠层，其中所述多层部件另外具有电阻器和解耦层，其中所述去耦层将所述电阻器 来自多层元件的至少一部分。
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