摘要:
The present invention relates to apparatuses for continuous and efficient heat-treatment of semiconductor films upon thermally susceptible non-conducting substrates at a minimum thermal budget, and more particularly, to a polycrystalline silicon thin-film transistors (poly-Si TFTs) and PN diodes on glass substrates for various applications of liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), and solar cells. According to the apparatuses of the present invention, the semiconductor films can be heat-treated without damaging the thermally susceptible substrates: e.g., crystallization of amorphous silicon films at the minimum thermal budget acceptable for the use of glass, enhancing kinetics of dopant activation at the minimum thermal budget acceptable for the use of glass.
摘要:
Described is a lateral field emission device emitting electrons in parallel with respect to a substrate. Electron emission materials having a predetermined thickness are arranged in a direction with respect to the substrate on a supporting portion. An anode is disposed on a side portion of the substrate, the anode corresponding to the electron emission materials.
摘要:
An electromagnetic bandgap (EBG) pattern structure includes a nonconductive substrate and a pattern assembly formed on the substrate. The EBG pattern structure also includes regularly arranged closed-loop patterns and open-loop patterns, both of which are made of a conductive material. The EBG pattern structure can be used to manufacture new security products by applying its frequency characteristics to securities or IDs and variously used in security technologies for preventing forgery and alteration because various security codes can be created by adjusting the variables of its EBG pattern.
摘要:
Various embodiments of the present invention generally relate to a light-cure and dual-cure resin that have low color and is color stable over conventional light, self and dual-cured resins. Additionally, the light-cure resin has enhanced degree of cure over conventional light-cure resins. Finally, due to the low color and enhanced color stability of the dual-cure resins, their inherent property of having lower shrinkage stress as compared to light-cure resins can now be utilized in various dental applications and other resin applications.
摘要:
Disclosed herein is an electromagnetic bandgap (EBG) pattern structure, including: a nonconductive substrate; and a pattern assembly formed on the substrate and including regularly arranged closed-loop patterns and open-loop patterns both of which are made of a conductive material. The EBG pattern structure is advantageous in that it can be used to manufacture new security products by applying its frequency characteristics to securities or IDs and in that it can be variously used in security technologies for preventing forgery and alteration because various security codes can be created by adjusting the variables of its EBG pattern.
摘要:
A dishwasher having a UV generator that sterilizes dishes is provided. The dishwasher includes a tub that holds dishes to be washed, a sump that holds washing water, a spray nozzle that sprays the washing water into the dishwasher, and at least one UV generator that directs a UV beam into the dishwasher.
摘要:
Disclosed is a heat treatment system for semiconductor devices. The heat treatment system is used in a heat treatment process for semiconductor devices, such as a crystallization process for an amorphous silicon thin film or a dopant activation process for a poly-crystalline silicon thin film formed on a surface of a glass substrate of a flat display panel including a liquid crystal display (LCD) or an organic light emitting device (OLED). The heat treatment system transfers a semiconductor device after uniformly preheating the semiconductor device in order to prevent deformation of the semiconductor device during the heat treatment process, rapidly performs the heat treatment process under the high temperature condition by heating the semiconductor device using a lamp heater and induction heat derived from induced electromotive force, and unloads the semiconductor device after uniformly cooling the semiconductor device such that the semiconductor device is prevented from being deformed when the heat treatment process has been finished. The heat treatment system rapidly performs the heat treatment process while preventing deformation of the semiconductor device by gradually heating or cooling the semiconductor device.
摘要:
A method for manufacturing a thin film transistor with improved current characteristics and high electron mobility. According to the method, when an amorphous silicon thin film is crystallized into a polycrystalline silicon thin film by metal-induced crystallization, annealing conditions of the amorphous silicon thin film and the amount of a metal catalyst doped into the amorphous silicon thin film are optimized to reduce the regions of a metal silicide distributed at grain boundaries of the polycrystalline silicon thin film. In addition, oxygen (O2) gas or water (H2O) vapor is supplied to form a passivation film on the surface of the polycrystalline silicon thin film.
摘要:
An active damping system has an electrically controlled actuator including: a steering wheel angle sensor; a yaw rate sensor; a lateral acceleration sensor; a vertical acceleration sensor; a roll angle sensor; a control mode determining unit configured to receive the signals detected by the sensors, thereby determining a control mode; a control signal generating unit configured to generate a control signal depending upon the control mode determined by the control mode determining unit; an electric motor which is operated according to the control signal of the control signal generating unit; and a ball screw which is rotated in cooperation with a rotation shaft of the electric motor at one side, and is meshed with an axle of the vehicle at the other side to vary a distance between the vehicle body and the axle according to the rotation of the electric motor.
摘要:
Various embodiments of the present invention generally relate to a light-cure and dual-cure resin that have low color and is color stable over conventional light, self and dual-cured resins. Additionally, the light-cure resin has enhanced degree of cure over conventional light-cure resins. Finally, due to the low color and enhanced color stability of the dual-cure resins, their inherent property of having lower shrinkage stress as compared to light-cure resins can now be utilized in various dental applications and other resin applications.