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公开(公告)号：US12217926B2
公开(公告)日：2025-02-04
申请号：US18433175
申请日：2024-02-05
Applicant: ELVE INC.
Inventor： Diana Gamzina Daugherty
Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
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公开(公告)号：US20240372516A1
公开(公告)日：2024-11-07
申请号：US18657220
申请日：2024-05-07
Applicant: Elve Inc.
Inventor： Danny Chan , Diana Gamzina Daugherty , Richard Kowalczyk , Daniel Springmann
IPC: H03F3/24
Abstract: A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.
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公开(公告)号：US20240372238A1
公开(公告)日：2024-11-07
申请号：US18628417
申请日：2024-04-05
Applicant: Elve Inc.
Inventor： Blake Griffin , Richard Kowalczyk
Abstract: A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.
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公开(公告)号：US20240096583A1
公开(公告)日：2024-03-21
申请号：US18368940
申请日：2023-09-15
Applicant: Elve Inc.
Inventor： Colin Andrew McElroy , Michelle Gonzalez , Diana Gamzina Daugherty , Mikhail Kuffel , Danny Chan
Abstract: A cathode heater assembly for use in a vacuum electronic device comprises a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.
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公开(公告)号：US11894208B2
公开(公告)日：2024-02-06
申请号：US17525658
申请日：2021-11-12
Applicant: ELVE INC.
Inventor： Diana Gamzina Daugherty
CPC classification number: H01J23/083 , H01J9/18 , H01J23/06 , H01J23/165 , H01J29/62 , H01J29/70 , H01J25/34 , H01J2229/581 , H01J2229/582
Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
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Patent Agency Ranking
公开(公告)号：US20220157549A1
公开(公告)日：2022-05-19
申请号：US17525658
申请日：2021-11-12
Applicant: ELVE INC.
Inventor： Diana Gamzina Daugherty
IPC: H01J23/083 , H01J23/06
Abstract: Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
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公开(公告)号：US20240371594A1
公开(公告)日：2024-11-07
申请号：US18657184
申请日：2024-05-07
Applicant: Elve Inc.
Inventor： Danny Chan , Michelle Gonzalez , Diana Gamzina Daugherty
IPC: H01J23/033 , H01J23/027 , H05K7/20
Abstract: A depressed collector, comprises an insulator body; a plurality of serial electrodes, each serial electrode having a serial electrode receptor portion inside the insulator body and having a serial electrode thermal fin portion passing through and extending outside the insulator body; and a terminal electrode having a terminal electrode receptor portion inside the insulator body and having a terminal electrode thermal fin portion passing through and extending outside the insulator body.
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公开(公告)号：US20240371593A1
公开(公告)日：2024-11-07
申请号：US18634127
申请日：2024-04-12
Applicant: Elve Inc.
Inventor： Mikhail Kuffel , Blake Griffin , Danny Chan , Michelle Gonzalez , Diana Gamzina Daugherty , Richard Kowalczyk
Abstract: A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.
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公开(公告)号：US12119201B2
公开(公告)日：2024-10-15
申请号：US18368940
申请日：2023-09-15
Applicant: Elve Inc.
Inventor： Colin Andrew McElroy , Michelle Gonzalez , Diana Gamzina Daugherty , Mikhail Kuffel , Danny Chan
Abstract: A cathode heater assembly for use in a vacuum electronic device includes a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.
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20.发明授权公开(公告)号：US11961693B2
公开(公告)日：2024-04-16
申请号：US17525698
申请日：2021-11-12
Applicant: ELVE INC.
Inventor： Diana Gamzina Daugherty
CPC classification number: H01J23/083 , H01J9/18 , H01J23/06 , H01J23/165 , H01J29/62 , H01J29/70 , H01J25/34 , H01J2229/581 , H01J2229/582
Abstract: Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.
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