公开(公告)号：US20120160553A1

公开(公告)日：2012-06-28

申请号：US13393392

申请日：2010-09-01

Applicant: Hitoshi Shimadu ,  Takehiko Sawada ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hitoshi Shimadu ,  Takehiko Sawada ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/165 ,  H01F27/2847 ,  H01F27/306 ,  H05K3/202 ,  H05K2201/09672 ,  H05K2201/10409 ,  H05K2203/175 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: [Object]To provide a method for producing a circuit board structurally characterized in that circuit patterns can be secured to an insulating member having a plate shape with relative positions thereof unchanged, and a circuit board where relative positions of a plurality of circuit patterns remain unchanged.[Solving means]A first coil 30 having the winding number of 1 is formed in a planar shape from a metal plate. Then, a second coil 40 having the winding number of 4 is formed in a planar shape from a metal plate in a manner that end portions 41 and 42 of the second coil 40 on both sides thereof are coupled with other portions adjacent thereto by coupling sections 43 and 44. A pair of the first coil 30 and the second coil 40 is mounted so as to face each other with a resin plate 50, where a plurality of prepregs are stacked in layers, interposed therebetween, and the coupling by the coupling section 43 and the coupling by the coupling section 44 are thereafter released.

Abstract translation: 本发明提供一种电路板的制造方法，其结构特征在于，可以将电路图形固定在具有相对位置不变的板状的绝缘构件上，以及电路板，其中多个电路图案的相对位置保持不变 。 [解决方案]卷绕数为1的第一线圈30从金属板形成为平面形状。 然后，绕组数为4的第二线圈40以金属板的平面形状形成，其两侧的第二线圈40的端部41和42与与其相邻的其它部分与耦合部分 一对第一线圈30和第二线圈40被安装成彼此面对的树脂板50，其中多个预浸料层叠在其间，并且由耦合部分耦合 然后释放由耦合部分44耦合的耦合。