公开(公告)号：US20080224721A1

公开(公告)日：2008-09-18

申请号：US12127665

申请日：2008-05-27

Applicant: Young-Seok KIM ,  Hwan-Chul LEE ,  Jae-Cheol JU

Inventor： Young-Seok KIM ,  Hwan-Chul LEE ,  Jae-Cheol JU

IPC: G01R31/26

CPC classification number: H01L27/14618 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.

Abstract translation: 本发明涉及一种用于测试图像传感器封装的装置，单元和方法，其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括：座位单元，图像传感器封装件用于测试; 测试部分，具有在图像传感器封装之上的透镜和光源，以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元，其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤：将图像传感器封装连接到测试器模块，用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。

公开(公告)号：US20070131881A1

公开(公告)日：2007-06-14

申请号：US11457771

申请日：2006-07-14

Applicant: Young-Seok KIM ,  Hwan-Chul LEE ,  Jae-Cheol JU

Inventor： Young-Seok KIM ,  Hwan-Chul LEE ,  Jae-Cheol JU

IPC: G01N21/88

CPC classification number: H01L27/14618 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.

Abstract translation: 本发明涉及一种用于测试图像传感器封装的装置，单元和方法，其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括：座位单元，图像传感器封装件用于测试; 测试部分，具有在图像传感器封装之上的透镜和光源，以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元，其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤：将图像传感器封装连接到测试器模块，用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。