公开(公告)号：US20100237498A1

公开(公告)日：2010-09-23

申请号：US12599298

申请日：2008-10-28

Applicant: Deok Hoon Kim ,  Young Sang Cho ,  Hwan Chul Lee

Inventor： Deok Hoon Kim ,  Young Sang Cho ,  Hwan Chul Lee

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L24/29 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1532 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2224/05599

Abstract: A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate.

Abstract translation: 半导体器件封装及其方法能够将半导体器件可靠地封装在基板上而不使用焊剂。 半导体器件封装包括半导体器件和相对于半导体器件相互配置的衬底，其中衬底包括与半导体器件往复的一侧，在该半导体器件上形成有围绕半导体器件的容纳区域的多个突起 被处置 封装半导体器件的方法包括制备半导体器件，制备衬底，形成多个突出部以围绕要放置半导体器件的衬底上的容纳区域，将半导体器件放置在容纳区域内，以及封装 衬底上的半导体器件。

公开(公告)号：US07484103B2

公开(公告)日：2009-01-27

申请号：US10501254

申请日：2003-01-10

Applicant: Je-Hak Woo ,  Hwan-Chul Lee ,  Sang-Young Cho ,  Seong-Ho Jeong ,  Young-Soo Ha ,  Seog-Kyoon Shin ,  Seong-Il Kim

Inventor： Je-Hak Woo ,  Hwan-Chul Lee ,  Sang-Young Cho ,  Seong-Ho Jeong ,  Young-Soo Ha ,  Seog-Kyoon Shin ,  Seong-Il Kim

IPC: G06F11/30

CPC classification number: G06F21/10

Abstract: The present invention relates to the information protection of digital content transferred by streaming and download service through wire or wireless Internet network. The information protection system in this invention suggests a drastic prevention method of copyrights infringement such as illegal copy and unauthorized distribution of digital content, by using of the encryption, decryption, distribution, and authentication technologies. This invention suggests the control technology of general viewer program, not the specific viewer program for information protection, using a network filter driver for streaming and file system filter driver for download service. The main function of network and file system filter driver is the filtering operation such as a hooking, changing, decrypting, and restoring of message and data packet, and transferring to the viewer program. The main idea and technology of this invention suggest higher secure and efficient digital information protection system for live/VOD/HTTP streaming and download service.

Abstract translation: 本发明涉及通过有线或无线因特网网络流式传输和下载服务传输的数字内容的信息保护。 本发明的信息保护系统通过使用加密，解密，分发和认证技术，提出了非法复制和非法分发数字内容等版权侵权的大力预防方法。 本发明提出了一般观看者节目的控制技术，而不是用于信息保护的特定观看者节目，使用用于流媒体的网络过滤器驱动程序和用于下载服务的文件系统过滤驱动器。 网络和文件系统过滤驱动的主要功能是消息和数据包的挂接，更改，解密和恢复等过滤操作，并传送给观众节目。 本发明的主要思想和技术提出了用于实时/ VOD / HTTP流和下载服务的更安全高效的数字信息保护系统。

公开(公告)号：US20080157251A1

公开(公告)日：2008-07-03

申请号：US11948716

申请日：2007-11-30

Applicant: Hwan-Chul Lee

Inventor： Hwan-Chul Lee

IPC: H01L23/48 ,  H01L21/02 ,  H01L31/00

CPC classification number: H01L27/14618 ,  H01L23/10 ,  H01L23/49816 ,  H01L27/14634 ,  H01L27/14685 ,  H01L31/0203 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16195 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Provided are an image sensor package used as a semiconductor device package and a method of packaging the image sensor package. The package and method prevent defects in sealing rings and connections for electrical connection during manufacturing process, by designating the melting point of solder balls used for the image sensor package different from the melting point of solder used in other bonding applications.The semiconductor device package includes a semiconductor device, a substrate assembly, a solder sealing ring, and a plurality of solder balls. The substrate assembly is disposed facing the semiconductor device. The solder sealing ring tightly seals the semiconductor device and the substrate assembly. The solder balls are formed in an outer periphery of the solder sealing ring of the substrate assembly. The solder sealing ring has a higher melting point than the solder balls.

Abstract translation: 提供了用作半导体器件封装的图像传感器封装以及封装图像传感器封装的方法。 包装和方法通过指定用于图像传感器封装的焊球的熔点不同于在其它接合应用中使用的焊料的熔点，从而防止在制造过程中用于电连接的密封环和连接中的缺陷。 半导体器件封装包括半导体器件，衬底组件，焊料密封环和多个焊球。 衬底组件面向半导体器件设置。 焊接密封环紧密地密封半导体器件和衬底组件。 焊球形成在基板组件的焊料密封环的外周。 焊接密封环的熔点高于焊球。

公开(公告)号：US07384818B2

公开(公告)日：2008-06-10

申请号：US11585152

申请日：2006-10-24

Applicant: Deok-Hoon Kim ,  Hwan-Chul Lee

Inventor： Deok-Hoon Kim ,  Hwan-Chul Lee

IPC: H01L21/50

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2224/29011 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.

Abstract translation: 提供一种半导体器件封装及其制造方法。 半导体器件封装通常包括耦合到半导体管芯的至少一个半导体管芯和衬底。 半导体管芯具有限定密封区域的前侧和形成在该前侧的第一焊料密封环垫。 基板设置有与形成有第二焊料密封环垫的半导体管芯的前侧相对的前表面。 焊料密封环结构被夹在基板和半导体管芯的第一和第二焊料密封垫之间，使得其在密封区域的大部分周围周边延伸，以在半导体管芯和衬底之间基本上封闭空腔。 焊料密封环结构包括至少一个排气部分，其限定衬底和半导体管芯中的至少一个，与空腔开放连通的通风口。

公开(公告)号：US07141869B2

公开(公告)日：2006-11-28

申请号：US11052864

申请日：2005-02-09

Applicant: Deok-Hoon Kim ,  Hwan-Chul Lee

Inventor： Deok-Hoon Kim ,  Hwan-Chul Lee

IPC: H01L23/495

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2224/29011 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.

公开(公告)号：US07427768B2

公开(公告)日：2008-09-23

申请号：US11457771

申请日：2006-07-14

Applicant: Young-Seok Kim ,  Hwan-Chul Lee ,  Jae-Cheol Ju

Inventor： Young-Seok Kim ,  Hwan-Chul Lee ,  Jae-Cheol Ju

IPC: G01N21/86 ,  G01N21/88 ,  G01V8/00 ,  G01R31/02 ,  G01R31/26 ,  G01R31/28

CPC classification number: H01L27/14618 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.

Abstract translation: 本发明涉及一种用于测试图像传感器封装的装置，单元和方法，其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括：座位单元，图像传感器封装件用于测试; 测试部分，具有在图像传感器封装之上的透镜和光源，以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元，其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤：将图像传感器封装连接到测试器模块，用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。

公开(公告)号：US20070042530A1

公开(公告)日：2007-02-22

申请号：US11585152

申请日：2006-10-24

Applicant: Deok-Hoon Kim ,  Hwan-Chul Lee

Inventor： Deok-Hoon Kim ,  Hwan-Chul Lee

IPC: H01L21/00

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2224/29011 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device package and method for its fabrication are provided. The semiconductor device package generally includes at least one semiconductor die and a substrate coupled to the semiconductor die. The semiconductor die is provided with a front side defining a sealing area, and a first solder sealing ring pad formed on that front side. The substrate is provided with a front surface opposing the front side of the semiconductor die on which a second solder sealing ring pad is formed. A solder sealing ring structure is sandwiched between the first and second solder sealing pads of the substrate and semiconductor die, such that it extends peripherally about a substantial portion of the sealing area to substantially enclose thereat a cavity between the semiconductor die and the substrate. The solder sealing ring structure includes at least one venting portion defining against at least one of the substrate and semiconductor die an air vent in open communication with the cavity.

Abstract translation: 提供一种半导体器件封装及其制造方法。 半导体器件封装通常包括耦合到半导体管芯的至少一个半导体管芯和衬底。 半导体管芯具有限定密封区域的前侧和形成在该前侧的第一焊料密封环垫。 基板设置有与形成有第二焊料密封环垫的半导体管芯的前侧相对的前表面。 焊料密封环结构被夹在基板和半导体管芯的第一和第二焊料密封垫之间，使得其在密封区域的大部分周围周边延伸，以在半导体管芯和衬底之间基本上封闭空腔。 焊料密封环结构包括至少一个排气部分，其限定衬底和半导体管芯中的至少一个，与空腔开放连通的通风口。

公开(公告)号：US07128066B2

公开(公告)日：2006-10-31

申请号：US11118165

申请日：2005-04-28

Applicant: Hwan Chul Lee ,  Seo Pong Pyun ,  Sang Do Lee ,  Byung Lyul Jin ,  Sang Jin Lee ,  Tae Ung Um ,  Yong Seob Shim ,  Shin Kyung Kim

Inventor： Hwan Chul Lee ,  Seo Pong Pyun ,  Sang Do Lee ,  Byung Lyul Jin ,  Sang Jin Lee ,  Tae Ung Um ,  Yong Seob Shim ,  Shin Kyung Kim

IPC: B28D1/12

CPC classification number: B23D61/04 ,  B28D1/121 ,  Y10T407/26

Abstract: Disclosed is a diamond tool having a metal plate inserted therein. Between abrasive layers containing diamond particles is inserted a ferrous or non-ferrous metal plate having a wear resistance lower than that of the abrasive layers such that a concave groove is spontaneously formed during a cutting process, thereby reducing the contact load with a workpiece to thereby avoid vibration (wobbling) of a shank, and providing a discharge path for smoothly removing cutting chips and the cooling water. In addition, the content of abrasives and the wear resistance of bonding material are uniformly constituted so that the shrinkage rate does not need to be considered during sintering and the manufacturing process can be simplified, thereby reducing the manufacturing cost and improving the productivity therefor. Furthermore, the area of the metal plate can be controlled, thereby enabling an easy design conforming to the working conditions with a workpiece.

Abstract translation: 公开了一种金刚石工具，其中插入有金属板。 在含有金刚石颗粒的研磨层之间插入耐磨性低于研磨层的耐磨性的铁或非铁金属板，使得在切割过程中自发形成凹槽，从而减少与工件的接触载荷 避免柄的振动（摆动），并且提供用于平滑地去除切屑和冷却水的排出路径。 此外，研磨剂的含量和接合材料的耐磨性均匀地构成，使得在烧结期间不需要考虑收缩率，并且可以简化制造过程，从而降低制造成本并提高其生产率。 此外，可以控制金属板的面积，从而能够使与工件的工作条件相一致的简单设计。

公开(公告)号：US07720374B2

公开(公告)日：2010-05-18

申请号：US11457766

申请日：2006-07-14

Applicant: Young-Seok Kim ,  Hyeok-Hwan Kwon ,  Hyun-Kyu Choi ,  Hwan-Chul Lee

Inventor： Young-Seok Kim ,  Hyeok-Hwan Kwon ,  Hyun-Kyu Choi ,  Hwan-Chul Lee

IPC: G03B7/26

CPC classification number: H01L27/14636 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14634 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package. At this time, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate. Alternatively, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the horizontal portion is formed to be flat such that it is attached to a peripheral portion of a top surface of the translucent substrate. Otherwise, the holder comprises a horizontal portion formed with a through-hole, and a bottom surface of the horizontal portion is attached to at least a peripheral portion of a top surface of the translucent substrate.

Abstract translation: 本发明涉及一种照相机模块，其包括封装的图像传感器，IR滤光器，透镜和用于保持这些部件的保持器，并且具有减小的总体尺寸和高度。 根据本发明的相机模块包括其上形成有透光性基板的图像传感器封装; 以及具有附接到图像传感器封装的透光性基板的下端的保持器。 此时，保持器包括形成有通孔的水平部分和从水平部分的边缘向下延伸的连接部分，并且连接部分的下端的端表面形成有内部台阶部分 以便附着到透光性基板的上表面和侧面的周边部。 或者，保持器包括形成有通孔的水平部分和从水平部分的边缘向下延伸的连接部分，并且水平部分的下端的端表面形成为平坦的，使得其被附接 到透光性基板的顶面的周边部。 否则，保持器包括形成有通孔的水平部分，并且水平部分的底表面附接到透光性基板的顶表面的至少周边部分。

公开(公告)号：US20080224721A1

公开(公告)日：2008-09-18

申请号：US12127665

申请日：2008-05-27

Applicant: Young-Seok KIM ,  Hwan-Chul LEE ,  Jae-Cheol JU

Inventor： Young-Seok KIM ,  Hwan-Chul LEE ,  Jae-Cheol JU

IPC: G01R31/26

CPC classification number: H01L27/14618 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: The present invention relates to an apparatus, unit and method for testing image sensor packages, which can automatically test whether the image sensor packages are defective before they are assembled into camera modules. An apparatus for testing image sensor packages according to the present invention comprises a seating unit on which image sensor packages are seated for tests; a testing section having a lens and a light source above the image sensor packages to perform an open and short test and an image test for the image sensor packages; and a controlling and processing unit having a tester module for performing the open and short test and the image test for the image sensor packages. A method for testing image sensor packages according to the present invention comprises the steps of connecting the image sensor packages to a tester module for performing tests for checking whether the image sensor packages are defective; and carrying out an open and short test and an image test for the image sensor packages while irradiating light on the image sensor packages through a lens or blocking the light.

Abstract translation: 本发明涉及一种用于测试图像传感器封装的装置，单元和方法，其可以在组装成相机模块之前自动测试图像传感器封装是否有缺陷。 根据本发明的用于测试图像传感器封装的装置包括：座位单元，图像传感器封装件用于测试; 测试部分，具有在图像传感器封装之上的透镜和光源，以执行图像传感器封装的开放和短时测试和图像测试; 以及控制和处理单元，其具有用于执行图像传感器封装的开放和短期测试和图像测试的测试器模块。 根据本发明的用于测试图像传感器封装的方法包括以下步骤：将图像传感器封装连接到测试器模块，用于执行检查图像传感器封装是否有缺陷的测试; 并且通过透镜对图像传感器封装进行照射光或遮光时对图像传感器封装进行开放和短暂的测试和图像测试。