Abstract:
A graphene device may include a channel layer including graphene, a first electrode and second electrode on a first region and second region of the channel layer, respectively, and a capping layer covering the channel layer and the first and second electrodes. A region of the channel layer between the first and second electrodes is exposed by an opening in the capping layer. A gate insulating layer may be on the capping layer to cover the region of the channel layer, and a gate may be on the gate insulating layer.
Abstract:
A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.
Abstract:
In a fabrication method of a SAW device, a first conductive layer, an etch-stop layer made of conductive material and a second conductive layer are formed one atop another in order on a piezoelectric ceramic substrate. A mask is provided on a first portion of the second conductive layer corresponding to a first SAW filter. A second portion of the second conductive layer corresponding to a second SAW filter is selectively removed using the mask. The mask is removed and a photoresist pattern used for forming electrodes of the SAW filters is provided on the first portion of the second conductive layer corresponding to the first SAW filter region and on a first portion of the etch-stop layer corresponding to the second SAW filter region. The first and second conductive layers and the etch-stop layer are selectively removed using the photoresist pattern, and the photoresist pattern is then removed.
Abstract:
A varifocal lens structure and a method of manufacturing the same, the varifocal lens structure including: a frame having a fluid chamber filled with an optical fluid and formed of polymethylsiloxane (PDMS) containing a predetermined fluid; a transparent cover disposed on a top surface of the frame so as to cover the fluid chamber; a transparent elastic membrane disposed on a bottom surface of the frame so as to form a lower wall of the fluid chamber; and an actuator disposed on the elastic membrane.
Abstract:
A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.
Abstract:
A pattern projecting apparatus usable with a three-dimensional imaging apparatus includes a light generator which emits a light beam, and a pattern adjusting unit disposed in front of the light generator. The pattern adjusting unit forms a projection pattern on an object, and adjusts a focus of the light beam emitted from the light generator.
Abstract:
A varifocal optical device is provided. The varifocal optical device includes an optical lens, an actuator unit connected with the optical lens and having two areas that are bending-deformed in opposite directions to each other when a voltage is applied thereto, and a supporting unit to support the actuator unit, so that a focus of the optical lens is varied by the bending deformation when the voltage is applied to the actuator unit. Thereby, a driving displacement of the varifocal optical lens can be maximized.
Abstract:
A liquid optical lens which changes a focus due to a change in a shape of a translucent elastic membrane according to a change in a fluid pressure of a lens chamber and a manufacturing method thereof are provided. The liquid optical lens forms a dampproof coating membrane on the translucent elastic membrane to prevent a fluid from permeating through the translucent elastic membrane and a swelling phenomenon of the translucent elastic membrane.
Abstract:
An optical apparatus such as a varifocal fluidic lens is provided. Optical apparatus includes a spacer frame, optical fluid, an elastic membrane, an actuator, an actuator frame, and a thermally deformable frame. Spacer frame defines an internal space including a lens portion and a driving portion that connect to each other, and the driving portion is disposed to surround the lens portion disposed in the center area of the internal space. Optical fluid is filled in the internal space defined by the spacer frame. The elastic membrane is attached on a surface of the spacer frame, to cover a side of the internal space, and the thermally deformable plate is attached on the other surface of the spacer frame, to cover the other side of the internal space. The thermally deformable plate deforms to increase or decrease a volume of the internal space according to a change in temperature.
Abstract:
A method for forming a selective ohmic contact for a Group III-nitride heterojunction structured device may include forming a conductive layer and a capping layer on an epitaxial substrate including at least one Group III-nitride heterojunction layer and having a defined ohmic contact region, the capping layer being formed on the conductive layer or between the conductive layer and the Group III-nitride heterojunction layer in one of the ohmic contact region and non-ohmic contact region, and applying at least one of a laser annealing process and an induction annealing process on the substrate at a temperature of less than or equal to about 750° C. to complete the selective ohmic contact in the ohmic contact region.