公开(公告)号：US20100181293A1

公开(公告)日：2010-07-22

申请号：US12591821

申请日：2009-12-02

Applicant: Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

Inventor： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC: B23K1/00

CPC classification number: B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract translation: 提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。 回流装置可以包括线圈，支撑构件和移动构件。 线圈可以从电源接收电流，以使用感应加热方法加热焊球。 支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。 移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

公开(公告)号：US20100117213A1

公开(公告)日：2010-05-13

申请号：US12615507

申请日：2009-11-10

Applicant: Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG ,  Hyun Jeong WOO

Inventor： Minill KIM ,  Kwang Yong LEE ,  Jonggi LEE ,  Ji-Seok HONG ,  Hyun Jeong WOO

IPC: H01L23/488 ,  H05B6/36

CPC classification number: H05B6/36 ,  B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/81222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101

Abstract: An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

Abstract translation: 封装半导体芯片的装置包括配置为使用感应加热来回流半导体芯片的焊球的线圈。 线圈包括第一主体，平行于第一主体的第二主体，从第一主体延伸到第二主体的第三主体。 第一和第二主体相对于设置在它们之间的垂直平面是对称的。 第一和第二主体具有彼此面对的倾斜表面，并且倾斜表面彼此向下延伸。