公开(公告)号：US20150294948A1

公开(公告)日：2015-10-15

申请号：US14248373

申请日：2014-04-09

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Stephen P. Ayotte ,  Sebastien S. Quesnel ,  Glen E. Richard ,  Timothy D. Sullivan ,  Timothy M. Sullivan

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/02126 ,  H01L2224/0345 ,  H01L2224/05017 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/0516 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05686 ,  H01L2224/10156 ,  H01L2224/10175 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81222 ,  H01L2224/81815 ,  H01L2924/01022 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/00014

摘要： A method of applying inductive heating to join an integrated circuit chip to an electrical substrate using solder bumps including applying a magnetic field to a magnetic liner in thermal contact with a solder bump on the integrated circuit chip, the magnetic field causes Joule heating in the magnetic liner sufficient to melt the solder bump, the solder bump comprising a lower portion embedded in a first dielectric layer and an upper portion at least partially embedded in a second dielectric layer, the lower

摘要翻译： 一种使用焊料凸块来施加感应加热以将集成电路芯片连接到电气基板的方法，包括将磁场施加到与集成电路芯片上的焊料凸块热接触的磁性衬垫上，磁场引起磁场中的焦耳加热 衬垫足以熔化焊料凸块，焊料凸块包括嵌入第一电介质层中的下部和至少部分地嵌入第二电介质层中的上部，下部

公开(公告)号：US20130320529A1

公开(公告)日：2013-12-05

申请号：US13482414

申请日：2012-05-29

申请人： Gregory M. Fritz ,  Eric P. Lewandowski

发明人： Gregory M. Fritz ,  Eric P. Lewandowski

IPC分类号： H01L23/498 ,  H01L21/30

CPC分类号： H01L24/17 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13179 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16501 ,  H01L2224/1713 ,  H01L2224/17163 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81466 ,  H01L2224/818 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0541 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2224/81121 ,  H01L2924/00012 ,  H01L2224/757 ,  H01L2924/014 ,  H01L2224/05552

摘要： An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.

公开(公告)号：US20110278284A1

公开(公告)日：2011-11-17

申请号：US13190447

申请日：2011-07-25

申请人： Yonglai Tian ,  Mark Y. Tian

发明人： Yonglai Tian ,  Mark Y. Tian

IPC分类号： H05B6/68

CPC分类号： H05B6/68 ,  B23K13/01 ,  H01L21/50 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/7525 ,  H01L2224/759 ,  H01L2224/81193 ,  H01L2224/8122 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05B6/806 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method and apparatus for rapid and selective heating of materials using variable frequency RF and microwaves. The apparatus uses variable frequency solid state electronics as a microwave power source, a novel microwave heating head to couple microwave energy to the target materials and a match-up network to tune the frequency and impedance match between the microwave source and the load. An electronic and computer measurement and control system is employed to monitor and control the microwave heating process. The method teaches the use of inductive microwave coupling for thin conductive materials such as metal film and impurity doped silicon wafers. The method also teaches the use of capacitive microwave coupling for dielectric material such as glass and ceramics. The method further teaches the use of rapid and selective heating of heterostructure for bonding and sealing of mems and integrated circuits. The method and apparatus can provide ultra-high heating speed along with ultra-high heating temperatures for rapid thermal processing of semiconductors and other materials. It also allows the use of bonding materials with high melting temperature for strong bonding and sealing of mems and IC devices. The apparatus further provides for high interconnection density of integrated circuits as connections are made without the use of solder bumps.

摘要翻译： 一种使用可变频率射频和微波对材料进行快速和选择性加热的方法和装置。 该装置使用可变频率固态电子器件作为微波功率源，将微波能量耦合到目标材料的新型微波加热头和匹配网络，以调谐微波源和负载之间的频率和阻抗匹配。 采用电子计算机测控系统对微波加热过程进行监控。 该方法教导了使用感应微波耦合用于薄导电材料，例如金属膜和掺杂杂质的硅晶片。 该方法还教导了电容式微波耦合用于介电材料如玻璃和陶瓷。 该方法进一步教导了使用快速和选择性加热异质结构来结合和密封MEM和集成电路。 该方法和装置可以提供超高的加热速度以及超高的加热温度，用于半导体和其他材料的快速热处理。 它还允许使用具有高熔融温度的接合材料，用于密实和密封MEM和IC器件。 该装置进一步提供集成电路的高互连密度，因为在不使用焊料凸块的情况下进行连接。

公开(公告)号：US07861908B2

公开(公告)日：2011-01-04

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US20070084856A1

公开(公告)日：2007-04-19

申请号：US11599529

申请日：2006-11-13

申请人： Thomas DeBonis

发明人： Thomas DeBonis

IPC分类号： B23K13/01

CPC分类号： H05B6/105 ,  H01L2224/81222 ,  H01L2924/10253 ,  H01L2924/00

摘要： An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first frequency. Heat is localized on at least an integrated heat spreader (IHS), a thermal interface material (TIM), an underfill, and a sealant on the die using a second induction heater operating at a second frequency.

摘要翻译： 本发明的一个实施例是一种封装器件的技术。 使用以第一频率操作的第一感应加热器将热定位在具有在封装衬底上的凸起的裸片上。 使用以第二频率操作的第二感应加热器将热定位在至少一个散热器（IHS），热界面材料（TIM），底部填充物和密封剂上。

公开(公告)号：US20040195701A1

公开(公告)日：2004-10-07

申请号：US10753115

申请日：2004-01-06

发明人： Abbas Ismail Attarwala

IPC分类号： H01L023/48

CPC分类号： H01L24/86 ,  H01L21/4846 ,  H01L21/50 ,  H01L21/563 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81222 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/0665 ,  H01L2224/73203 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2224/81805 ,  H01L2224/0401

摘要： An electronic package substrate for an electronic package that includes an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip and a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, said circuitized member being electrically connectable to the chip. An electronic package for a wire bonded chip or tab bonded chip that includes an adhesive bonding member having two planar surfaces and an orifice there through; a circuitized member bonded to one of the planar surfaces and having an orifice there through overlying the orifice in the bonding member; a support member bonded to the other planar surface, blocking the orifices, thereby forming a cavity; and a chip bonded within the cavity to the support member and electrically connected to the circuitized member. An electronic package substrate for an electronic package for a flip chip includes an adhesive bonding member having two planar surfaces and an orifice there through, a circuitized member bonded to one of the planar surfaces and blocking the orifice, thereby forming a cavity for receiving a flip chip, and an array of solder pads on the circuitized member within the cavity. A process for fabricating an electronic package substrate including the steps of fabricating an adhesive bonding member and a circuitized member, aligning the members with respect to each other, sandwiching the members together, and bonding the members together with heat and pressure.

摘要翻译： 一种用于电子封装的电子封装衬底，包括具有两个平坦表面的粘合剂接合构件和用于接收芯片的孔口以及具有两个平坦表面的电路构件，一个表面接合到接合构件的一个平面表面 所述电路元件可与芯片电连接。 一种用于线接合芯片或接头片接合芯片的电子封装，其包括具有两个平坦表面的粘合剂接合件和其上的孔口; 一个电路化构件，其结合到一个平面表面，并且通过覆盖接合构件中的孔口而具有孔口; 结合到另一个平坦表面的支撑构件，阻挡孔，从而形成空腔; 以及芯片，其在空腔内结合到支撑构件并电连接到电路化构件。 一种用于倒装芯片的电子封装的电子封装衬底包括具有两个平坦表面的粘合剂构件和其上的孔口，电路构件接合到一个平面表面并阻塞孔，从而形成用于接收翻转的空腔 芯片，以及在空腔内的电路化元件上的焊盘阵列。 一种制造电子封装衬底的方法，包括以下步骤：制造粘合剂和电路化构件，将构件彼此对准，将构件夹在一起，并将构件与热和压力接合。

公开(公告)号：US09847308B2

公开(公告)日：2017-12-19

申请号：US14566185

申请日：2014-12-10

申请人： Intel Corporation

发明人： Rajasekaran Swaminathan ,  Ravindranath V. Mahajan

IPC分类号： H01L23/00 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1132 ,  H01L2224/11418 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13387 ,  H01L2224/13411 ,  H01L2224/13447 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16503 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81222 ,  H01L2224/81409 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0341 ,  H05K2201/083 ,  H05K2201/10674 ,  H05K2203/104 ,  Y02P70/613 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/05381 ,  H01L2924/053 ,  H01L2924/0532 ,  H01L2924/01056

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

公开(公告)号：US08987130B2

公开(公告)日：2015-03-24

申请号：US13482414

申请日：2012-05-29

申请人： Gregory M. Fritz ,  Eric P. Lewandowski

发明人： Gregory M. Fritz ,  Eric P. Lewandowski

IPC分类号： H01L21/76 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L24/17 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13179 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16501 ,  H01L2224/1713 ,  H01L2224/17163 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81466 ,  H01L2224/818 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0541 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2224/81121 ,  H01L2924/00012 ,  H01L2224/757 ,  H01L2924/014 ,  H01L2224/05552

摘要： An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.

摘要翻译： 包括一组反应性材料的焊盘阵列设置在第一衬底上。 通过由时间依赖磁场引起的磁加热，可以选择一组反应性材料。 磁加热可以是涡流加热，滞后加热和/或通过磁弛豫过程加热。 使第二基板上的焊球的阵列与焊盘的阵列接触。 通过施加的磁场在一组磁性材料中引发反应。 在一组反应性材料的反应期间，在形成反应的材料的反应中快速释放热量，熔化焊球并在第一基板和第二基板之间提供粘结。 由于磁加热可以被定位，所以在接合过程中可以最小化衬底的加热和翘曲。

公开(公告)号：US08254140B2

公开(公告)日：2012-08-28

申请号：US12357693

申请日：2009-01-22

申请人： Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

发明人： Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

IPC分类号： H05K7/10

CPC分类号： H05K3/3494 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K1/0212 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2203/101 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

摘要翻译： 安装基板包括基板，接合焊盘和感应加热垫。 接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。 感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。 响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。 因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

公开(公告)号：US20110278351A1

公开(公告)日：2011-11-17

申请号：US12777476

申请日：2010-05-11

申请人： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Nachiket Raravikar

发明人： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Nachiket Raravikar

IPC分类号： B23K31/02 ,  B23K1/20

CPC分类号： B23K1/0016 ,  B23K1/20 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8122 ,  H01L2224/81222 ,  H01L2224/81355 ,  H01L2224/81375 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81416 ,  H01L2224/81594 ,  H01L2224/81655 ,  H01L2224/81657 ,  H01L2224/8166 ,  H01L2224/81686 ,  H01L2224/81711 ,  H01L2224/81799 ,  H01L2224/83222 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3494 ,  H05K2203/101 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/053 ,  H01L2924/00 ,  H01L2224/81805

摘要： The present disclosure relates to the field of fabricating microelectronic packages, wherein a magnetic particle attachment material comprising magnetic particles distributed within a carrier material may be used to achieve attachment between microelectronic components. The magnetic particle attachment material may be exposed to a magnetic field, which, through the vibration of the magnetic particles within the magnetic particle attachment material, can heat a solder material to a reflow temperature for attaching microelectronic components of the microelectronic packages.

摘要翻译： 本公开涉及制造微电子封装的领域，其中包含分布在载体材料内的磁性颗粒的磁性颗粒附着材料可用于实现微电子部件之间的附着。 磁性颗粒附着材料可能暴露于磁场，通过磁性颗粒附着材料内的磁性颗粒的振动，可以将焊料材料加热到回流温度，以附着微电子封装的微电子部件。