公开(公告)号：US08420989B2

公开(公告)日：2013-04-16

申请号：US12615507

申请日：2009-11-10

Applicant: Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong ,  Hyun jeong Woo

Inventor： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong ,  Hyun jeong Woo

IPC: H05B6/10

CPC classification number: H05B6/36 ,  B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/81222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101

Abstract: An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

Abstract translation: 封装半导体芯片的装置包括配置为使用感应加热来回流半导体芯片的焊球的线圈。 线圈包括第一主体，平行于第一主体的第二主体，从第一主体延伸到第二主体的第三主体。 第一和第二主体相对于设置在它们之间的垂直平面是对称的。 第一和第二主体具有彼此面对的倾斜表面，并且倾斜表面彼此向下延伸。

公开(公告)号：US20100096754A1

公开(公告)日：2010-04-22

申请号：US12588477

申请日：2009-10-16

Applicant: Jonggi Lee ,  SunWon Kang ,  Young Lyong Kim ,  Jongho Lee ,  Chul-Yong Jang ,  Minill Kim ,  Eunchul Ahn ,  Kwang Yong Lee ,  Seungduk Baek ,  Ji-Seok Hong

Inventor： Jonggi Lee ,  SunWon Kang ,  Young Lyong Kim ,  Jongho Lee ,  Chul-Yong Jang ,  Minill Kim ,  Eunchul Ahn ,  Kwang Yong Lee ,  Seungduk Baek ,  Ji-Seok Hong

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L24/13 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0233 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1191 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Provided is a semiconductor package, a semiconductor module and a method for fabricating the semiconductor package. The method provides a substrate including a bonding pad. The method forms a dielectric layer for exposing the bonding pad on the substrate. The method forms a redistribution line which is electrically connected to the bonding pad, on the dielectric layer. The method forms an external terminal which is electrically connected to the bonding pad without using a solder mask which limits a position of the external terminal, on the redistribution line.

Abstract translation: 提供半导体封装，半导体模块和制造半导体封装的方法。 该方法提供了包括接合焊盘的衬底。 该方法形成用于使衬底上的焊盘露出的介电层。 该方法形成在电介质层上电连接到接合焊盘的再分配线。 该方法形成外部端子，该外部端子电连接到接合焊盘，而不使用在再分配线上限制外部端子的位置的焊接掩模。

公开(公告)号：US20170055062A1

公开(公告)日：2017-02-23

申请号：US15210384

申请日：2016-07-14

Applicant: Jonggi LEE

Inventor： Jonggi LEE

IPC: H04R1/10

CPC classification number: H04R1/1033 ,  H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R5/033 ,  H04R2201/109 ,  H04R2420/07

Abstract: A protection assembly for an ear-mounted sound-output device, the assembly comprising: one pair of sound-output unit covers, each cover having an inner space formed therein and a first open end to allow a sound-output unit of the ear-mounted sound-output device to be received in the inner space, and a coupling hole defined at a second closed end of the cover, wherein the first and second ends are opposite to each other; and one pair of connection lines, each line coupled to each of one pair of the ear-mounted sound-output unit covers at the second end of the cover, each line having a first end passing through the hole, each line having a stopper received in the inner space at the first of the line, each line having a loop at a second end of the line to allow a sound-transfer cable connected the sound-output unit to slidably pass through the loop.

Abstract translation: 一种用于耳塞式声音输出装置的保护组件，该组件包括：一对声音输出单元盖，每个盖具有形成在其中的内部空间和第一开口端，以允许耳塞式声音输出装置的声音输出单元， 安装的声音输出装置被容纳在内部空间中，以及联接孔，限定在所述盖的第二封闭端，其中所述第一和第二端彼此相对; 以及一对连接线，每条线在盖的第二端耦合到一对耳挂式声音输出单元盖中的每一条，每条线具有穿过该孔的第一端，每条线具有接收的止动件 在第一行的内部空间中，每条线在线的第二端具有一个环，以允许连接声音输出单元的声音传输电缆可滑动地穿过环路。

公开(公告)号：US20120043125A1

公开(公告)日：2012-02-23

申请号：US13193699

申请日：2011-07-29

Applicant: Taehoon Kim ,  Jonggi Lee ,  Seungduk Baek

Inventor： Taehoon Kim ,  Jonggi Lee ,  Seungduk Baek

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/184 ,  C23C18/1605 ,  C23C18/2086 ,  C23C18/44 ,  H05K2203/0793 ,  H05K2203/122 ,  Y10T29/49155

Abstract: Provided is a method of forming a circuit board including an adhesion portion. The method may include forming a mask pattern including an opening on a board; performing a surface treatment process at a bottom of the opening; combining a linker with the surface on which a surface treatment process is performed; and forming a metal pattern combined with the linker in the opening.

Abstract translation: 提供一种形成包括粘合部分的电路板的方法。 该方法可以包括在板上形成包括开口的掩模图案; 在开口的底部进行表面处理过程; 将接头与其上进行表面处理过程的表面结合; 并在开口中形成与接头组合的金属图案。

公开(公告)号：US08456018B2

公开(公告)日：2013-06-04

申请号：US13275074

申请日：2011-10-17

Applicant: Sangwook Park ,  Jonggi Lee ,  Wonchul Lim

Inventor： Sangwook Park ,  Jonggi Lee ,  Wonchul Lim

IPC: H01L29/40

CPC classification number: H01L24/03 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/20 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip having a bonding pad, a metal line electrically connected to the semiconductor chip and having a terminal contacting an external terminal, an insulation layer covering the metal line and having an opening that defines the terminal, and a molding layer molding the semiconductor chip, wherein the molding layer includes a recess pattern exposing the bonding pad and extending from the bonding pad to the terminal, and the metal line is embedded in the recess pattern to contact the bonding pad.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括具有接合焊盘的半导体芯片，与半导体芯片电连接并具有与外部端子接触的端子的金属线，覆盖金属线并具有限定端子的开口的绝缘层，以及模制层 模制所述半导体芯片，其中所述模制层包括暴露所述焊盘并从所述焊盘延伸到所述端子的凹陷图案，并且所述金属线嵌入所述凹槽图案中以接触所述焊盘。

公开(公告)号：US09736565B2

公开(公告)日：2017-08-15

申请号：US15210384

申请日：2016-07-14

Applicant: Jonggi Lee

Inventor： Jonggi Lee

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1033 ,  H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R5/033 ,  H04R2201/109 ,  H04R2420/07

Abstract: A protection assembly for an ear-mounted sound-output device, the assembly comprising: one pair of sound-output unit covers, each cover having an inner space formed therein and a first open end to allow a sound-output unit of the ear-mounted sound-output device to be received in the inner space, and a coupling hole defined at a second closed end of the cover, wherein the first and second ends are opposite to each other; and one pair of connection lines, each line coupled to each of one pair of the ear-mounted sound-output unit covers at the second end of the cover, each line having a first end passing through the hole, each line having a stopper received in the inner space at the first of the line, each line having a loop at a second end of the line to allow a sound-transfer cable connected the sound-output unit to slidably pass through the loop.

公开(公告)号：US08051555B2

公开(公告)日：2011-11-08

申请号：US12615585

申请日：2009-11-10

Applicant: Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

Inventor： Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

IPC: B23B19/00

CPC classification number: H05K3/225 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/3025 ,  H05K3/3494 ,  H05K2203/162 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electrically connect the semiconductor chip to the circuit board. The testing unit tests the semiconductor chip, and, when the testing unit determines that the first semiconductor chip is not functioning properly, the heating unit reheats the solder connection to remove the non-functioning semiconductor chip from the circuit board.

Abstract translation: 组装装置包括芯片传送单元，加热单元，测试单元和输出单元。 芯片传送单元将第一半导体芯片安装到电路板以形成电路。 加热单元加热焊接连接以将半导体芯片电连接到电路板。 测试单元测试半导体芯片，并且当测试单元确定第一半导体芯片不能正常工作时，加热单元重新加热焊接连接以从电路板去除不起作用的半导体芯片。

公开(公告)号：US20100115763A1

公开(公告)日：2010-05-13

申请号：US12615585

申请日：2009-11-10

Applicant: Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

Inventor： Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

IPC: B23P19/00

CPC classification number: H05K3/225 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/3025 ,  H05K3/3494 ,  H05K2203/162 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A module apparatus includes a first unit and a second unit adjacent to the first unit. The first unit includes a chip transfer unit mounting semiconductor chips on a printed circuit board and a heat unit applying heat on a solder ball of the semiconductor chip. The second unit includes a tester testing an electrical connection state between the printed circuit board and the semiconductor chip, a bad board storage storing the printed circuit board on which a semiconductor chip determined as bad in the tester is mounted, and a board moving member moving the printed circuit board stored in the bad board storage into the first unit.

Abstract translation: 模块装置包括与第一单元相邻的第一单元和第二单元。 第一单元包括在印刷电路板上安装半导体芯片的芯片传送单元和在半导体芯片的焊球上施加热量的加热单元。 第二单元包括测试印刷电路板和半导体芯片之间的电气连接状态的测试器，存储存储安装了测试仪中确定为坏的半导体芯片的印刷电路板的坏板存储器，以及板移动部件移动 存储在坏板存储器中的印刷电路板存储到第一单元中。

公开(公告)号：US08324522B2

公开(公告)日：2012-12-04

申请号：US12591821

申请日：2009-12-02

Applicant: Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

Inventor： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC: B23K3/00 ,  B23K26/00

CPC classification number: B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract translation: 提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。 回流装置可以包括线圈，支撑构件和移动构件。 线圈可以从电源接收电流，以使用感应加热方法加热焊球。 支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。 移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

公开(公告)号：US20120104625A1

公开(公告)日：2012-05-03

申请号：US13275074

申请日：2011-10-17

Applicant: Sangwook Park ,  Jonggi Lee ,  Wonchul Lim

Inventor： Sangwook Park ,  Jonggi Lee ,  Wonchul Lim

IPC: H01L23/498

CPC classification number: H01L24/03 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/20 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip having a bonding pad, a metal line electrically connected to the semiconductor chip and having a terminal contacting an external terminal, an insulation layer covering the metal line and having an opening that defines the terminal, and a molding layer molding the semiconductor chip, wherein the molding layer includes a recess pattern exposing the bonding pad and extending from the bonding pad to the terminal, and the metal line is embedded in the recess pattern to contact the bonding pad.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括具有接合焊盘的半导体芯片，与半导体芯片电连接并具有与外部端子接触的端子的金属线，覆盖金属线并具有限定端子的开口的绝缘层，以及模制层 模制所述半导体芯片，其中所述模制层包括暴露所述焊盘并从所述焊盘延伸到所述端子的凹陷图案，并且所述金属线嵌入所述凹槽图案中以接触所述焊盘。