公开(公告)号：USRE44071E1

公开(公告)日：2013-03-12

申请号：US11487577

申请日：2006-07-13

Applicant: Kouroche Kian ,  Ramin Heydarpour

Inventor： Kouroche Kian ,  Ramin Heydarpour

IPC: H01L21/461

CPC classification number: H01L29/78603 ,  B23K26/364 ,  G02F1/133305 ,  G02F1/13439 ,  H01L51/5206 ,  H05K3/027

Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer. According to a preferred method, the excimer laser is employed and controlled to ablate portions of the at least one conductive layer without completely decomposing the at least one functional layer therebeneath.

公开(公告)号：US20080124842A1

公开(公告)日：2008-05-29

申请号：US11557472

申请日：2006-11-07

Applicant: Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

Inventor： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

IPC: H01L21/60 ,  B23P19/00

CPC classification number: G06K19/07752 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/53543 ,  H01L2224/81 ,  H01L2224/0401

Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Abstract translation: 一种组装半导体器件的方法，包括以下步骤：提供具有粘合剂表面的可穿透基底和设置在粘合剂表面上的多个管芯; 提供具有设置在其上的多个带状引线的带状引线基底; 从所述多个带状引线分配第一多个带状引线; 提供多个销; 使所述可穿透基板与所述带状引线基板紧密接合，以使所述第一多个带状引线与所述多个管芯接触; 使用所述多个销将所述第一多个带引线压靠所述多个管芯; 以及在使用所述多个销以保持所述第一多个带状引线和所述多个管芯之间的接触的同时将所述可穿透基板移离所述带状引线基板。 还公开了一种用于组装半导体器件的装置。

公开(公告)号：US20080122119A1

公开(公告)日：2008-05-29

申请号：US11469313

申请日：2006-08-31

Applicant: Kouroche Kian ,  Xiaoming He ,  Ali Mehrabi ,  Haochuan Wang

Inventor： Kouroche Kian ,  Xiaoming He ,  Ali Mehrabi ,  Haochuan Wang

IPC: H01L23/12 ,  H01L21/58

CPC classification number: H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68322 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83868 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2224/0401

Abstract: A method for creating a plurality of semiconductor assemblies that includes the steps of creating a plurality of quasi-wafers, each quasi-wafer comprising a plurality of semiconductor devices; transferring the plurality of semiconductor devices on each quasi-wafers onto a carrier having a functional adhesive; and bonding the plurality of semiconductor devices to a substrate.

Abstract translation: 一种用于产生多个半导体组件的方法，包括以下步骤：产生多个准晶片，每个准晶片包括多个半导体器件; 将每个准晶片上的多个半导体器件转移到具有功能性粘合剂的载体上; 以及将所述多个半导体器件接合到衬底。

公开(公告)号：US20050282355A1

公开(公告)日：2005-12-22

申请号：US10872235

申请日：2004-06-18

Applicant: David Edwards ,  Jason Munn ,  Kouroche Kian ,  Reza Mehrabi ,  Ian Forster ,  Thomas Weakley

Inventor： David Edwards ,  Jason Munn ,  Kouroche Kian ,  Reza Mehrabi ,  Ian Forster ,  Thomas Weakley

IPC: H01L21/30 ,  H01L21/44 ,  H01L21/46 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L21/603

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/75315 ,  H01L2224/81801 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.

Abstract translation: 提供了一种使用各个加热元件和一个弹性部件热压接合一个或多个电气装置以迫使各个加热元件与电气装置压缩接合的方法。 各个加热元件可以是居里点加热元件或常规电阻加热元件。 还提供了使用透明柔性压板和热辐射的一个或多个电气装置的热压接合方法。 在一个实施例中，热辐射接近红外热辐射，透明柔性压板由硅橡胶组成。 接合材料可以是粘合剂或热塑性粘合材料。 还提供了利用压敏粘合剂将半导体芯片电容耦合到电气部件的方法。 该方法包括通过迫使粘结装置的柔性压板与半导体芯片压缩接合来压缩芯片。

公开(公告)号：US06762124B2

公开(公告)日：2004-07-13

申请号：US09783122

申请日：2001-02-14

Applicant: Kouroche Kian ,  Ramin Heydarpour

Inventor： Kouroche Kian ,  Ramin Heydarpour

IPC: H01L21461

CPC classification number: H01L29/78603 ,  B23K26/364 ,  G02F1/133305 ,  G02F1/13439 ,  H01L51/5206 ,  H05K3/027

Abstract: A method for patterning a multilayered conductor/substrate structure includes the steps of: providing a multilayered conductor/substrate structure which includes a plastic substrate and at least one conductive layer overlying the plastic substrate; and irradiating the multilayered conductor/substrate structure with ultraviolet radiation such that portions of the at least one conductive layer are ablated therefrom. In a preferred embodiment, a projection-type excimer laser system is employed to rapidly and precisely ablate a pattern from a mask into the at least one conductive layer. Preferably, the excimer laser is controlled in consideration of how well the at least one conductive layer absorbs radiation at particular wavelengths. Preferably, a fluence of the excimer laser is controlled in consideration of an ablation threshold level of at least one conductive layer. According to a preferred method, the excimer laser is employed and controlled to ablate portions of the at least one conductive layer without completely decomposing the at least one functional layer therebeneath.

Abstract translation: 用于图案化多层导体/衬底结构的方法包括以下步骤：提供包括塑料衬底和覆盖塑料衬底的至少一个导电层的多层导体/衬底结构; 以及用紫外线照射所述多层导体/衬底结构，使得所述至少一个导电层的部分被烧蚀。 在优选实施例中，使用投影型准分子激光系统将图案快速且精确地从掩模切割成至少一个导电层。 考虑到至少一个导电层吸收特定波长的辐射，优选地控制准分子激光器。 优选地，考虑到至少一个导电层的消融阈值水平来控制准分子激光器的注量。 根据优选的方法，使用和控制准分子激光器以烧蚀所述至少一个导电层的部分，而不完全分解其下面的至少一个功能层。