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23 条记录 (耗时 0.023 秒)

    Method and apparatus for linear die transfer
    1.
    发明授权
    Method and apparatus for linear die transfer 有权
    线性模具转移的方法和装置

    公开(公告)号：US07560303B2

    公开(公告)日：2009-07-14

    申请号：US11557472

    申请日：2006-11-07

    申请人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

    发明人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

    IPC分类号： H01L21/00

    CPC分类号： G06K19/07752 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/53543 ,  H01L2224/81 ,  H01L2224/0401

    摘要： A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

    摘要翻译： 一种组装半导体器件的方法，包括以下步骤：提供具有粘合剂表面的可穿透基底和设置在粘合剂表面上的多个管芯; 提供具有设置在其上的多个带状引线的带状引线基底; 从所述多个带状引线分配第一多个带状引线; 提供多个销; 使所述可穿透基板与所述带状引线基板紧密接合，以使所述第一多个带状引线与所述多个管芯接触; 使用所述多个销将所述第一多个带引线压靠所述多个管芯; 以及在使用所述多个销以保持所述第一多个带状引线和所述多个管芯之间的接触的同时将所述可穿透基板移离所述带状引线基板。 还公开了一种用于组装半导体器件的装置。

    METHOD AND APPARATUS FOR LINEAR DIE TRANSFER
    3.
    发明申请
    METHOD AND APPARATUS FOR LINEAR DIE TRANSFER 有权
    线性转移的方法和装置

    公开(公告)号：US20080124842A1

    公开(公告)日：2008-05-29

    申请号：US11557472

    申请日：2006-11-07

    申请人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

    发明人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

    IPC分类号： H01L21/60 ,  B23P19/00

    CPC分类号： G06K19/07752 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/53543 ,  H01L2224/81 ,  H01L2224/0401

    摘要： A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

    摘要翻译： 一种组装半导体器件的方法，包括以下步骤：提供具有粘合剂表面的可穿透基底和设置在粘合剂表面上的多个管芯; 提供具有设置在其上的多个带状引线的带状引线基底; 从所述多个带状引线分配第一多个带状引线; 提供多个销; 使所述可穿透基板与所述带状引线基板紧密接合，以使所述第一多个带状引线与所述多个管芯接触; 使用所述多个销将所述第一多个带引线压靠所述多个管芯; 以及在使用所述多个销以保持所述第一多个带状引线和所述多个管芯之间的接触的同时将所述可穿透基板移离所述带状引线基板。 还公开了一种用于组装半导体器件的装置。

    Encapsulation and Controlled Release of Small Molecules for Intracellular Delivery Using Thermally Responsive Nanocapsules
    5.
    发明申请
    Encapsulation and Controlled Release of Small Molecules for Intracellular Delivery Using Thermally Responsive Nanocapsules 有权
    使用热响应性纳米胶囊封装和控制小分子用于细胞内递送

    公开(公告)号：US20100203148A1

    公开(公告)日：2010-08-12

    申请号：US12705072

    申请日：2010-02-12

    申请人： Xiaoming He

    发明人： Xiaoming He

    IPC分类号： A61K9/51 ,  A61K38/02 ,  A61K31/7088 ,  A61K31/713 ,  A61K31/7016

    CPC分类号： A61K9/51 ,  A61K9/0004 ,  A61K9/19 ,  A61K9/5146 ,  A61K9/5161 ,  A61K31/00

    摘要： In accordance with certain embodiments of the present disclosure, a method for intracellular delivery of small molecules is provided. The method includes encapsulation of small molecules in a thermally responsive nanocapsule by decreasing the temperature of the nanocapsule to increase the permeability of the nanocapsule and allowing the small molecules to be suck into or diffuse into the nanocapsule. The nanocapsule is delivered into a cell by increasing the temperature of the nanocapsule. The small molecules are released from the nanocapsule into the cell in a controllable manner by cooling and heating treatments.

    摘要翻译： 根据本公开的某些实施方案，提供了用于小分子的细胞内递送的方法。 该方法包括通过降低纳米胶囊的温度来增加纳米胶囊的渗透性并允许小分子吸入或扩散到纳米胶囊中来将热分解纳米胶囊中的小分子包封。 通过增加纳米胶囊的温度将纳米胶囊递送到细胞中。 通过冷却和加热处理，小分子以可控的方式从纳米胶囊释放到细胞中。

    Encapsulation and controlled release of small molecules for intracellular delivery using thermally responsive nanocapsules
    9.
    发明授权
    Encapsulation and controlled release of small molecules for intracellular delivery using thermally responsive nanocapsules 有权
    使用热响应纳米胶囊封装和控制小分子进行细胞内传递

    公开(公告)号：US08318207B2

    公开(公告)日：2012-11-27

    申请号：US12705072

    申请日：2010-02-12

    申请人： Xiaoming He

    发明人： Xiaoming He

    IPC分类号： A61K9/14

    CPC分类号： A61K9/51 ,  A61K9/0004 ,  A61K9/19 ,  A61K9/5146 ,  A61K9/5161 ,  A61K31/00

    摘要： In accordance with certain embodiments of the present disclosure, a method for intracellular delivery of small molecules is provided. The method includes encapsulation of small molecules in a thermally responsive nanocapsule by decreasing the temperature of the nanocapsule to increase the permeability of the nanocapsule and allowing the small molecules to be suck into or diffuse into the nanocapsule. The nanocapsule is delivered into a cell by increasing the temperature of the nanocapsule. The small molecules are released from the nanocapsule into the cell in a controllable manner by cooling and heating treatments.

    摘要翻译： 根据本公开的某些实施方案，提供了用于小分子的细胞内递送的方法。 该方法包括通过降低纳米胶囊的温度来增加纳米胶囊的渗透性并允许小分子吸入或扩散到纳米胶囊中来将热分解纳米胶囊中的小分子包封。 通过增加纳米胶囊的温度将纳米胶囊递送到细胞中。 通过冷却和加热处理，小分子以可控的方式从纳米胶囊释放到细胞中。

    Ceramic coating comprising yttrium which is resistant to a reducing plasma
    10.
    发明申请
    Ceramic coating comprising yttrium which is resistant to a reducing plasma 审中-公开
    包含耐还原性等离子体的钇的陶瓷涂层

    公开(公告)号：US20090214825A1

    公开(公告)日：2009-08-27

    申请号：US12072530

    申请日：2008-02-26

    申请人： Jennifer Y. Sun ,  Xiaoming He ,  Kenneth S. Collins ,  Thomas Graves ,  Senh Thach ,  Jie Yuan ,  Li Xu ,  Ren-Guan Duan

    发明人： Jennifer Y. Sun ,  Xiaoming He ,  Kenneth S. Collins ,  Thomas Graves ,  Senh Thach ,  Jie Yuan ,  Li Xu ,  Ren-Guan Duan

    IPC分类号： B32B7/00 ,  C23C4/00

    CPC分类号： C23C4/11 ,  Y10T428/24355 ,  Y10T428/24997

    摘要： Particulate generation has been a problem in semiconductor device processing in highly corrosive plasma environments. The problem is exacerbated when the plasma is a reducing plasma. Empirically produced data has shown that the formation of a plasma spray coated yttrium-comprising ceramic such as yttrium oxide, Y2O3—ZrO2 solid solution, YAG, and YF3 provides a low porosity coating with smooth and compacted surfaces when such ceramics are spray coated from a powder feed having an average effective diameter ranging from about 22 μm to about 0.1 μm. These spray-coated materials reduce the generation of particulates in corrosive reducing plasma environments.

    摘要翻译： 在高度腐蚀性等离子体环境中的半导体器件加工中，微粒产生是一个问题。 当等离子体是还原等离子体时，问题更加严重。 经验生产的数据显示，等离子体喷涂的包含钇的陶瓷如氧化钇，Y2O3-ZrO2固溶体，YAG和YF3的形成提供了具有光滑和压实表面的低孔隙率涂层，当这种陶瓷从 粉末进料的平均有效直径为约22μm至约0.1μm。 这些喷涂材料减少了腐蚀性还原等离子体环境中的颗粒物的产生。