Analysis system and method for analyzing a sample on an analytical test element
    11.
    发明授权
    Analysis system and method for analyzing a sample on an analytical test element 有权
    用于分析分析测试元素上的样本的分析系统和方法

    公开(公告)号:US07951331B2

    公开(公告)日:2011-05-31

    申请号:US11776379

    申请日:2007-07-11

    CPC classification number: G01N21/4738 G01N21/01 G01N21/8483 Y10T436/110833

    Abstract: The invention relates to embodiments of an analysis system and to a method for analyzing a sample on an analytical test element, with the analysis system comprising a test element receptacle for receiving and positioning a test element in an analysis position. In an exemplary embodiment, the test element receptacle contains a guide part and a lock part, the guide part having means for guiding a test element into and out of the analysis position, the lock part comprising a frame and a bolt element, which frame and bolt element are connected to one another by a hinge. The bolt element can be pivoted about the hinge between a first position and a second position with respect to the frame. The bolt element comprises a latching lug for engaging in a recess in test element when the bolt element is in the first position and when the test element is positioned in the analysis position.

    Abstract translation: 本发明涉及分析系统的实施例和用于分析分析测试元件上的样本的方法,其中分析系统包括用于在分析位置接收和定位测试元件的测试元件容器。 在示例性实施例中,测试元件插座包括引导部分和锁定部分,引导部分具有用于将测试元件引导到分析位置和从分析位置引出的装置,该锁定部分包括框架和螺栓元件,该框架和 螺栓元件通过铰链彼此连接。 螺栓元件可相对于框架在第一位置和第二位置之间围绕铰链枢转。 螺栓元件包括当螺栓元件处于第一位置时并且当测试元件位于分析位置时用于接合在测试元件中的凹部中的闩锁凸耳。

    ANALYSIS SYSTEM AND METHOD FOR ANALYZING A SAMPLE ON AN ANALYTICAL TEST ELEMENT
    13.
    发明申请
    ANALYSIS SYSTEM AND METHOD FOR ANALYZING A SAMPLE ON AN ANALYTICAL TEST ELEMENT 有权
    分析系统和分析方法对分析测试元素进行分析

    公开(公告)号:US20080053201A1

    公开(公告)日:2008-03-06

    申请号:US11776379

    申请日:2007-07-11

    CPC classification number: G01N21/4738 G01N21/01 G01N21/8483 Y10T436/110833

    Abstract: The invention relates to embodiments of an analysis system and to a method for analyzing a sample on an analytical test element, with the analysis system comprising a test element receptacle for receiving and positioning a test element in an analysis position. In an exemplary embodiment, the test element receptacle contains a guide part and a lock part, the guide part having means for guiding a test element into and out of the analysis position, the lock part comprising a frame and a bolt element, which frame and bolt element are connected to one another by a hinge. The bolt element can be pivoted about the hinge between a first position and a second position with respect to the frame. The bolt element comprises a latching lug for engaging in a recess in test element when the bolt element is in the first position and when the test element is positioned in the analysis position.

    Abstract translation: 本发明涉及分析系统的实施例和用于分析分析测试元件上的样本的方法,其中分析系统包括用于在分析位置接收和定位测试元件的测试元件容器。 在示例性实施例中,测试元件插座包括引导部分和锁定部分,引导部分具有用于将测试元件引导到分析位置和从分析位置引出的装置,该锁定部分包括框架和螺栓元件,该框架和 螺栓元件通过铰链彼此连接。 螺栓元件可相对于框架在第一位置和第二位置之间围绕铰链枢转。 螺栓元件包括当螺栓元件处于第一位置时并且当测试元件位于分析位置时用于接合在测试元件中的凹部中的闩锁凸耳。

    Coating substrate
    14.
    发明授权
    Coating substrate 失效
    涂层基材

    公开(公告)号:US6124039A

    公开(公告)日:2000-09-26

    申请号:US155702

    申请日:1998-10-05

    Abstract: A coating substrate containing an aluminum or aluminum rolled alloy product for thin-film coatings for producing electronic components. The coating substrate prevents the interdiffusion of substrate elements and thin-film coating elements and enables the thin-film coatings to grow completely over irregularities. The local irregularities on the substrate surface to be coated, which have a maximum extension, measured vertically to the substrate surface, of less than 10 um and than 0.1 um, are such that the flanks of the local irregularities can be exposed to material deposition impinging on the substrate surface in a perpendicular manner.

    Abstract translation: PCT No.PCT / CH97 / 00130 Sec。 371日期:1998年10月5日 102(e)日期1998年10月5日PCT 1997年3月27日PCT公布。 第WO97 / 38145号公报 日期1997年10月16日一种包含用于生产电子部件的薄膜涂层的铝或铝轧制合金产品的涂层基材。 涂层基底可防​​止基底元件和薄膜涂层元件的相互扩散,并使薄膜涂层能够在不规则状态下完全生长。 要涂覆的基材表面上的局部不规则物,其具有小于10μm和0.1μm的垂直于基材表面测量的最大延伸度使得局部不规则的侧面可暴露于材料沉积物撞击 以垂直方式在基板表面上。

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