公开(公告)号：US20220076927A1

公开(公告)日：2022-03-10

申请号：US17465856

申请日：2021-09-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Ki Yong PARK

IPC: H01J37/32 ,  C23C4/11

Abstract: Proposed is a part with a corrosion-resistant layer capable of preventing the exposure of pores attributable to corrosion and preventing the discharge of internal moisture and particles through the pores.

公开(公告)号：US20220056606A1

公开(公告)日：2022-02-24

申请号：US17403689

申请日：2021-08-16

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: C25D1/00 ,  G01R1/073 ,  C25D11/04

Abstract: Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of μm, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of μm using the anodic aluminum oxide mold, and a molded article manufactured thereby.

公开(公告)号：US20210407830A1

公开(公告)日：2021-12-30

申请号：US17291981

申请日：2019-11-05

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/67 ,  H01L25/075 ,  H01L21/683 ,  H01L21/68

Abstract: Proposed are a micro-LED position error correcting carrier capable of correcting a position error of micro-LEDs, and a micro-LED transfer system using the same. The micro-LED position error correcting carrier includes: a loading recess having a bottom surface and an inclined portion and allowing a micro-LED to be accommodated therein; and a non-loading surface provided around the loading recess.

公开(公告)号：US11193955B2

公开(公告)日：2021-12-07

申请号：US16794147

申请日：2020-02-18

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01R1/073

Abstract: The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.

公开(公告)号：US11145788B2

公开(公告)日：2021-10-12

申请号：US16734175

申请日：2020-01-03

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01L33/00 ,  H01L33/64 ,  H01L25/075

Abstract: The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.

公开(公告)号：US20210307160A1

公开(公告)日：2021-09-30

申请号：US17209203

申请日：2021-03-22

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Dong Eun LEE

IPC: H05K1/03 ,  G01R1/073 ,  H05K1/11

Abstract: Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.

公开(公告)号：US20210265522A1

公开(公告)日：2021-08-26

申请号：US17253965

申请日：2020-02-13

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: Proposed are a micro LED transfer method of transferring micro LEDs of a first substrate to a second substrate and a micro LED display device using the same. More particularly, proposed are a micro LED transfer method capable of manufacturing a micro LED display device by transferring a normal individualized module to a second substrate, and a micro LED display device using the same.

公开(公告)号：US20210244836A1

公开(公告)日：2021-08-12

申请号：US17167938

申请日：2021-02-04

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Young Woon JEON ,  Min Woo CHOI

IPC: A61L2/10

Abstract: Proposed is a UV sterilizer. In a UV sterilizer according to an embodiment of the present disclosure, a light source module that emits ultraviolet (UV) light is provided between an upper body and a lower body where a fluid flows, thereby sterilizing a fluid by irradiating the flowing fluid with UV light.

公开(公告)号：US20210238763A1

公开(公告)日：2021-08-05

申请号：US17128770

申请日：2020-12-21

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Sung Hyun BYUN ,  Dong Hyeok SEO

IPC: C25D11/24 ,  C25D11/12 ,  B32B15/01 ,  B32B7/12

Abstract: Proposed is a laminated anodic oxide film structure in which a plurality of anodic oxide films are stacked. More particularly, proposed is a laminated anodic oxide film structure having a high degree of strength.

公开(公告)号：US20210115584A1

公开(公告)日：2021-04-22

申请号：US17070057

申请日：2020-10-14

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: C25D11/12 ,  C23C16/44 ,  C25D11/04

Abstract: Proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber. More particularly, proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber, wherein the metal part is installed in a process chamber used in a display or semiconductor manufacturing process or constitutes a part of the process chamber, and a large thickness of the thin film layer of the metal part for the process chamber is easily secured, thereby achieving an extended lifespan by preventing cracks of the metal part for the process chamber, while preventing outgassing due to pores.