Abstract:
The invention is based on the object of providing armoring that is lightweight and exhibits a denser microstructure that is improved as against ceramic composite materials. To this end, armoring against high dynamic impulsive loads is provided that comprises a composite material having at least two phases, the first phase forming a matrix for the second phase, and the first phase being a glass or a glass ceramic, and the second phase being embedded and distributed in the form of particles and/or fibers in the matrix formed by the material of the first phase.
Abstract:
In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a higher quality etching and etching rate even for economical types of glass the chemical etching gas is mixed with at least one noble gas, so that the proportion of sputtering etching in the ion etching process is significantly increased.
Abstract:
In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a higher quality etching and etching rate even for economical types of glass the chemical etching gas is mixed with at least one noble gas, so that the proportion of sputtering etching in the ion etching process is significantly increased.
Abstract:
In the method according to the invention cold or unheated hardened glass and/or glass-ceramic parts are bonded together with a metallic ductile joining material, preferably silver, copper, aluminum or an alloy of those metals, to form a brittle article. The parts to be joined in an initial unheated state are placed with the metallic ductile joining material between them in a high frequency alternating field with frequencies preferably from 100 to 500 kHz. Then the joining material is inductively heated locally to melt it by means of the alternating field and the parts are pressed together to form a sufficiently strong bond between the parts.
Abstract:
The invention relates to a conversion material, in particular for a white or colored light source comprising a semiconductor light source as primary light source, comprising a matrix glass that, as bulk material, for a thickness d of about 1 mm, has a pure transmission τi of greater than 80% in the wavelength region from 350 to 800 nm and in the region in which the primary light source emits light, wherein the sum of transmission and reflection of the sintered matrix glass without luminophore is at least greater than 80% in the spectral region from 350 nm to 800 nm and in the spectral region in which the primary light source emits light.
Abstract:
The invention relates to a glass ceramic armour material consisting (in % by weight in relation to oxide base) of 5-33 SiO2, 20-50 Al2O3, 5-40 MgO, 0-15 B2O3, 0.1-30 Y2O3, Ln2O3, As2O3, Nb2O3 and/or Sc2O3 and 0-10 P2O5. The inventive armour material can also be reinforced with inorganic reinforcing fibres in a quantity of 5-65% by weight, preferably consisting of C, SiC, Si3N4, Al2O3, ZrO2 or Sialon. Said armour material is characterised in that it exhibits a high elasticity modulus and is producible from green glass without to fear a premature crystallisation.
Abstract translation:本发明涉及一种由5-33SiO 2,20-50 Al 2 O 3,5-40MgO,0-15B 2 O 3,0.1-30 Y 2 O 3,L 2 O 3,As 2 O 3组成(相对于氧化物基的重量%)的玻璃陶瓷装甲材料 ,Nb 2 O 3和/或Sc 2 O 3和0-10 P 2 O 5。 本发明的装甲材料还可以用5-65重量%的量的无机增强纤维来增强,优选由C,SiC,Si 3 N 4,Al 2 O 3,ZrO 2或赛隆组成。 所述装甲材料的特征在于其显示出高弹性模量并且可以从绿色玻璃制造而不用担心过早结晶。
Abstract:
The invention is based on the object of providing armoring that is lightweight and exhibits a denser microstructure that is improved as against ceramic composite materials. To this end, armoring against high dynamic impulsive loads is provided that comprises a composite material having at least two phases, the first phase forming a matrix for the second phase, and the first phase being a glass or a glass ceramic, and the second phase being embedded and distributed in the form of particles and/or fibers in the matrix formed by the material of the first phase.
Abstract:
The glass is advantageous for microstructuring, especially reactive ion etching with fluorine and fluorine compounds, and has a glass composition based on oxide content and expressed in mol % of: SiO2, 40-70; GeO2, 0-30; B2O3, 5-20; P2O5, 5-20; WO3, 0-10; As2O3, 0-10; Yb2O3, 0-5; and Lu2O3, 0-5. Microstructure components, such as micro arrays, Fresnel lenses, micro wafers, or micro lens wafers, made by a method including reactive ion etching from the glass are also part of the present invention.
Abstract translation:该玻璃有利于微结构化,特别是氟和氟化合物的反应离子蚀刻,并且具有基于氧化物含量并以摩尔%表示的玻璃组合物:SiO 2,40-70; GeO 2,0-30; B 2 O 3,5-20; P u> 5 u> 5,5-20; WO 3,0-10; 作为2 O> 3,0-10; Yb 2 O 3,0-5; 和Lu 2 O 3,0-5。 通过包括从玻璃进行反应离子蚀刻的方法制造的微结构组件,例如微阵列,菲涅耳透镜,微晶片或微透镜晶片也是本发明的一部分。
Abstract:
In the method for microstructuring flat glass substrates a substrate surface of a glass substrate is coated with at least one structured mask layer and subsequently exposed to a chemically reactive ion etching process (RIE) with at least one chemical etching gas. In order to provide the same or a higher quality etching and etching rate even for economical types of glass the chemical etching gas is mixed with at least one noble gas, so that the proportion of sputtering etching in the ion etching process is significantly increased.
Abstract:
A glass ceramic comprises (in wt.-% on oxide basis): SiO2 35 to 60, B2O3>4 to 10, P2O5 0 to 10, Al2O3 16.5 to 40, TiO2 1 to 10, Ta2O5 0 to 8, Y2O3 0 to 6, ZrO21 to 10, MgO 6 to 20, CaO 0 to 10, SrO 0 to 4, BaO 0 to 8, ZnO 0 to 4, SnO2+CeO2 0 to 4, SO42−+Cl− 0 to 4, wherein the total content (SnO2+CeO2+S042−+Cl−) is between 0.01 and 4 wt.-%. The glass ceramic may be processed by the float glass method, may be transparent and is, inter alia, suitable as a substrate for thin film semiconductors, in particular for display applications, solar cells etc.
Abstract translation:玻璃陶瓷包含(以氧化物为基准的重量%):SiO 2→35〜60,B 2 O 3→4〜10 ,P u> 2 u> O <0> 0至10,Al 2 O 3 16.5至40,TiO 2 1〜10,Ta 2 O 5,0〜8,Y 2 O 3→0〜 6,ZrO 2 1〜10,MgO 6〜20,CaO 0〜10,SrO 0〜4,BaO 0〜8,ZnO 0〜4,SnO 2 + 0至4,SO 4,SO 2 - ,SO 2 - , - SO 2 - , - SO 2 - , - SO 2 - SnO 2 + C 2 O 2 + S 0 4 - - - - - - - - - - - - - - - - - - - 在0.01至4重量%之间。 玻璃陶瓷可以通过浮法玻璃法处理,可以是透明的,并且尤其适合作为薄膜半导体的衬底,特别是用于显示器应用,太阳能电池等。