Transducer Built-In Self-Test
    12.
    发明申请

    公开(公告)号:US20220365128A1

    公开(公告)日:2022-11-17

    申请号:US17741246

    申请日:2022-05-10

    发明人: Michael Carfore

    IPC分类号: G01R31/28

    摘要: An apparatus for testing a transducer module includes a test signal generator coupled to a common-mode terminal common to a plurality of transducers, and a signal processing circuit configured to receive output signal from each of said transducers and to produce an output signal. If the transducers are well matched to one another, the output signal will have little or no output amplitude. If there is a mismatch between the transducers, however, the output signal will have an amplitude proportional to the mismatch. The amplitude of the output signal may be compared to a predetermined threshold in order to produce a mismatch output signal indicating the existence of, and/or the degree of, mismatch between the transducers.

    Transducer system with configurable acoustic overload point

    公开(公告)号:US11363387B2

    公开(公告)日:2022-06-14

    申请号:US17165998

    申请日:2021-02-03

    摘要: A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.

    Acoustic filtering
    15.
    发明授权

    公开(公告)号:US10771889B2

    公开(公告)日:2020-09-08

    申请号:US15357075

    申请日:2016-11-21

    摘要: A package comprises: a transducer; a substrate comprising an acoustic port, with the transducer attached to a surface of the substrate and over or adjacent to the acoustic port; and a venting mechanism for venting air or sound pressure from a device comprising the package, with the venting mechanism being affixed to the substrate and partially surrounding the acoustic port, and with the venting mechanism being dimensioned to filter out audio frequencies.

    High Acoustic Overload Point Recovery Apparatus and Method

    公开(公告)号:US20220360894A1

    公开(公告)日:2022-11-10

    申请号:US17741215

    申请日:2022-05-10

    IPC分类号: H04R3/00 H01L41/113

    摘要: Illustrative embodiments enable a MEMS transducer to quickly recover from, acoustic overload events by quickly resetting signal processing circuitry downstream from a MEMS transducer. An acoustic overload sensor detects occurrence of an acoustic overload event, and triggers a reset circuit to operate a set of switches to rapidly drain charge from a corresponding set of capacitances within the transducer, or within the signal processing circuitry, thereby resetting the signal processing circuitry more rapidly than would occur if said transducer or circuitry were allowed to recover on its own.

    Piezoelectric Accelerometer with Wake Function

    公开(公告)号:US20220317148A1

    公开(公告)日:2022-10-06

    申请号:US17807310

    申请日:2022-06-16

    IPC分类号: G01P15/09 H04R19/04 G01P1/00

    摘要: A sensor device that senses proper acceleration. The sensor device includes a substrate, a spacer layer supported over a first surface of the substrate, at least a first tapered cantilever beam element having a base and a tip, the base attached to the spacer layer, and which is supported over and spaced from the substrate by the spacer layer. The at least first tapered cantilever beam element tapers in width from the base portion to the tip portion. The at least first cantilever beam element further including at least a first layer comprised of a piezoelectric material, a pair of electrically conductive layers disposed on opposing surfaces of the first layer, and a mass supported at the tip portion of the at least first tapered cantilever beam element.

    TRANSDUCER SYSTEM WITH THREE DECIBEL FEEDBACK LOOP

    公开(公告)号:US20210360347A1

    公开(公告)日:2021-11-18

    申请号:US17318980

    申请日:2021-05-12

    发明人: Julian Aschieri

    IPC分类号: H04R3/02 H03F3/183 H04R3/04

    摘要: A transducer system has a transducer configured to receive an incident signal and produce an output signal as a function of the incident signal. As known in the art, the output signal has a −3 dB point. The transducer system also has circuitry operatively coupled with the transducer. The circuitry includes an amplifier with an output configured to produce an amplified signal as a function of the output signal. In addition, the circuitry further has a positive feedback loop and a negative feedback loop that both are electrically coupled between the transducer and the amplifier. The positive feedback loop is configured to move the −3 dB point in a first frequency direction. Conversely, the negative feedback loop is configured to move the −3 dB point in a second frequency direction. Preferably, the first and second frequency directions are different.

    Transducer system with configurable acoustic overload point

    公开(公告)号:US10917727B2

    公开(公告)日:2021-02-09

    申请号:US16353589

    申请日:2019-03-14

    摘要: A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.