公开(公告)号：US07476565B2

公开(公告)日：2009-01-13

申请号：US11799923

申请日：2007-05-03

Applicant: Wen-Kun Yang ,  Wen-Bin Sun ,  Hsi-Ying Yuan ,  Chun Hui Yu

Inventor： Wen-Kun Yang ,  Wen-Bin Sun ,  Hsi-Ying Yuan ,  Chun Hui Yu

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/6835 ,  H01L23/5389 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01094 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract translation: 公开了一种填充浆料结构和晶片级封装的工艺。 该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。 多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。 用粘合剂材料涂覆刚性基材以粘附骰子。 然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

公开(公告)号：US20060033196A1

公开(公告)日：2006-02-16

申请号：US10918416

申请日：2004-08-16

Applicant: Wen-Kun Yang ,  Shih-Li Chen ,  Wen-Bin Sun ,  Ming-Hui Lin ,  Chao-Nan Chou ,  Chih-Wei Lin

Inventor： Wen-Kun Yang ,  Shih-Li Chen ,  Wen-Bin Sun ,  Ming-Hui Lin ,  Chao-Nan Chou ,  Chih-Wei Lin

IPC: H01L23/48

CPC classification number: H01L23/3114 ,  H01L23/3128 ,  H01L24/19 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.

Abstract translation: 提供包括器件，互连元件，焊盘和保护元件的封装结构。 该装置通过焊盘与互连元件的第一端连接。 保护元件覆盖焊盘和互连元件的第一端。