Abstract:
A needle bed structure for flat knitting machines that is located at two sides of a needle bed gap includes a plurality of parallel needle plates, a plurality of knitting needles and sinkers located between the needle plates, a sinker control portion movable in parallel with the arranged direction of the sinkers, and at least one control cam driven by a switching portion to push the sinkers to rotate towards the needle bed gap during the switching movement. The switching portion performs a switching movement according to the moving direction. The needle plates hole at least one needle pressing board to restrict vertical movement of the knitting needles. The switching portion has a magnetic attracting portion corresponding to the needle pressing board to form magnetic attraction therewith. A spacer is provided between the needle plates to prevent the horizontal movement of the sinkers.
Abstract:
A sinker control apparatus for flat knitting machines located on a transverse board over a plurality of knitting needles to drive parallel sinkers hinged between the knitting needles to rotate. The sinker control apparatus includes a base, a linked movement portion located on the base to perform driving movements, a first control cam and a second control cam hinged on the linked movement portion, and a switching portion coupled with the linked movement portion. The switching portion includes at least one connection rod connecting to the linked movement portion, a switching seat coupled on the connection rod and an elastic element coupled around the connection rod to provide a butting force to the switching seat towards the transverse board. The switching seat has a magnetic attracting portion at one side facing the transverse board to attract the transverse board magnetically.
Abstract:
A sinker control apparatus for flat knitting machines located on a transverse board over a plurality of knitting needles to drive parallel sinkers hinged between the knitting needles to rotate. The sinker control apparatus includes a base, a linked movement portion located on the base to perform driving movements, a first control cam and a second control cam hinged on the linked movement portion, and a switching portion coupled with the linked movement portion. The switching portion includes at least one connection rod connecting to the linked movement portion, a switching seat coupled on the connection rod and an elastic element coupled around the connection rod to provide a butting force to the switching seat towards the transverse board. The switching seat has a magnetic attracting portion at one side facing the transverse board to attract the transverse board magnetically.
Abstract:
An exemplary protecting film for coating a three-dimensional surface of a workpiece, includes an adhesive layer and a release layer. The adhesive layer defines a split. The release layer includes a remaining portion for shielding the split of the adhesive layer and a release portion detachably formed on the adhesive layer. The remaining portion is capable of remaining on the adhesive layer after the release portion detaches from the adhesive layer. A method for coating a protecting film on a workpiece is also provided.
Abstract:
In an electric contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite, an Ag—(SnO2+In2O3) composite containing 9˜11% of (SnO2+In2O3) or an Ag—Cu oxide, composite containing 15˜25% of Cu oxide is used. The electrical contact material has a contact resistance of 5˜60 milliohms (mohm) and an arc erosion resistance capability up to 2*103˜10*103 times provided that the Vickers hardness (Hv) of the material is 100˜150, the measured current is 1˜5 amperes, and the measured voltage is 10˜20 volts. Two electrical contacts maintain an arc erosion resisting capability at the condition of a low contact resistance when the electrical contact material is formed on a surface of a metal substrate of an electric connector.
Abstract translation:在能够抵抗电弧腐蚀并且不含镉复合物的银基质的电接触材料中,含有9〜11%(SnO 2 + In 2 O 3)或Ag-Cu氧化物的Ag-(SnO 2 + In 2 O 3)复合材料包含15 使用〜25%的Cu氧化物。 电接触材料的接触电阻为5〜60毫欧(mohm),耐电弧腐蚀能力高达2 * 103〜10 * 103倍,条件是材料的维氏硬度(Hv)为100〜150,测得的 电流为1〜5安培,测量电压为10〜20伏。 当在电连接器的金属基板的表面上形成电接触材料时,两个电触点在低接触电阻的条件下保持抗电弧侵蚀能力。
Abstract:
Films containing microlayer structures are provided. In a general embodiment, the present disclosure provides an autoclavable film containing a first microlayer of a heat resistant polymer and a second microlayer of a flexible polymer attached to the first microlayer. Each of the first microlayer and the second microlayer has a thickness ranging between about 0.01 microns and about 10 microns.
Abstract:
A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured.
Abstract:
Patients suffering from acute renal failure must be diagnosed and treated quickly so that a physician can confidently prescribe either peritoneal dialysis or hemodialysis. In one way of quickly treating the patients, software is used to calculate a suitable peritoneal dialysis prescription without regard to how short or how long a dialysis cycle is used, and without regard to a total dialysate fluid volume for a therapy. For patients with suitable peritoneal membrane transport properties, the software program suggests that, at least over a short period of time, unexpectedly high ultrafiltrate volumes and high clearances may be achieved.
Abstract:
An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor.
Abstract:
An exemplary image sensor package includes a base, an image sensor chip, a bonding layer, and an imaging lens. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area with the bonding layer. The imaging lens is configured for forming images on the photosensitive area. The present invention also relates to a method for manufacturing the image sensor package.