CHIP CARRIER
    1.
    发明公开
    CHIP CARRIER 审中-公开

    公开(公告)号:US20230253226A1

    公开(公告)日:2023-08-10

    申请号:US18094428

    申请日:2023-01-09

    CPC classification number: H01L21/67333 G01R31/2893

    Abstract: The present invention provides a chip carrier that selectively carries a chip under test or a standard chip. The chip carrier comprises a body and a load board. The body defines a test area located on an upper surface of the body, and a first chip position is defined in the test area. The load board is detachably located in the test area, and a second chip position is defined in the load board. A standard chip is disposed within the second chip position. When the load board is located in the test area, the load board covers the first chip position and the chip under test is not disposed within the first chip position. When the chip under test is disposed within the first chip position, the load board is not located in the test area.

    ELECTRONIC DEVICE
    3.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20180303000A1

    公开(公告)日:2018-10-18

    申请号:US15922887

    申请日:2018-03-15

    CPC classification number: H05K5/0226 G06F1/1616 G06F1/1681 H05K5/0247

    Abstract: An electronic device includes a first body, a second body, an electrical connection element, and a hinge structure. The electrical connection element is configured to electrically connect the first body with the second body. The hinge structure is configured to pivot the first body with the second body. The hinge structure includes two mounting bases, two first linking assemblies, and a second linking assembly. Each of the mounting bases is connected to the first body and the second body. The two first linking assemblies are respectively pivoted to the two mounting bases. The second linking assembly is disposed between the two mounting bases, and two opposite terminals of the second linking assembly are movably connected to the two mounting bases respectively. The second linking assembly has a receding space configured to accommodate a portion of the electrical connection element.

    ELECTRONIC APPARATUS AND METHOD OF FABRICATING THE SAME
    4.
    发明申请
    ELECTRONIC APPARATUS AND METHOD OF FABRICATING THE SAME 有权
    电子装置及其制造方法

    公开(公告)号:US20120026102A1

    公开(公告)日:2012-02-02

    申请号:US12915017

    申请日:2010-10-29

    CPC classification number: G02F1/13338 G03F7/2022 G06F3/041 G06F2203/04103

    Abstract: A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured.

    Abstract translation: 描述了制造具有有源区域和围绕有源区域的周边区域的电子设备的方法。 提供第一主装置和第二主装置。 光学透明液体粘合剂(OCLA)被施加在第一主装置和第二主装置之间并且在有源区域内。 具有透明区域和不透明区域的光掩模设置在第二主设备的上方,透明区域对应于周边区域。 执行OCLA扩散过程,使得OCLA从活性区扩散到周边区域。 在OCLA扩散处理期间,进行利用光掩模的第一照射处理,使得扩散到周边区域的OCLA部分固化。 在去除光掩模之后,进行第二次照射处理,使得OCLA完全固化。

    Apparatuses and Methods for Coordinating Operations of Multiple Wireless Communications Modules with Multiple Subscriber Numbers
    5.
    发明申请
    Apparatuses and Methods for Coordinating Operations of Multiple Wireless Communications Modules with Multiple Subscriber Numbers 有权
    用于协调具有多个用户号码的多个无线通信模块的操作的装置和方法

    公开(公告)号:US20110235587A1

    公开(公告)日:2011-09-29

    申请号:US13075045

    申请日:2011-03-29

    Abstract: A wireless communications device is provided with a plurality of card slots, a first wireless communications module, and a second wireless communications module. The card slots are inserted with at least one subscriber identity card. The first wireless communications module performs wireless transceiving in compliance with at least a first wireless technology. The second wireless communications module determines at least a first subscriber number and a second subscriber number from the at least one subscriber identity card, and enables the wireless transceiving of the first wireless communications module using the first subscriber number. Also, the second wireless communications module performs wireless transceiving in compliance with at least a second wireless technology using the second subscriber number.

    Abstract translation: 无线通信设备具有多个卡槽,第一无线通信模块和第二无线通信模块。 卡槽插入至少一个订户身份证。 第一无线通信模块执行至少第一无线技术的无线收发。 所述第二无线通信模块至少从所述至少一个订户身份卡确定第一用户号码和第二用户号码,并且使用所述第一用户号码启用所述第一无线通信模块的无线收发。 此外,第二无线通信模块根据至少使用第二用户号码的第二无线技术执行无线收发。

    Graphics card and heat dissipation method thereof
    6.
    发明授权
    Graphics card and heat dissipation method thereof 有权
    显卡及其散热方法

    公开(公告)号:US07952880B2

    公开(公告)日:2011-05-31

    申请号:US12365232

    申请日:2009-02-04

    Inventor: Sheng-Hung Wang

    Abstract: A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein.

    Abstract translation: 图形卡包括图形处理单元(GPU),散热片,电冷却模块和热电发电机。 电冷却组件具有冷侧和热侧。 冷端接触GPU,热侧接触散热片。 热电发生器接触散热片并与电冷却模块电连接。 此外,还公开了用于耗散图形卡的热量的方法。

    TEST COMPONENT EXTRACTION MODULE
    7.
    发明申请

    公开(公告)号:US20230057060A1

    公开(公告)日:2023-02-23

    申请号:US17886498

    申请日:2022-08-12

    Abstract: The present invention provides a test component extraction module having a first arm, a second arm, and a base. The second arm is connected to the first arm. The base is connected to the second arm and has a suction hole for holding a test component. Wherein a first angle is predetermined between the first arm and the second arm. When the suction hole sucks the test component attached to a surface, and the first arm gradually moves away from the surface, a second angle is between the second arm and the first arm, and the second angle is greater than the first angle.

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