Abstract:
The present invention provides a chip carrier that selectively carries a chip under test or a standard chip. The chip carrier comprises a body and a load board. The body defines a test area located on an upper surface of the body, and a first chip position is defined in the test area. The load board is detachably located in the test area, and a second chip position is defined in the load board. A standard chip is disposed within the second chip position. When the load board is located in the test area, the load board covers the first chip position and the chip under test is not disposed within the first chip position. When the chip under test is disposed within the first chip position, the load board is not located in the test area.
Abstract:
The invention provides a chip carrier, a chip testing module and a chip handling module. The chip carrier for carrying a plurality of chips comprises a main body with an upper surface and a lower surface. The main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface. A part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected. The main body is made of conductive material.
Abstract:
An electronic device includes a first body, a second body, an electrical connection element, and a hinge structure. The electrical connection element is configured to electrically connect the first body with the second body. The hinge structure is configured to pivot the first body with the second body. The hinge structure includes two mounting bases, two first linking assemblies, and a second linking assembly. Each of the mounting bases is connected to the first body and the second body. The two first linking assemblies are respectively pivoted to the two mounting bases. The second linking assembly is disposed between the two mounting bases, and two opposite terminals of the second linking assembly are movably connected to the two mounting bases respectively. The second linking assembly has a receding space configured to accommodate a portion of the electrical connection element.
Abstract:
A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured.
Abstract:
A wireless communications device is provided with a plurality of card slots, a first wireless communications module, and a second wireless communications module. The card slots are inserted with at least one subscriber identity card. The first wireless communications module performs wireless transceiving in compliance with at least a first wireless technology. The second wireless communications module determines at least a first subscriber number and a second subscriber number from the at least one subscriber identity card, and enables the wireless transceiving of the first wireless communications module using the first subscriber number. Also, the second wireless communications module performs wireless transceiving in compliance with at least a second wireless technology using the second subscriber number.
Abstract:
A graphics card includes a graphics processing unit (GPU), a heat dissipation fin, an electric cooling module and a thermoelectric generator. The electric cooling module has a cold side and a hot side. The cold side contacts the GPU, and the hot side contacts the heat dissipation fin. The thermoelectric generator contacts the heat dissipation fin and is electrically connected to the electric cooling module. Furthermore, a method for dissipating the heat of the graphics card is also disclosed herein.
Abstract:
The present invention provides a test component extraction module having a first arm, a second arm, and a base. The second arm is connected to the first arm. The base is connected to the second arm and has a suction hole for holding a test component. Wherein a first angle is predetermined between the first arm and the second arm. When the suction hole sucks the test component attached to a surface, and the first arm gradually moves away from the surface, a second angle is between the second arm and the first arm, and the second angle is greater than the first angle.
Abstract:
A foldable electronic device including a first body, a second body, a hinge module and a shielding sheet is provided. The hinge module is pivotally connected to the first body and the second body. The shielding sheet covers the hinge module. The shielding sheet includes an inner film and an outer film overlapping each other, and the inner film is fixed to the hinge module.
Abstract:
A foldable electronic device including a first body, a second body, a hinge module and a shielding sheet is provided. The hinge module is pivotally connected to the first body and the second body. The shielding sheet covers the hinge module. The shielding sheet includes an inner film and an outer film overlapping each other, and the inner film is fixed to the hinge module.
Abstract:
Cancer-targeting peptides having a PX1LX2 motif, in which X1 is His or an amino acid residue with a hydrophobic side chain and X2 is Pro, Phe, or Trp. Also disclosed herein are conjugates containing the cancer-targeting peptides and uses thereof in cancer treatment and diagnosis.