Semiconductor type pressure sensor
    12.
    发明授权
    Semiconductor type pressure sensor 失效
    半导体式压力传感器

    公开(公告)号:US6122974A

    公开(公告)日:2000-09-26

    申请号:US139273

    申请日:1998-08-25

    IPC分类号: G01L9/04 G01L9/00 G01L7/08

    CPC分类号: G01L19/147

    摘要: A pressure sensor superior in pressure resistance and capable of covering from a low to high pressure range as a measuring range is to be provided. Plural pressure sensing sections for high and low pressures are formed on a silicon board, the pressure sensing sections each com ing an outer frame portion, a diaphragm portion, a strain gauge portion and an electrode portion. The silicon board side with the strain gauge portions formed thereon and an insulating substrate having electrode take-out portions are bonded together in such a manner that the strain gauge portions are hermetically sealed and that the electrode portions on the silicon board and the electrode take-out portions of the insulating substrate are electrically connected with each other, to constitute a pressure sensing unit. The pressure sensing unit, a low-melting glass and a stem are laminated together in such a manner that lead pins are electrically bonded by solder to the electrode portions of the silicon board through the electrode take-out portions of the insulating substrate. In this state, the low-melting glass is melted to bond the pressure sensing unit and the stem with each other.

    摘要翻译: 要提供耐压性能优异且能够从低压到高压范围覆盖的压力传感器作为测量范围。 用于高压和低压的多个压力感测部分形成在硅板上,每个压力感测部分均设有外框部分,隔膜部分,应变计部分和电极部分。 在其上形成有应变计部分的硅板侧和具有电极取出部分的绝缘基板以使应变计部分气密密封的方式接合在一起,并且硅板和电极上的电极部分 绝缘基板的外侧部分彼此电连接,以构成压力感测单元。 将压力感测单元,低熔点玻璃和阀杆以这样的方式层压在一起,使得引脚通过焊料通过绝缘基板的电极取出部分与硅板的电极部分电连接。 在这种状态下,低熔点玻璃被熔化,以将压力感测单元和杆彼此粘合。