公开(公告)号：US09773714B2

公开(公告)日：2017-09-26

申请号：US14810631

申请日：2015-07-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate ,  Hiroko Akiyama ,  Naota Sugiyama ,  Brant U. Kolb ,  Eric G. Larson

IPC: H01L23/29 ,  C08L63/00 ,  H01L23/10 ,  H01L21/56 ,  C08K3/36 ,  C08K9/06 ,  H01L33/56

CPC classification number: H01L23/296 ,  C08K3/36 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/10 ,  H01L23/293 ,  H01L23/295 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

公开(公告)号：US20150017434A1

公开(公告)日：2015-01-15

申请号：US14373953

申请日：2013-01-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Blake R. Dronen ,  Eric G. Larson

IPC: B32B38/10 ,  B32B37/24

CPC classification number: B32B38/10 ,  B32B33/00 ,  B32B37/12 ,  B32B37/24 ,  B32B43/006 ,  B32B2037/243 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10 ,  Y10T428/2839

Abstract: A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body.

Abstract translation: 提供了一种混合层压体，其包括透光支撑体，设置在透光性支撑体上的潜在释放层，设置在潜在释放层上的接合层和设置在接合层上的热塑性起泡层。 混合层叠体还可以包括待加工的基板，例如待研磨的硅晶片。 还提供了制造所提供的层叠体的方法。