公开(公告)号：US20150229109A1

公开(公告)日：2015-08-13

申请号：US14174910

申请日：2014-02-07

Applicant: ABB Technology AG

Inventor： Zdenek Kutalek ,  Stefano Motta ,  Amar G. Kini ,  Frantisek Koudelka

IPC: H02B13/02

CPC classification number: H02B13/02 ,  H02B1/01 ,  H02B1/301 ,  Y10T29/49826

Abstract: Side panels for a compartment of a switchgear include a first panel structure and a second panel structure that is identical to the first panel structure. Each panel structure has a body with symmetric surface features in the body. Certain of the surface features are offset from a plane of symmetry of the body. The first panel structure is constructed and arranged to define a left side of the compartment and the second panel structure, upon proper orientation, is constructed and arranged to define an opposing, right side of the compartment.

Abstract translation: 用于开关设备的隔室的侧面板包括与第一面板结构相同的第一面板结构和第二面板结构。 每个面板结构都具有在身体中具有对称表面特征的身体。 某些表面特征偏离身体的对称平面。 第一板结构被构造和布置成限定隔室的左侧，并且第二面板结构在适当定向时被构造和布置以限定隔室的相对的右侧。

公开(公告)号：US20150062832A1

公开(公告)日：2015-03-05

申请号：US14013064

申请日：2013-08-29

Applicant: ABB Technology AG

Inventor： Shamsi Ismayilov ,  Yaser A. Khalifa ,  Frantisek Koudelka ,  Arkady Oksengorn ,  Siu Lau ,  Hardik Patel ,  In Y. Choi

IPC: H05K7/02 ,  H05K13/00

CPC classification number: H05K7/026 ,  H05K7/1425 ,  H05K13/00 ,  Y10T29/49128

Abstract: A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.

Abstract translation: 一种方法和装置为智能电子设备（IED）提供新的硬件模块。 提供的硬件模块被配置为与具有第一外形尺寸的第一IED外壳的连接电连接。 提供了具有不同于第一形状因子的第二形状因数的第二IED壳体。 硬件模块安装在第二壳体中。 采用适配器结构将硬件模块与第二壳体的连接电连接。 第二个壳体安装在现有的布线和第二个外形环境中。