Lidar sensor with orthogonal arrays

    公开(公告)号:US12181583B1

    公开(公告)日:2024-12-31

    申请号:US17712264

    申请日:2022-04-04

    Abstract: A method for scanning a scene is disclosed. According to the method, light is transmitted by a transmitter through a transmitter surface grating array, as a first elliptical pattern in a first lateral direction. Light is received by a receiver through a receiver surface grating array, from an area of a second elliptical pattern. The received light is reflected from the first elliptical pattern. The first elliptical pattern is orthogonal to the second elliptical pattern. The first elliptical pattern overlaps with the second elliptical pattern.

    Optical waveguide passivation for moisture protection

    公开(公告)号:US12164150B2

    公开(公告)日:2024-12-10

    申请号:US17373576

    申请日:2021-07-12

    Abstract: In part, in one aspect, the disclosure relates to a method for passivating a waveguide of an optical circuit. The method includes etching a suspended waveguide in the optical circuit; the suspended waveguide having a top surface, a bottom surface, and side surfaces; and covering the top surface and side surfaces of the suspended waveguide with a passivation coating having a thickness that ranges from between about 10 nm to about 20 nm. In one embodiment, the method further includes removing one or more coatings from a portion of the optical circuit. The disclosure also relates to various passivated optical silicon circuit embodiments.

    Wavelength division multiplexer
    16.
    发明授权

    公开(公告)号:US11353666B2

    公开(公告)日:2022-06-07

    申请号:US16441775

    申请日:2019-06-14

    Abstract: An integrated wavelength division multiplexer is described. The integrated wavelength division multiplexer may include a first waveguide core defining a first propagation axis and configured to guide light of a first wavelength and light of a second wavelength, and a second waveguide core defining a second propagation axis and configured to guide the light of the second wavelength. A first portion of the second propagation axis for which the first waveguide core and second waveguide core may be overlapping is oriented at a non-zero angle relative to the first propagation axis. The first waveguide core and second waveguide core may be configured relative to each other to adiabatically couple the light of the second wavelength between the first and second waveguide cores.

    LiDAR sensor with orthogonal arrays

    公开(公告)号:US11294061B1

    公开(公告)日:2022-04-05

    申请号:US16104872

    申请日:2018-08-17

    Abstract: An apparatus for scanning a scene comprising a light transmitter including a one-dimensional phased array; wherein the light transmitter is fed by a frequency swept scanning laser; and a light receiver including a one-dimensional phased array; the one-dimensional phased array of the light receiver disposed orthogonally to the one-dimensional phased array of the transmitter; wherein light received by the light receiver is enabled to be interfered with light from the frequency swept scanning laser.

    Coherent receiver array
    18.
    发明授权

    公开(公告)号:US11187517B2

    公开(公告)日:2021-11-30

    申请号:US16441576

    申请日:2019-06-14

    Abstract: Optical coherent receiver arrays are described. The optical coherent receiver arrays include an integrated array of photodetectors separated by integrated mirrors which may cause interference of received free space optical and local oscillator signals. The mirrors may serve as splitters, helping to align the received signal and local oscillator to cause interference. The photodetectors of the optical coherent receiver array may be electrically coupled in various manners to read out the signals. The optical coherent receiver array may be implemented in an optical coherence tomography (OCT) imaging system in some embodiments.

    Techniques to combine two integrated photonic substrates

    公开(公告)号:US10852492B1

    公开(公告)日:2020-12-01

    申请号:US14926868

    申请日:2015-10-29

    Abstract: Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

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