公开(公告)号：US10964605B1

公开(公告)日：2021-03-30

申请号：US16741089

申请日：2020-01-13

Applicant: Acacia Communications, Inc.

Inventor： Diedrik Vermeulen ,  Long Chen ,  Christopher Doerr

IPC: H01L21/66 ,  G01M11/00 ,  G02B6/122 ,  G02B6/12 ,  G02B6/34 ,  G02B6/30

Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.

公开(公告)号：US10852492B1

公开(公告)日：2020-12-01

申请号：US14926868

申请日：2015-10-29

Applicant: Acacia Communications, Inc.

Inventor： Diedrik Vermeulen ,  Christopher Doerr

IPC: G02B6/42 ,  G02B6/125 ,  G02B6/12

Abstract: Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

公开(公告)号：US10578799B2

公开(公告)日：2020-03-03

申请号：US15870468

申请日：2018-01-12

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Eric Swanson ,  Diedrik Vermeulen ,  Saeid Azemati ,  Jon Stahl

IPC: G02B6/12 ,  G02B6/10 ,  G02B6/42

Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

公开(公告)号：US09523820B1

公开(公告)日：2016-12-20

申请号：US14797005

申请日：2015-07-10

Applicant: Acacia Communications, Inc.

Inventor： Diedrik Vermeulen

IPC: G02B6/00 ,  G02B6/10 ,  G02B6/27 ,  G02B6/126 ,  G02B6/12

CPC classification number: G02B6/2733 ,  G02B6/126 ,  G02B6/2773 ,  G02B2006/12061 ,  G02B2006/12097

Abstract: A photonic device comprising a first waveguide core and a second waveguide core. The first waveguide core is asymmetric relative to an imaginary plane that bisects a height of the first waveguide core and is parallel to the bottom surface of the first waveguide core throughout a first region of the photonic device. A side surface of the second waveguide core is parallel to the first waveguide core throughout the first region of the photonic device.

Abstract translation: 一种光子器件，包括第一波导芯和第二波导芯。 第一波导芯相对于虚拟平面是不对称的，该虚平面在光子器件的整个第一区域中平分第一波导芯的高度并且平行于第一波导芯的底表面。 第二波导芯的侧表面在光子器件的整个第一区域平行于第一波导芯。

公开(公告)号：US20160202432A1

公开(公告)日：2016-07-14

申请号：US14991816

申请日：2016-01-08

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  G02B6/30 ,  G02B6/28

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Abstract translation: 光子集成电路（PIC）可以与多个光学部件（例如，光纤阵列）光学对准。 可以通过使用耦合在PIC的第一输入/输出（I / O）光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的，并且在PIC的常规操作期间是不透射的。

公开(公告)号：US12147073B1

公开(公告)日：2024-11-19

申请号：US16801789

申请日：2020-02-26

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Eric Swanson ,  Diedrik Vermeulen ,  Saeid Azemati ,  Jon Stahl

IPC: G02B6/42 ,  G02B6/12

Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

公开(公告)号：US09829659B2

公开(公告)日：2017-11-28

申请号：US15295241

申请日：2016-10-17

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/122 ,  G02B6/28 ,  G02B6/30 ,  G02B6/34

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

公开(公告)号：US20170123154A1

公开(公告)日：2017-05-04

申请号：US15359275

申请日：2016-11-22

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/124 ,  G02B6/126

CPC classification number: G02B6/124 ,  G02B6/126 ,  G02B6/30 ,  G02B6/34 ,  G02B2006/12038 ,  G02B2006/12061

Abstract: Disclosed herein are techniques, methods, structures and apparatus for providing photonic structures and integrated circuits with optical gratings disposed within cladding layer(s) of those structures and circuits.

公开(公告)号：US20170031113A1

公开(公告)日：2017-02-02

申请号：US15295241

申请日：2016-10-17

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/34 ,  G02B6/28 ,  G02B6/30 ,  G02B6/122

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Abstract translation: 光子集成电路（PIC）可以与多个光学部件（例如，光纤阵列）光学对准。 可以通过使用耦合在PIC的第一输入/输出（I / O）光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的，并且在PIC的常规操作期间是不透射的。

公开(公告)号：US09529156B2

公开(公告)日：2016-12-27

申请号：US13928031

申请日：2013-06-26

Applicant: ACACIA COMMUNICATIONS INC.

Inventor： Diedrik Vermeulen ,  Christopher Doerr

IPC: G02B6/34 ,  G02B6/124 ,  G02B6/30

CPC classification number: G02B6/124 ,  G02B6/126 ,  G02B6/30 ,  G02B6/34 ,  G02B2006/12038 ,  G02B2006/12061

Abstract: Disclosed herein are techniques, methods, structures and apparatus for providing photonic structures and integrated circuits with optical gratings disposed within cladding layer(s) of those structures and circuits.

Abstract translation: 本文公开了用于向光子结构和集成电路提供设置在这些结构和电路的包层内的光栅的技术，方法，结构和装置。