Q margin
    2.
    发明授权
    Q margin 有权

    公开(公告)号:US12015481B1

    公开(公告)日:2024-06-18

    申请号:US17866825

    申请日:2022-07-18

    Inventor: Yue Pan Jonas Geyer

    Abstract: A method, system, and ASIC chip for comparing a bit error rate (BER) to a forward error correction (FEC) threshold to determine a Q margin for a codeblock; wherein the BER corresponds to the number of errors in a given amount of data; where a codeblock of a FEC corresponds to the given amount of data; wherein the FEC threshold corresponds to the maximum amount of errors per codeblock that the FEC is able to remove per given amount of data; wherein the Q margin corresponds to a difference between the BER and the FEC threshold.

    RESISTIVITY ENGINEERED SUBSTRATE FOR RF COMMON-MODE SUPPRESSION

    公开(公告)号:US20230155683A1

    公开(公告)日:2023-05-18

    申请号:US18094205

    申请日:2023-01-06

    CPC classification number: H04B10/50 H04B10/032 H04B10/25 H04J14/0254

    Abstract: Aspects of the present disclosure are directed to a photonic integrated circuit (PIC) having a resistivity-engineered substrate to suppress radio-frequency (RF) common-mode signals. In some embodiments, a semiconductor substrate is provided that comprises two portions having different levels of resistivity to provide both suppression of common mode signals, and reduction of RF absorption loss for non-common mode RF signals. In such embodiments, a bottom portion of the semiconductor substrate has a low resistivity to suppress common mode via RF absorption, while a top portion of the semiconductor substrate that is adjacent to conductors in the IC has a high resistivity to reduce RF loss.

    Flexible baud rate
    7.
    发明授权

    公开(公告)号:US11621781B2

    公开(公告)日:2023-04-04

    申请号:US17357344

    申请日:2021-06-24

    Inventor: Jonas Geyer

    Abstract: A method, system, and apparatus enabled to selectively choose a baud rate for communication of optical data using a modem enabled to operate with an optical signal modulated at plurality of finely tuned baud rates.

    FORWARD ERROR CORRECTION SYSTEMS AND METHODS

    公开(公告)号:US20230040120A1

    公开(公告)日:2023-02-09

    申请号:US17972176

    申请日:2022-10-24

    Inventor: Pierre Humblet

    Abstract: Techniques for performing forward error correction of data to be transmitted over an optical communications channel. The techniques include: receiving data bits; organizing the data bits into an arrangement having a plurality of blocks organized into rows and columns and into a plurality of strands including a first strand of blocks that includes a back portion comprising a first row of the plurality of blocks, and a front portion comprising blocks from at least two different columns in at least two different rows other than the first row of blocks; and encoding at least some of the data bits in the arrangement using a first error correcting code at least in part by generating first parity bits by applying the first error correcting code to first data bits in the front portion of the first strands and second data bits in the back portion of the first strand.

    Carrier sweep-out in a tunable laser

    公开(公告)号:US11411371B1

    公开(公告)日:2022-08-09

    申请号:US16927506

    申请日:2020-07-13

    Abstract: In a first embodiment, an external cavity tunable laser, comprising a silicon photonics circuit comprising one or more resonators having one or more p-i-n junctions; wherein a voltage is applied to one or more of the p-i-n junctions. In a second embodiment, a method of operating an external cavity tunable laser, comprising sweeping out free-carriers from a resonator of the tunable laser by applying a voltage to a p-i-n junction of a waveguide of the resonator.

    Optoelectronic ball grid array package with fiber

    公开(公告)号:US11360278B2

    公开(公告)日:2022-06-14

    申请号:US14927016

    申请日:2015-10-29

    Abstract: A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.

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