公开(公告)号：US10680023B2

公开(公告)日：2020-06-09

申请号：US16357627

申请日：2019-03-19

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L27/14 ,  H01L27/146

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

公开(公告)号：US20200045828A1

公开(公告)日：2020-02-06

申请号：US16597447

申请日：2019-10-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Nicola Spring ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

IPC: H05K3/00 ,  H01L27/146 ,  H01L33/48 ,  H05K1/02

Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

公开(公告)号：US11662541B2

公开(公告)日：2023-05-30

申请号：US16762102

申请日：2018-10-25

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Mario Cesana ,  Camilla Camarri ,  Hartmut Rudmann

IPC: H01L33/48 ,  G02B7/02 ,  H01L23/04 ,  H01L23/31

CPC classification number: G02B7/02 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3142 ,  H01L33/483

Abstract: This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.

公开(公告)号：US11013123B2

公开(公告)日：2021-05-18

申请号：US16597447

申请日：2019-10-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Nicola Spring ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

IPC: H05K3/00 ,  H01L27/146 ,  H01L33/48 ,  H05K1/02 ,  H01L33/58 ,  H05K3/28 ,  H01L33/62

Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

公开(公告)号：US20190326340A1

公开(公告)日：2019-10-24

申请号：US16357627

申请日：2019-03-19

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L27/146

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.