-
公开(公告)号：US11013123B2
公开(公告)日：2021-05-18
申请号：US16597447
申请日：2019-10-09
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring , Simon Gubser , Robert Lenart , Mario Cesana
Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
-
2.发明申请公开(公告)号：US20200176615A1
公开(公告)日：2020-06-04
申请号：US16630588
申请日：2018-07-24
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Robert Lenart , Sonja Hanselmann , Özkan Ahishali
IPC: H01L31/0203 , H01L31/18 , B29C45/14
Abstract: Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.
-
公开(公告)号：US10352764B2
公开(公告)日：2019-07-16
申请号：US15274055
申请日：2016-09-23
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Jens Geiger , Frank Sobel , Rene Kromhof , Alberto Soppelsa , Kevin Hauser , Robert Lenart
Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.
-
公开(公告)号：US10373996B2
公开(公告)日：2019-08-06
申请号：US15651510
申请日：2017-07-17
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Stephan Heimgartner , Ville Kettunen , Nicola Spring , Alexander Bietsch , Mario Cesana , Hartmut Rudmann , Jukka Alasirnio , Robert Lenart
IPC: H04N5/225 , H01L27/146 , G02B27/00 , H01L31/18 , H01L31/0216 , H01L31/0232
Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
-
公开(公告)号：US10317254B2
公开(公告)日：2019-06-11
申请号：US15127660
申请日：2015-03-18
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Jens Geiger , Nicola Spring , Robert Lenart , Bassam Hallal , Hakan Karpuz
Abstract: Optical encoding systems include a generalized cylindrical code scale having one or more regions with different light reflective properties. In an example process, a code scale can be created by coating an elongated generalized cylinder with one or more different layers of materials having different light reflective properties. Portions of these layers can be removed selectively in order to expose a particular overlying material and create a particular pattern of features having different optical characteristics (e.g., absorbing, specularly reflecting, diffusely reflecting).
-
Patent Agency Ranking
公开(公告)号：US20210199475A1
公开(公告)日：2021-07-01
申请号：US16967601
申请日：2019-02-07
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Markus Dantler , Alison Marie Jäggi , Robert Lenart , Nicola Spring
IPC: G01D5/347 , G01D5/30 , G06F3/03 , G06F3/0362
Abstract: An example optical encoder includes a rotary shaft having a rotational axis. The rotary shaft is actuatable along the rotational axis. The optical encoder also includes at least one light generating element operable to generate light, and at least one light detecting element operable to detect light and convert the detected light into a signal. The rotary shaft includes a portion operable to reflect light generated from the at least one light generating element onto the at least one light detecting element wherein the signal is generated. The portion is configured such that an actuation of the rotary shaft from a first position to a second position generates a corresponding change in the signal generated in the at least one light detecting element.
-
7.发明授权公开(公告)号：US11171249B2
公开(公告)日：2021-11-09
申请号：US16630588
申请日：2018-07-24
Applicant: ams Sensors Singapore Pte. Ltd
Inventor： Robert Lenart , Sonja Gantner-Hanselmann , Özkan Ahishali
Abstract: Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.
-
8.发明授权公开(公告)号：US11114593B2
公开(公告)日：2021-09-07
申请号：US16461982
申请日：2017-11-30
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Robert Lenart , Sonja Gantner , Oezkan Ahishali
IPC: H01L33/54 , H01L31/0203 , H01L31/0232 , H01L31/12 , H01L31/18 , H01L33/00 , H01L33/58 , H01L27/14 , H01L33/48
Abstract: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.
-
公开(公告)号：US20200045828A1
公开(公告)日：2020-02-06
申请号：US16597447
申请日：2019-10-09
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring , Simon Gubser , Robert Lenart , Mario Cesana
IPC: H05K3/00 , H01L27/146 , H01L33/48 , H05K1/02
Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
-
10.发明申请公开(公告)号：US20190288166A1
公开(公告)日：2019-09-19
申请号：US16461982
申请日：2017-11-30
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Robert Lenart , Sonja Hanselmann , Oezkan Ahishali
IPC: H01L33/54 , H01L31/12 , H01L33/58 , H01L31/0232 , H01L31/18 , H01L33/00 , H01L31/0203
Abstract: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.659 seconds)
