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    HANDHELD ELECTRONIC DEVICE
    14.
    发明申请
    HANDHELD ELECTRONIC DEVICE 有权

    公开(公告)号：US20210168226A1

    公开(公告)日：2021-06-03

    申请号：US17068619

    申请日：2020-10-12

    Applicant: Apple Inc.

    Inventor： Bryan D. Keen ,  Devon A. Monaco ,  Sherry Lee ,  Ihtesham H. Chowdhury ,  Eric N. Nyland ,  Matthew D. Hill ,  Arun R. Varma ,  Lucy E. Browning ,  Sawyer I. Cohen ,  Benjamin J. Pope

    IPC: H04M1/02 ,  H05K1/11 ,  H05K5/00

    Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

    Thermally conductive camera enclosure
    16.
    发明授权
    Thermally conductive camera enclosure 有权
    导热相机外壳

    公开(公告)号：US09591215B1

    公开(公告)日：2017-03-07

    申请号：US14852336

    申请日：2015-09-11

    Applicant: Apple Inc.

    Inventor： Scott W. Miller ,  Ihtesham H. Chowdhury ,  Ryan J. Dunn ,  Jeffrey Nathan Gleason

    IPC: H04N5/232 ,  H04N5/225

    CPC classification number: H04N5/23241 ,  H04N5/2252 ,  H04N5/2257

    Abstract: Embodiments of the invention include devices, systems and methods for using or manufacturing a camera enclosure or mobile device that includes a thermally conductive camera module, such as having a minimum thermal conductivity of 200 watts per meter Kelvin (W/mK), that enhances heat transfer between a stiffener and cap of the enclosure. This allows heat produced by the camera to be conducted forward, away from the bottom of the stiffener, through the stiffener, and to the top of can so that the bottom of the stiffener does not heat to a high temperature, components of the device or an outer surface of a cover of the device near the bottom of the stiffener. This substantially increases the time before or avoids having the temperature of outer surface reach a high temperature, such as one that will be uncomfortable to the user. Other embodiments are also described and claimed.

    Abstract translation: 本发明的实施例包括用于使用或制造相机外壳或移动设备的装置，系统和方法，其包括导热相机模块，例如具有200瓦/米开尔文（W / mK）的最小热导率，其增强热量 在外壳的加强件和盖子之间传递。 这允许相机产生的热量向前传导，远离加强件的底部，通过加强件，并且到达顶部，使得加强件的底部不会加热到高温，装置的部件或 该装置的盖的外表面靠近加强件的底部。 这大大增加了外表面的温度达到高温之前的时间，或者避免了使用者不舒适的高温。 还描述和要求保护其他实施例。

    PARALLEL HEAT SPREADER
    17.
    发明申请
    PARALLEL HEAT SPREADER 有权
    平行散热器

    公开(公告)号：US20170042058A1

    公开(公告)日：2017-02-09

    申请号：US14816122

    申请日：2015-08-03

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Scott A. Myers ,  Ihtesham H. Chowdhury

    IPC: H05K7/20

    CPC classification number: H05K7/205 ,  H01L23/34 ,  H01L23/373 ,  H01L23/3735

    Abstract: A heat spreader including multiple layers of anisotropic material to conduct thermal energy. Multiple graphite sheet layers may be laminated and each sheet may be thermally connected to one or more thermal energy sources in a portable electronic device. Methods for making a heat spreader are also disclosed.

    Abstract translation: 散热器包括多层各向异性材料以传导热能。 可以层叠多个石墨片层，并且每个片材可以热连接到便携式电子设备中的一个或多个热能源。 还公开了制造散热器的方法。

    System and methods for thermal control using sensors on die
    18.
    发明授权
    System and methods for thermal control using sensors on die 有权
    使用模具上的传感器进行热控制的系统和方法

    公开(公告)号：US09285278B2

    公开(公告)日：2016-03-15

    申请号：US13891030

    申请日：2013-05-09

    Applicant: Apple Inc.

    Inventor： Amaury J. Heresztyn ,  Ihtesham H. Chowdhury ,  Keith Cox

    IPC: G01K1/00 ,  G01K7/01

    CPC classification number: G01K7/01

    Abstract: A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.

    Abstract translation: 提供了包括嵌入在模具中的温度传感器的便携式电子设备。 为了处理温度测量，便携式电子设备包括耦合到温度传感器的处理器电路，处理器电路被配置为当芯片中的集成电路不活动时从温度传感器读取测量值。 此外，耦合到处理器电路和温度传感器的存储器电路存储由温度传感器提供的温度梯度。 还提供了如上所述的用于便携式电子设备的印刷电路板。 还提供了如上所述在便携式电子设备中进行热控制的方法。

    Electronic Device With Heat Spreading Film
    19.
    发明申请
    Electronic Device With Heat Spreading Film 有权
    带热扩散膜的电子设备

    公开(公告)号：US20150362791A1

    公开(公告)日：2015-12-17

    申请号：US14498814

    申请日：2014-09-26

    Applicant: Apple Inc.

    Inventor： Tyler R. Kakuda ,  Shawn R. Gettemy ,  Mark T. Sullivan ,  Ihtesham H. Chowdhury

    IPC: G02F1/1333 ,  G02F1/1335

    CPC classification number: G02F1/133385 ,  F28F2013/006 ,  G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133628 ,  H01L23/34 ,  H01L23/40 ,  H01L2023/4068

    Abstract: An electronic device may have a housing in which components are mounted that produce heat. The heat producing components may be light-emitting diodes mounted on a flexible printed circuit in a display backlight, may be integrated circuits, or may be other devices that generate heat during operation. A heat spreading layer such as a layer of graphite may be attached to the backlight unit or other structures in the electronic device using adhesive. The adhesive may be patterned to form an unbonded area between at least some of the backlight unit or other structures to which the heat spreading layer is being attached and the heat spreading layer. The heat spreading layer may be mounted adjacent to a housing structure such as a metal midplate member that is attached to housing walls in the housing.

    Abstract translation: 电子设备可以具有其中安装有产生热量的部件的壳体。 发热部件可以是安装在显示器背光源中的柔性印刷电路上的发光二极管，可以是集成电路，或者可以是在操作期间产生热量的其它装置。 可以使用粘合剂将诸如石墨层的散热层附着到电子设备中的背光单元或其它结构。 粘合剂可以被图案化以在至少一些背光单元或其它结构之间形成未结合的区域，散热层所附着的其它结构和散热层。 散热层可以安装在诸如附接到壳体中的壳体壁的金属中间板构件的壳体结构附近。

    HEAT TRANSFER STRUCTURE
    20.
    发明申请
    HEAT TRANSFER STRUCTURE 有权
    热传递结构

    公开(公告)号：US20150092351A1

    公开(公告)日：2015-04-02

    申请号：US14077550

    申请日：2013-11-12

    Applicant: APPLE INC.

    Inventor： Ihtesham H. Chowdhury ,  Henry H. Lam ,  Derek W. Wright ,  Amaury J. Heresztyn

    IPC: H05K7/20 ,  F28F21/06 ,  F28F21/02

    CPC classification number: F28F21/06 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/02 ,  G06F1/203 ,  H01L23/373 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

    Abstract translation: 电子设备可以包括位于产生热量的第一部件和散发热量的第二部件之间的传热结构。 传热结构将热量从第一部件传递到第二部件。 传热结构可以包括传热构件，其包括附接到至少一个柔性层的导热层和由传热构件的形状产生的至少一个可变形区域。

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