Method and system for balancing the electrostatic chucking force on a substrate

    公开(公告)号:US10541169B2

    公开(公告)日:2020-01-21

    申请号:US15593502

    申请日:2017-05-12

    Abstract: Embodiments of the disclosure relate to methods and a system for adjusting the chucking voltage of an electrostatic chuck. In one embodiment, a system for plasma processing a substrate includes a plasma processing chamber, a radio-frequency (RF) matching circuit coupled to the chamber, a sensor and a controller. The chamber includes a chamber body having an inner volume, a bipolar electrostatic chuck disposed in the inner volume and a power supply configured to provide chucking voltage to a pair of electrodes embedded within the electrostatic chuck. When plasma is energized within the chamber by the application of RF power through an RF matching circuit, the sensor is configured to detect a change in an electrical characteristic at the RF matching circuit. The controller is coupled to the power supply and configured to adjust the chucking voltage in response to the change in the electrical characteristic detected by the sensor.

    Topography prediction using system state information

    公开(公告)号:US10303812B2

    公开(公告)日:2019-05-28

    申请号:US15231487

    申请日:2016-08-08

    Abstract: Embodiments presented herein provide techniques for predicting the topography of a product produced from a manufacturing process. One embodiment includes generating a plurality of prediction models. Each of the plurality of prediction models corresponds to a respective one of a plurality of positional coordinates of a product produced from a manufacturing process. The method also includes receiving a set of user-specified input parameters to apply to the manufacturing control process. The method further includes generating a graphical representation of a topography map for the product for the user-specified of input parameters based on the plurality of prediction models.

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