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公开(公告)号：US20210207898A1
公开(公告)日：2021-07-08
申请号：US17210511
申请日：2021-03-24
Applicant: Acer Incorporated
Inventor： Cheng-Yu Cheng , Wen-Neng Liao , Cheng-Wen Hsieh
Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
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公开(公告)号：US10996006B2
公开(公告)日：2021-05-04
申请号：US16293642
申请日：2019-03-06
Applicant: Acer Incorporated
Inventor： Cheng-Yu Cheng , Wen-Neng Liao , Cheng-Wen Hsieh
Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
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公开(公告)号：US10529649B2
公开(公告)日：2020-01-07
申请号：US15828435
申请日：2017-12-01
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: H01L23/467 , H01L23/427 , F28F1/32 , H01L23/367
Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
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公开(公告)号：US20180374777A1
公开(公告)日：2018-12-27
申请号：US15828435
申请日：2017-12-01
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: H01L23/467 , H01L23/427 , F28F1/32
CPC classification number: H01L23/467 , F28D15/0233 , F28D15/0275 , F28F1/325 , F28F2215/08 , H01L23/3672 , H01L23/3677 , H01L23/427 , H01L2924/0002
Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
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公开(公告)号：US20180192543A1
公开(公告)日：2018-07-05
申请号：US15483600
申请日：2017-04-10
Applicant: Acer Incorporated
Inventor： Yung-Chih Wang , Jau-Han Ke , Wen-Neng Liao , Cheng-Yu Cheng , Cheng-Wen Hsieh
IPC: H05K7/20
CPC classification number: H05K7/20309 , G06F1/203 , H05K7/20336
Abstract: A heat dissipation module applicable to an electronic apparatus is provided. The electronic apparatus includes a heat source. The heat dissipation module includes an evaporator, a first pipe, and a working fluid. The evaporator includes a tank and a first sheet metal installed in the tank. The tank includes a cavity, and the first sheet metal includes a plurality of tabs that are arranged and stand in the cavity. The evaporator is in thermal contact with the heat source so as to absorb heat generated by the heat source. The first pipe is connected to the cavity to form a first loop. The working fluid is filled in the cavity and the first loop. In addition, a method for manufacturing the heat dissipation module is also provided.
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Patent Agency Ranking
公开(公告)号：US10006471B2
公开(公告)日：2018-06-26
申请号：US15352212
申请日：2016-11-15
Applicant: Acer Incorporated
Inventor： Yung-Chih Wang , Cheng-Wen Hsieh , Kuang-Hua Lin , Cheng-Yu Cheng , Wen-Neng Liao
CPC classification number: F04D29/666 , F04D17/16 , F04D25/0613 , F04D29/281 , F04D29/4226 , F04D29/4233 , F04D29/441 , G06F1/203 , H05K7/20145 , H05K7/20172
Abstract: A fan module and an electronic device using the fan module are provided. The fan module includes a housing, a fan blade assembly, and a fan hub. The housing has a first surface on which plural wind guiding structures are arranged. The fan blade assembly is pivoted to the housing through the fan hub and adapted to rotate along a rotation direction. The wind guiding structures are arranged along a circumferential direction of the fan hub to guide a wind flow into the housing while the fan blade assembly is being rotated.
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公开(公告)号：US11035378B2
公开(公告)日：2021-06-15
申请号：US16292350
申请日：2019-03-05
Applicant: Acer Incorporated
Inventor： Jau-Han Ke , Shun-Ta Yu , Cheng-Yu Cheng , Cheng-Wen Hsieh , Wen-Neng Liao
Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.
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公开(公告)号：US10914313B2
公开(公告)日：2021-02-09
申请号：US16111220
申请日：2018-08-24
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
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公开(公告)号：US20200091038A1
公开(公告)日：2020-03-19
申请号：US16691528
申请日：2019-11-21
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: H01L23/467 , F28D15/02 , H01L23/427 , F28F1/32
Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.
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公开(公告)号：US20190277584A1
公开(公告)日：2019-09-12
申请号：US16293642
申请日：2019-03-06
Applicant: Acer Incorporated
Inventor： Cheng-Yu Cheng , Wen-Neng Liao , Cheng-Wen Hsieh
Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
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