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公开(公告)号：US20190129474A1
公开(公告)日：2019-05-02
申请号：US16004452
申请日：2018-06-11
Applicant: Acer Incorporated
Inventor： Hung-Chi Chen , Hsueh-Chih Peng , Yi-Chang Lai , Cheng-Yu Cheng
CPC classification number: G06F1/1652 , F03G7/065 , G02F1/133305 , G06F1/1616 , G06F1/203 , G06F2200/203 , G09F9/301
Abstract: An electronic device includes a flexible display panel and a shape memory component. The flexible display panel is driven by the shape memory component, herein when a temperature of the shape memory component is lower than a default temperature range, the shape memory component forms as a first shape, so that the flexible display panel is capable of being located at a first position. When the temperature of the shape memory component is higher than the default temperature range, the shape memory component forms as a second shape, so that the flexible display panel is driven to be moved to a second position.
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公开(公告)号：US20180196485A1
公开(公告)日：2018-07-12
申请号：US15679175
申请日：2017-08-17
Applicant: Acer Incorporated
Inventor： Cheng-Yu Cheng , Wen-Neng Liao , Cheng-Wen Hsieh , Yu-Ming Lin
CPC classification number: G06F1/206 , G02B27/0006 , G02B27/017 , G02B27/0176 , G02B2027/014 , H05K7/20963
Abstract: A head mounted display includes a lens unit, at least one lens temperature sensor, an environment temperature sensor, an environment humidity sensor, a temperature controller, a housing, and a display unit. The lens unit includes a carrier having a touching surface and a back surface opposite to each other and two lenses disposed on the carrier. An enclosed space is formed between a user and the touching surface. The at least one lens temperature sensor is adjacent to the lenses, and the sensors are all disposed on the touching surface. The temperature controller is disposed on the back surface and increases or decreases a temperature of the enclosed space and lens temperatures of the lenses according to sensing actions of the at least one lens temperature sensor, the environment temperature sensor, and the environment humidity sensor, so as to adjust the environment temperature and humidity of the enclosed space.
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公开(公告)号：US10808715B2
公开(公告)日：2020-10-20
申请号：US16168855
申请日：2018-10-24
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Yu-Ming Lin , Cheng-Yu Cheng , Cheng-Wen Hsieh
Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
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公开(公告)号：US20190063451A1
公开(公告)日：2019-02-28
申请号：US16111220
申请日：2018-08-24
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: F04D29/28
Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
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公开(公告)号：US20180051717A1
公开(公告)日：2018-02-22
申请号：US15352212
申请日：2016-11-15
Applicant: Acer Incorporated
Inventor： Yung-Chih Wang , Cheng-Wen Hsieh , Kuang-Hua Lin , Cheng-Yu Cheng , Wen-Neng Liao
CPC classification number: F04D29/666 , F04D17/16 , F04D25/0613 , F04D29/281 , F04D29/4226 , F04D29/4233 , F04D29/441 , G06F1/203 , H05K7/20145 , H05K7/20172
Abstract: A fan module and an electronic device using the fan module are provided. The fan module includes a housing, a fan blade assembly, and a fan hub. The housing has a first surface on which plural wind guiding structures are arranged. The fan blade assembly is pivoted to the housing through the fan hub and adapted to rotate along a rotation direction. The wind guiding structures are arranged along a circumferential direction of the fan hub to guide a wind flow into the housing while the fan blade assembly is being rotated.
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Patent Agency Ranking
公开(公告)号：US11953272B2
公开(公告)日：2024-04-09
申请号：US17210511
申请日：2021-03-24
Applicant: Acer Incorporated
Inventor： Cheng-Yu Cheng , Wen-Neng Liao , Cheng-Wen Hsieh
CPC classification number: F28F13/02 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20409
Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
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公开(公告)号：USD873834S1
公开(公告)日：2020-01-28
申请号：US29579273
申请日：2016-09-29
Applicant: Acer Incorporated
Designer： Ju-Hsien Weng , Tzu-Hsiang Chang , Te-Ho Chen , Hsing-Yi Kao , Chien-Yu Hsieh , Wei-Yi Li , Yi-Ming Chang , Lun-Yu Hung , Cheng-Yu Cheng
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公开(公告)号：US20190163246A1
公开(公告)日：2019-05-30
申请号：US16199237
申请日：2018-11-26
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Cheng-Yu Cheng , Shun-Ta Yu
Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.
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公开(公告)号：US20180218858A1
公开(公告)日：2018-08-02
申请号：US15482057
申请日：2017-04-07
Applicant: Acer Incorporated
Inventor： Jian-Siang Wang , Ching-Piao Kuan , Hung-Chi Chen , Yi-Hsuan Yang , Cheng-Yu Cheng
IPC: H01H13/705 , G06F1/16 , H02N2/02
CPC classification number: H01H13/705 , G06F1/1616 , H01H13/7065 , H01H13/82 , H01H2211/002 , H01H2213/002 , H01H2213/008 , H01H2213/014 , H01H2215/028 , H01H2221/038 , H01H2227/02 , H02N2/02
Abstract: A keyboard module and an electronic device using the keyboard module are provided. The keyboard module includes a housing, a plurality of keys, a micro pump chamber and an actuator. The housing has multiple openings with the keys disposed in the housing. Each key includes a switch membrane, a key cover, an elastic element and a scissor unit. The switch membrane has a key switch, the key cover is above the switch membrane, and the elastic element disposed between the switch membrane and the key cover triggers the key switch when being pressed and deformed. The scissor unit is disposed between the key cover and the switch membrane to support the key cover. The micro pump chamber disposed below the key cover includes a first chamber, a second chamber communicating with the first chamber, a check valve disposed between the first chamber and the second chamber, and an actuator driving the keys to be withdrawn into or protrude out of the openings.
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公开(公告)号：US20180031328A1
公开(公告)日：2018-02-01
申请号：US15482042
申请日：2017-04-07
Applicant: Acer Incorporated
Inventor： Cheng-Yu Cheng , Wen-Neng Liao , Cheng-Wen Hsieh , Jau-Han Ke , Yung-Chih Wang
IPC: F28D15/02
CPC classification number: F28D15/025 , F28D15/0266 , F28D15/06 , F28F9/026 , F28F2270/00 , H01L23/427
Abstract: A heat dissipation apparatus suited for dissipating heat of a heat source. The heat dissipation apparatus includes a tank, a heat-insulation unit and a pipe. The tank has an outlet end, an inlet end and an accommodating space, wherein the tank receives heat of the heat source from above. The heat-insulation unit is disposed in the accommodating space of the tank, and the heat-insulation unit includes a heat-insulation nozzle. The heat-insulation nozzle has a first opening, a second opening and a neck portion, wherein the first opening communicates with the inlet end, the second opening communicates with the accommodating space and the neck portion is near the second opening. The pipe communicates the outlet end and the inlet end and forms a closed circulating loop with the tank.
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