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公开(公告)号：US20190163246A1
公开(公告)日：2019-05-30
申请号：US16199237
申请日：2018-11-26
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Cheng-Yu Cheng , Shun-Ta Yu
Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.
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公开(公告)号：US10529649B2
公开(公告)日：2020-01-07
申请号：US15828435
申请日：2017-12-01
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: H01L23/467 , H01L23/427 , F28F1/32 , H01L23/367
Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
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公开(公告)号：US20180374777A1
公开(公告)日：2018-12-27
申请号：US15828435
申请日：2017-12-01
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: H01L23/467 , H01L23/427 , F28F1/32
CPC classification number: H01L23/467 , F28D15/0233 , F28D15/0275 , F28F1/325 , F28F2215/08 , H01L23/3672 , H01L23/3677 , H01L23/427 , H01L2924/0002
Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
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公开(公告)号：US10808715B2
公开(公告)日：2020-10-20
申请号：US16168855
申请日：2018-10-24
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Yu-Ming Lin , Cheng-Yu Cheng , Cheng-Wen Hsieh
Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
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公开(公告)号：US20190063451A1
公开(公告)日：2019-02-28
申请号：US16111220
申请日：2018-08-24
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: F04D29/28
Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
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Patent Agency Ranking
公开(公告)号：US11353041B2
公开(公告)日：2022-06-07
申请号：US16703794
申请日：2019-12-04
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Jau-Han Ke , Shun-Ta Yu
Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
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公开(公告)号：US11035378B2
公开(公告)日：2021-06-15
申请号：US16292350
申请日：2019-03-05
Applicant: Acer Incorporated
Inventor： Jau-Han Ke , Shun-Ta Yu , Cheng-Yu Cheng , Cheng-Wen Hsieh , Wen-Neng Liao
Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.
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公开(公告)号：US10914313B2
公开(公告)日：2021-02-09
申请号：US16111220
申请日：2018-08-24
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
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公开(公告)号：US20200182258A1
公开(公告)日：2020-06-11
申请号：US16703794
申请日：2019-12-04
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Jau-Han Ke , Shun-Ta Yu
Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
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公开(公告)号：US20200091038A1
公开(公告)日：2020-03-19
申请号：US16691528
申请日：2019-11-21
Applicant: Acer Incorporated
Inventor： Shun-Ta Yu , Wen-Neng Liao , Cheng-Yu Cheng , Jau-Han Ke , Cheng-Wen Hsieh
IPC: H01L23/467 , F28D15/02 , H01L23/427 , F28F1/32
Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.
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