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公开(公告)号：US12104603B2
公开(公告)日：2024-10-01
申请号：US18306252
申请日：2023-04-25
Applicant: Acer Incorporated
Inventor： Cheng-Wen Hsieh , Wen-Neng Liao , Kuang-Hua Lin , Wei-Chin Chen , Tsung-Ting Chen
CPC classification number: F04D17/10 , F04D17/162 , F04D29/281 , F04D29/30 , F04D29/666
Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.
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公开(公告)号：US20240243114A1
公开(公告)日：2024-07-18
申请号：US18414485
申请日：2024-01-17
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Mao-Neng Liao , Cheng-Wen Hsieh , Kuang-Hua Lin , Wei-Chin Chen , Kuan-Lin Chen , Chun-Chieh Wang
CPC classification number: H01L25/165 , H01L23/24 , H01L24/29 , H01L24/32 , H01L24/33 , H05K7/20445 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/33183 , H01L2924/0665 , H01L2924/1432
Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.
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公开(公告)号：US20240237268A9
公开(公告)日：2024-07-11
申请号：US18486178
申请日：2023-10-13
Applicant: Acer Incorporated
Inventor： Tsung-Ting Chen , Wen-Neng Liao , Cheng-Wen Hsieh , Kuang-Hua Lin , Wei-Chin Chen , Yu-Ming Lin
CPC classification number: H05K7/20136 , F04D17/16 , F04D29/281
Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
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公开(公告)号：US11946483B2
公开(公告)日：2024-04-02
申请号：US18318852
申请日：2023-05-17
Applicant: Acer Incorporated
Inventor： Jau-Han Ke , Tsung-Ting Chen , Chun-Chieh Wang , Yu-Ming Lin , Cheng-Wen Hsieh , Wen-Neng Liao
CPC classification number: F04D29/281 , F04D17/10 , F04D29/4226 , F04D29/666
Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.
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公开(公告)号：US11629725B2
公开(公告)日：2023-04-18
申请号：US17222963
申请日：2021-04-05
Applicant: Acer Incorporated
Inventor： Tsung-Ting Chen , Wen-Neng Liao , Cheng-Wen Hsieh , Yu-Ming Lin , Jau-Han Ke , Kuang-Hua Lin
Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.
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Patent Agency Ranking
公开(公告)号：US20220290684A1
公开(公告)日：2022-09-15
申请号：US17688910
申请日：2022-03-08
Applicant: Acer Incorporated
Inventor： Yu-Ming Lin , Wen-Neng Liao , Cheng-Wen Hsieh , Chun-Chieh Wang , Han-Liang Huang , Sheng-Yan Chen , Tsung-Ting Chen
Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.
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公开(公告)号：USD962879S1
公开(公告)日：2022-09-06
申请号：US29741641
申请日：2020-07-14
Applicant: Acer Incorporated
Designer： Shu-Hao Kuo , Wen-Neng Liao , Cheng-Wen Hsieh
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公开(公告)号：US20210364238A1
公开(公告)日：2021-11-25
申请号：US17325217
申请日：2021-05-20
Applicant: Acer Incorporated
Inventor： Chun-Chieh Wang , Wen-Neng Liao , Cheng-Wen Hsieh , Kuang-Hua Lin , Jau-Han Ke
Abstract: A vapor chamber structure for heat dissipation of a heat source is provided. The vapor chamber structure includes a housing having a heat absorption side and a heat dissipation side, a first capillary structure disposed in the housing, and a working fluid filled in the housing. The first capillary structure is formed into cavities isolated from each other, and each of the cavities is connected between the heat absorption side and the heat dissipation side. Heat generated by the heat source is absorbed by the heat absorption side, thereby transforming the working fluid from liquid state to vapor state. The working fluid in the vapor state is transmitted to the heat dissipation side via the cavities, and is transformed to the liquid state while the heat is dissipated. The working fluid in the liquid state returns to the heat absorption side via the first capillary structure.
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公开(公告)号：US20210324873A1
公开(公告)日：2021-10-21
申请号：US17228665
申请日：2021-04-12
Applicant: Acer Incorporated
Inventor： Kuang-Hua Lin , Cheng-Wen Hsieh , Wen-Neng Liao
Abstract: A fan including a hub and a plurality metal blades is provided. Each of the blades extends from the hub and is inclined relative to a radial direction of the hub. Each blade has a distal edge away from the hub, and has a pair of wingtips at the distal edge.
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公开(公告)号：US20210317839A1
公开(公告)日：2021-10-14
申请号：US17222963
申请日：2021-04-05
Applicant: Acer Incorporated
Inventor： Tsung-Ting Chen , Wen-Neng Liao , Cheng-Wen Hsieh , Yu-Ming Lin , Jau-Han Ke , Kuang-Hua Lin
Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one flow inlet. The impeller assembled in the housing and rotating about an axial direction includes a hub and a plurality blades disposed around the hub. The flow inlet is located in the axial direction and faces the hub. Each of the blades has a wing tab next to the flow inlet, and the wing tab extends from a main surface of the blade to another blade. The wing tab has an inclined surface facing toward a periphery of the flow inlet along a radial direction of the impeller.
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