公开(公告)号：US12132006B2

公开(公告)日：2024-10-29

申请号：US17566579

申请日：2021-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pao-Nan Lee ,  Chen-Chao Wang ,  Chang Chi Lee

IPC: H01L23/31 ,  H01L23/552 ,  H01L25/16 ,  H01L49/02

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L25/16 ,  H01L28/10 ,  H01L28/40

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

公开(公告)号：US11127650B2

公开(公告)日：2021-09-21

申请号：US16799751

申请日：2020-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien Lin Chang Chien ,  Chiu-Wen Lee ,  Hung-Jung Tu ,  Chang Chi Lee ,  Chin-Li Kao

IPC: H01L23/36 ,  H01L21/48 ,  H01L23/48 ,  H01L23/367 ,  H01L23/00

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.

公开(公告)号：US10541198B2

公开(公告)日：2020-01-21

申请号：US15884197

申请日：2018-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chien Lin Chang Chien ,  Chin-Li Kao ,  Chang Chi Lee ,  Chih-Pin Hung

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L23/16 ,  H01L23/522 ,  H01L23/528 ,  H01L25/065 ,  H01L21/683 ,  H01L21/48 ,  H01L23/31

Abstract: A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.