公开(公告)号：US20230327333A1

公开(公告)日：2023-10-12

申请号：US18206580

申请日：2023-06-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/52 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q1/22 ,  H01Q21/06 ,  H01Q5/378

CPC classification number: H01Q1/523 ,  H01Q1/243 ,  H01Q5/378 ,  H01Q1/2283 ,  H01Q21/061 ,  H01Q1/48

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US20200153081A1

公开(公告)日：2020-05-14

申请号：US16730411

申请日：2019-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/22 ,  H01L23/367 ,  H01L23/498 ,  H01Q1/02 ,  H01Q1/24 ,  H01Q21/06 ,  H01L23/66

Abstract: A semiconductor package device includes a substrate having an upper surface; an antenna disposed on the upper surface of the substrate; a conductor disposed on the upper surface of the substrate and surrounding the antenna; and a package body covering the conductor and the upper surface of the substrate.

公开(公告)号：US20180342471A1

公开(公告)日：2018-11-29

申请号：US15604545

申请日：2017-05-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/66 ,  H01L23/31 ,  H01P3/08 ,  H01L23/498 ,  H01Q1/22 ,  H01Q13/08

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01P3/08 ,  H01Q1/2283 ,  H01Q13/08

Abstract: An antenna semiconductor package device includes a first conductive layer, a second conductive layer, a first conductive element and a first directing element. The second conductive layer is over the first conductive layer and separated from the first conductive layer. The first conductive element connects the first conductive layer to the second conductive layer. The first directing element is adjacent to the first conductive layer and separated from the first conductive layer by a first gap. The first conductive element, the first conductive layer and the second conductive layer define a waveguide cavity and a radiation opening.