公开(公告)号：US10741483B1

公开(公告)日：2020-08-11

申请号：US16774161

申请日：2020-01-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang Liu ,  Tsung-Tang Tsai ,  Huang-Hsien Chang ,  Ching-Ju Chen

IPC: H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13

Abstract: A substrate structure includes a wiring structure, a first bump pad, a second bump pad and a compensation structure. The wiring structure includes a plurality of redistribution layers. The first bump pad and the second bump pad are bonded to and electrically connected to the wiring structure. An amount of redistribution layers disposed under the first bump pad is greater than an amount of redistribution layers disposed under the second bump pad. The compensation structure is disposed under the second bump pad.

公开(公告)号：US10663746B2

公开(公告)日：2020-05-26

申请号：US15347675

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuan-Feng Chiang ,  Tsung-Tang Tsai ,  Min Lung Huang

IPC: G02B27/30 ,  G02B5/00 ,  G02B19/00

Abstract: According to various embodiments, a collimator includes a substrate defining a plurality of channels through the substrate. The substrate includes a first surface and a second surface opposite the first surface. Each of the channels includes a first aperture exposed from the first surface, a second aperture between the first surface and the second surface, and a third aperture exposed from the second surface. The first aperture and the third aperture are larger than the second aperture.