公开(公告)号：US20180337084A1

公开(公告)日：2018-11-22

申请号：US15600664

申请日：2017-05-19

Applicant: Analog Devices Global

Inventor： Alan John Blennerhassett ,  Bernard Patrick Stenson

IPC: H01L21/768

CPC classification number: H01L21/768 ,  H01F17/00 ,  H01G4/06 ,  H01L21/7682 ,  H01L21/7687 ,  H01L23/5227 ,  H01L29/0649

Abstract: Integrated digital isolators comprise a first transformer coil or capacitor plate mounted on an integrated circuit substrate, and separated from a second transformer coil or capacitor plate via an electrically insulating isolation layer. The electrical isolation that is achieved is dependent upon the material and thickness of the isolation layer. In order to reduce the amount of time required for fabrication while still allowing thick isolation layers to be deployed, in examples of the disclosure pre-formed sheets or tapes of dielectric material are applied to the substrate over the first transformer coil or capacitive plate, for example by being rolled onto the substrate using a heated roller. Such a technique results in a thick isolation layer that is formed using a simple process and much more quickly and reliably than conventional spin-coating or deposition techniques.

公开(公告)号：US20180033565A1

公开(公告)日：2018-02-01

申请号：US15663628

申请日：2017-07-28

Applicant: Analog Devices Global

Inventor： Padraig Fitzgerald ,  Jo-ey Wong ,  Raymond C. Goggin ,  Bernard Patrick Stenson ,  Paul Lambkin ,  Mark Schirmer

IPC: H01H1/00 ,  H01H59/00

CPC classification number: H01H1/0036 ,  H01H59/0009 ,  H01H2001/0084 ,  H01H2059/0018 ,  H01H2059/0072

Abstract: Several features are disclosed that improve the operating performance of MEMS switches such that they exhibit improved in-service life and better control over switching on and off.

公开(公告)号：US20160219719A1

公开(公告)日：2016-07-28

申请号：US14608072

申请日：2015-01-28

Applicant: Analog Devices Global

Inventor： Seamus Paul Whiston ,  Bernard Patrick Stenson ,  Michael Noel Morrissey ,  Michael John Flynn

IPC: H05K3/30 ,  H03H9/22 ,  H05K1/02 ,  H03H9/54 ,  H03H9/62 ,  H05K1/18 ,  H03H9/17 ,  H03H9/46

CPC classification number: H03H9/462 ,  H01L2224/48227 ,  H03H9/174 ,  H03H9/22 ,  H03H2009/02165 ,  H03H2009/155 ,  H03H2009/2421

Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.

Abstract translation: 提供一种修整组分的方法，其中保护组分免受氧化或修剪后的应力变化。 作为该方法的一部分，在组件的修整（例如，激光修整）之前，将保护性玻璃盖结合到半导体衬底的表面。 这可以保护组件在修剪后免受氧化，这可能会改变其组件的值或参数。 它还可以保护组件免受包装过程中作用在其上或与模具相邻的模具上的应力变化，这也可能改变组件的值或参数。