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Patent Agency Ranking
公开(公告)号：US20170117602A1
公开(公告)日：2017-04-27
申请号：US14922037
申请日：2015-10-23
Applicant: Analog Devices Global
Inventor： Conor John McLoughlin , Michael John Flynn , Laurence B. O'Sullivan , Shane Geary , Stephen O'Brien , Bernard P. Stenson , Baoxing Chen , Sarah Carroll , Michael Morrissey , Patrick M. McGuinness
CPC classification number: H01P1/36 , H01L2224/48137 , H01P5/187
Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.
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公开(公告)号：US09941565B2
公开(公告)日：2018-04-10
申请号：US14922037
申请日：2015-10-23
Applicant: Analog Devices Global
Inventor： Conor John McLoughlin , Michael John Flynn , Laurence B. O'Sullivan , Shane Geary , Stephen O'Brien , Bernard P. Stenson , Baoxing Chen , Sarah Carroll , Michael Morrissey , Patrick M. McGuinness
CPC classification number: H01P1/36 , H01L2224/48137 , H01P5/187
Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.
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公开(公告)号：US20160219719A1
公开(公告)日：2016-07-28
申请号：US14608072
申请日：2015-01-28
Applicant: Analog Devices Global
Inventor： Seamus Paul Whiston , Bernard Patrick Stenson , Michael Noel Morrissey , Michael John Flynn
CPC classification number: H03H9/462 , H01L2224/48227 , H03H9/174 , H03H9/22 , H03H2009/02165 , H03H2009/155 , H03H2009/2421
Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.
Abstract translation: 提供一种修整组分的方法，其中保护组分免受氧化或修剪后的应力变化。 作为该方法的一部分，在组件的修整（例如，激光修整）之前，将保护性玻璃盖结合到半导体衬底的表面。 这可以保护组件在修剪后免受氧化，这可能会改变其组件的值或参数。 它还可以保护组件免受包装过程中作用在其上或与模具相邻的模具上的应力变化，这也可能改变组件的值或参数。
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公开(公告)号：US20180148318A1
公开(公告)日：2018-05-31
申请号：US15362296
申请日：2016-11-28
Applicant: Analog Devices Global
Inventor： Michael John Flynn , Paul Lambkin , Seamus Paul Whiston , Christina B. McLoughlin
Abstract: Suspended microelectromechanical systems (MEMS) devices including a stack of one or more materials over a cavity in a substrate are described. The suspended MEMS device may be formed by forming the stack, which may include one or more electrode layers and an active layer, over the substrate and removing part of the substrate underneath the stack to form the cavity. The resulting suspended MEMS device may include one or more channels that extend from a surface of the device to the cavity and the one or more channels have sidewalls with a spacer material. The cavity may have rounded corners and may extend beyond the one or more channels to form one or more undercut regions. The manner of fabrication may allow for forming the stack layers with a high degree of planarity.
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公开(公告)号：US09887687B2
公开(公告)日：2018-02-06
申请号：US14608072
申请日：2015-01-28
Applicant: Analog Devices Global
Inventor： Seamus Paul Whiston , Bernard Patrick Stenson , Michael Noel Morrissey , Michael John Flynn
CPC classification number: H03H9/462 , H01L2224/48227 , H03H9/174 , H03H9/22 , H03H2009/02165 , H03H2009/155 , H03H2009/2421
Abstract: A method of trimming a component is provided in which the component is protected from oxidation or changes in stress after trimming. As part of the method, a protective glass cover is bonded to the surface of a semiconductor substrate prior to trimming (e.g., laser trimming) of a component. This can protect the component from oxidation after trimming, which may change its value or a parameter of the component. It can also protect the component from changes in stress acting on it or on the die adjacent it during packaging, which may also change a value or parameter of the component.
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