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公开(公告)号：US11450469B2
公开(公告)日：2022-09-20
申请号：US16553954
申请日：2019-08-28
Applicant: Analog Devices Global Unlimited Company
Inventor： Paul Lambkin , Patrick J. Murphy , Bernard Patrick Stenson , Laurence B. O'Sullivan , Stephen O'Brien , Shane Geary , Baoxing Chen , Sombel Diaham
Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
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公开(公告)号：US20210153128A1
公开(公告)日：2021-05-20
申请号：US17158733
申请日：2021-01-26
Applicant: Analog Devices Global
Inventor： Philip P.E. Quinlan , Paul Lambkin
Abstract: A wireless sensor node is described. The wireless sensor node may include a wake-up circuitry configured to awaken the sensor when a request is received. The sensor may be placed in a sleep mode, thus saving battery usage until a wake-up signal requesting use of the sensor is received. Powering of the wake-up circuitry may be supplied through energy captured using an energy harvester. In one example, the energy for powering the wake-up circuitry is extracted from the same signal used for awakening the sensor. The wireless sensor mode may operate in a passive mode, in which the energy for powering the wake-up circuitry is harvested, or in a power supply-assisted mode, in which some of the power is provided by a power supply. High quality factors filters may be used to increase the signal-to-noise ratio of the wake-up signals, thus improving the node's ability to recognize activation requests.
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公开(公告)号：US20180148318A1
公开(公告)日：2018-05-31
申请号：US15362296
申请日：2016-11-28
Applicant: Analog Devices Global
Inventor： Michael John Flynn , Paul Lambkin , Seamus Paul Whiston , Christina B. McLoughlin
Abstract: Suspended microelectromechanical systems (MEMS) devices including a stack of one or more materials over a cavity in a substrate are described. The suspended MEMS device may be formed by forming the stack, which may include one or more electrode layers and an active layer, over the substrate and removing part of the substrate underneath the stack to form the cavity. The resulting suspended MEMS device may include one or more channels that extend from a surface of the device to the cavity and the one or more channels have sidewalls with a spacer material. The cavity may have rounded corners and may extend beyond the one or more channels to form one or more undercut regions. The manner of fabrication may allow for forming the stack layers with a high degree of planarity.
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公开(公告)号：US20180130867A1
公开(公告)日：2018-05-10
申请号：US15347724
申请日：2016-11-09
Applicant: Analog Devices Global
Inventor： Paul Lambkin , Michal J. Osiak , Brian Anthony Moane , Stephen O'Brien , Laurence Brendan O'Sullivan , Patrick J. Murphy , Patrick M. McGuinness , Bernard P. Stenson
CPC classification number: H01L28/10 , H01F27/2804 , H01F27/2885 , H01F27/323 , H01F41/041 , H01F41/042 , H01F41/122 , H01F2019/085 , H01F2027/2809 , H01F2027/2819 , H01L23/5227
Abstract: A magnetic isolator is described. The magnetic isolator may comprise a top conductive coil, a bottom conductive coil, and a dielectric layer separating the top conductive coil from the bottom conductive coil. The top conductive coil may comprise an outermost portion having multiple segments. The segments may be configured to reduce the peak electric field in a region of the dielectric layer near the outer edge of the top conductive coil. The top conductive coil may comprise a first lateral segment, and a second lateral segment that is laterally offset with respect to the first lateral segment. The first lateral segment may be closer to the center of the top conductive coil than the second lateral segment, and may be closer to the bottom conductive coil than the second lateral segment. The magnetic isolator may be formed using microfabrication techniques.
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公开(公告)号：US11044022B2
公开(公告)日：2021-06-22
申请号：US16287796
申请日：2019-02-27
Applicant: Analog Devices Global Unlimited Company
Inventor： Laurence B. O'Sullivan , Shane Geary , Baoxing Chen , Bernard Patrick Stenson , Paul Lambkin , Patrick M. McGuinness , Stephen O'Brien , Patrick J. Murphy
Abstract: Isolators having a back-to-back configuration for providing electrical isolation between two circuits are described, in which multiple isolators formed on a single, monolithic substrate are connected in series to achieve a higher amount of electrical isolation for a single substrate than for isolators formed on separate substrates connected in series. Discrete dielectric regions positioned between isolator components forming an isolator provide electrical isolation between the isolator components as well as between the isolators formed on the substrate. The back-to-back isolator may provide one or more communication channels for transfer of information and/or power between different circuits.
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Patent Agency Ranking
公开(公告)号：US20180033565A1
公开(公告)日：2018-02-01
申请号：US15663628
申请日：2017-07-28
Applicant: Analog Devices Global
Inventor： Padraig Fitzgerald , Jo-ey Wong , Raymond C. Goggin , Bernard Patrick Stenson , Paul Lambkin , Mark Schirmer
CPC classification number: H01H1/0036 , H01H59/0009 , H01H2001/0084 , H01H2059/0018 , H01H2059/0072
Abstract: Several features are disclosed that improve the operating performance of MEMS switches such that they exhibit improved in-service life and better control over switching on and off.
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公开(公告)号：US20150311003A1
公开(公告)日：2015-10-29
申请号：US14262188
申请日：2014-04-25
Applicant: Analog Devices Global
Inventor： Padraig L. Fitzgerald , Jo-ey Wong , Raymond C. Goggin , Bernard P. Stenson , Paul Lambkin , Mark Schirmer
CPC classification number: H01H1/0036 , H01H59/0009 , H01H2001/0084 , H01H2059/0018 , H01H2059/0072
Abstract: Several features are disclosed that improve the operating performance of MEMS switches such that they exhibit improved in-service life and better control over switching on and off.
Abstract translation: 公开了几个提高MEMS开关的操作性能的特征，使得它们表现出改善的使用寿命和对开关的更好控制。
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公开(公告)号：US12080460B2
公开(公告)日：2024-09-03
申请号：US17890163
申请日：2022-08-17
Applicant: Analog Devices Global Unlimited Company
Inventor： Paul Lambkin , Patrick J. Murphy , Bernard Patrick Stenson , Laurence B. O'Sullivan , Stephen O'Brien , Shane Geary , Baoxing Chen , Sombel Diaham
CPC classification number: H01F19/08 , H01F2019/085 , H01G2/00 , H04B1/04 , H04B1/16
Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
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公开(公告)号：US20210065955A1
公开(公告)日：2021-03-04
申请号：US16553954
申请日：2019-08-28
Applicant: Analog Devices Global Unlimited Company
Inventor： Paul Lambkin , Patrick J. Murphy , Bernard Patrick Stenson , Laurence B. O'Sullivan , Stephen O'Brien , Shane Geary , Baoxing Chen , Sombel Diaham
IPC: H01F19/08
Abstract: A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.
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公开(公告)号：US10939379B2
公开(公告)日：2021-03-02
申请号：US15809520
申请日：2017-11-10
Applicant: Analog Devices Global
Inventor： Philip P. E. Quinlan , Paul Lambkin
Abstract: A wireless sensor node is described. The wireless sensor node may include a wake-up circuitry configured to awaken the sensor when a request is received. The sensor may be placed in a sleep mode, thus saving battery usage until a wake-up signal requesting use of the sensor is received. Powering of the wake-up circuitry may be supplied through energy captured using an energy harvester. In one example, the energy for powering the wake-up circuitry is extracted from the same signal used for awakening the sensor. The wireless sensor mode may operate in a passive mode, in which the energy for powering the wake-up circuitry is harvested, or in a power supply-assisted mode, in which some of the power is provided by a power supply. High quality factors filters may be used to increase the signal-to-noise ratio of the wake-up signals, thus improving the node's ability to recognize activation requests.
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