HETEROGENOUS MEMORY ACCESS
    11.
    发明申请
    HETEROGENOUS MEMORY ACCESS 有权
    异构存储器访问

    公开(公告)号:US20150082062A1

    公开(公告)日:2015-03-19

    申请号:US14030515

    申请日:2013-09-18

    Abstract: A memory controller operable for selective memory access to areas of memory exhibiting different attributes leverages different memory capabilities that vary access speed, retention time and power consumption, among others. Different areas of memory have different attributes while remaining available to applications as a single contiguous range of addressable memory. The memory controller employs an operating mode that identifies operational priorities for a computing device, such as speed, power conservation, or efficiency. The memory controller identifies an area of memory based on an expected usage of the data stored in the area, for example an access frequency indicating future retrieval. The memory controller therefore selects areas of memory based on the operating mode and the expected usage of data to be stored in the area according to a heuristic that favors areas of memory based on those exhibiting attributes having a high correspondence to the expected usage of the data.

    Abstract translation: 存储器控制器可操作用于对显示不同属性的存储器区域的选择性存储器访问,利用改变存取速度,保留时间和功耗的不同存储器能力等。 存储器的不同区域具有不同的属性,而作为可寻址存储器的单个连续范围,可用于应用。 存储器控制器采用识别计算设备的操作优先级的操作模式,例如速度,功率节省或效率。 存储器控制器基于存储在该区域中的数据的预期使用情况来识别存储器区域,例如指示将来检索的访问频率。 因此,存储器控制器基于操作模式和存储在该区域中的数据的预期使用量,根据启发式方式来选择存储器区域,该启发式方法基于那些呈现与数据的预期使用高度对应的属性的那些, 。

    DYNAMIC OPERATIONS FOR 3D STACKED MEMORY USING THERMAL DATA
    12.
    发明申请
    DYNAMIC OPERATIONS FOR 3D STACKED MEMORY USING THERMAL DATA 有权
    使用热数据的三维堆叠存储器的动态操作

    公开(公告)号:US20130275665A1

    公开(公告)日:2013-10-17

    申请号:US13995899

    申请日:2011-09-30

    Abstract: Dynamic operations for operations for 3D stacked memory using thermal data. An embodiment of a memory device includes memory having multiple coupled memory elements and multiple thermal sensors, including a first thermal sensor in a first area of the memory stack and a second thermal sensor in a second area of the memory stack. A memory controller is to provide operations to modify thermal conditions of the memory elements based at least in part on thermal information generated by the thermal sensors.

    Abstract translation: 使用热量数据的3D堆叠存储器的操作的动态操作。 存储器件的实施例包括具有多个耦合的存储器元件和多个热传感器的存储器,所述多个热传感器包括存储器堆叠的第一区域中的第一热传感器和存储器堆叠的第二区域中的第二热传感器。 存储器控制器至少部分地基于由热传感器产生的热信息来提供操作来修改存储元件的热条件。

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