Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts
    12.
    发明授权
    Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts 失效
    使用碱土金属盐磨料颗粒进行化学机械抛光的方法

    公开(公告)号:US07108586B2

    公开(公告)日:2006-09-19

    申请号:US10870423

    申请日:2004-06-18

    IPC分类号: B24B1/00

    CPC分类号: C09G1/02

    摘要: Particles of strontium carbonate, barium carbonate, strontium sulfate and/or barium sulfate having a sufficient degree of fineness, especially when produced synthetically, are suitable as abrasive agents in chemical mechanical polishing (CMP polishing) of components, e.g., microelectronic components such as silicon wafers. The alkaline earth metal salt compounds are used as slurries in water and/or organic liquids and optionally may contain a dispersing agent, and preferably have a pH value of at least 8.

    摘要翻译: 具有足够细度的碳酸锶,碳酸钡,硫酸锶和/或硫酸钡的颗粒,特别是合成生产时,适合作为组分的化学机械抛光(CMP抛光)中的研磨剂,例如微电子组件如硅 晶圆 碱土金属盐化合物用作水和/或有机液体中的浆料,并且任选地可以含有分散剂,并且优选具有至少8的pH值。

    Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts
    13.
    发明申请
    Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts 失效
    使用碱土金属盐磨料颗粒进行化学机械抛光的方法

    公开(公告)号:US20050048877A1

    公开(公告)日:2005-03-03

    申请号:US10870423

    申请日:2004-06-18

    CPC分类号: C09G1/02

    摘要: Particles of strontium carbonate, barium carbonate, strontium sulfate and/or barium sulfate having a sufficient degree of fineness, especially when produced synthetically, are suitable as abrasive agents in chemical mechanical polishing (CMP polishing) of components, e.g., microelectronic components such as silicon wafers. The alkaline earth metal salt compounds are used as slurries in water and/or organic liquids and optionally may contain a dispersing agent, and preferably have a pH value of at least 8.

    摘要翻译: 具有足够细度的碳酸锶,碳酸钡,硫酸锶和/或硫酸钡的颗粒,特别是合成生产时,适合作为组分的化学机械抛光(CMP抛光)中的研磨剂,例如微电子组件如硅 晶圆 碱土金属盐化合物用作水和/或有机液体中的浆料,并且任选地可以含有分散剂,并且优选具有至少8的pH值。