摘要:
A multimode circuit that is configured to operate in one of multiple operating modes is disclosed. In particular, an exemplary multimode circuit may be configured to operating in one of a full-swing mode, a limited-swing mode, a full-swing to limited-swing converter mode, and a limited-swing to full-swing converter mode. The operating modes of the multimode circuit may be dynamically selectable. One or more multimode circuits may be part of a configurable distribution path for controlling the performance of a signal distribution path or tree of an integrated circuit.
摘要:
Method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.
摘要:
A method for controlling the common-mode output voltage in a fully differential amplifier includes comparing a sensed common-mode output voltage of the fully differential amplifier to a reference voltage, and generating an error signal representing the difference between the sensed common-mode output voltage and the reference voltage. The error signal is utilized to control the body voltage of one or more FET devices included within the fully differential amplifier until the sensed common-mode output voltage is in agreement with said reference voltage.
摘要:
A body-biased enhanced current mirror circuit is disclosed wherein the body voltage of a current mirror device is adjusted to compensate for the effect of changes in the output voltage on the output current, increasing the output impedance. For each instance of the current mirror, this approach has the advantage of requiring no additional margin in operating voltage and of consuming no more circuit area than prior art current mirror designs. In addition, the body-biased enhanced current mirror circuit provides a stable reference current to output current ratio over a wide operating range. An auxiliary MOSFET current mirror device with the body connected to ground may be added in parallel with the body-biased current mirror device to eliminate a non-monotonicity of the current output.
摘要:
A clock distribution network, structure, and method for providing balanced loading is disclosed. In particular, a clock distribution network may be formed of one or more clock fanout distribution levels. Each respective distribution level may include an equal number of buffer circuits and wiring routes that have substantially identical physical and electrical properties. Additionally, a final distribution level may include wiring routes that have substantially identical physical and electrical properties connecting buffer circuits to one or more logic leaf connection nodes.
摘要:
A method of balancing signal interconnect path delays between an analog domain and a digital domain of an integrated circuit includes applying a test signal to a selected one of a plurality of communication paths between the analog domain and the digital domain. A rising edge delay and a falling edge delay of the test signal is equalized by adjusting a body bias voltage of a delay element configured within the selected communication path. A rising edge delay and a falling edge delay for each of the remaining communication paths is compared with the equalized rising edge delay and falling edge delay of the selected communication path, and a body bias voltage for one or more of a plurality of delay elements configured within each of the remaining communication paths is adjusted until corresponding rising and falling edge delays thereof match the equalized rising edge delay and falling edge delay of the selected communication path.
摘要:
A system and method for testing the most complex portions of transceiver devices integrated into digital VLSI chips. The testing is performed in a manufacturing environment with minimal external hardware and using a combination of test-specific circuitry and pattern algorithms built into a mixed signal transceiver implementing a test methodology suitable for application and measurement on a digital tester.
摘要:
Cross-die connection structure and method for a die or chip includes buffer elements having a buffer driver and bypass, and control lines coupled to the buffer elements in order to select one of the buffer driver and bypass for each respective buffer element. A logic network is arranged with the buffer elements to form functional paths, a test unit is structured and arranged to test the functional paths and to be coupled to the control lines, and a configuration storage register to set the selected one of the buffer driver and bypass for each passing functional path.
摘要:
An integrated circuit device includes functional logic, an anti-noise machine, and state monitoring points providing the anti-noise machine with an interface to the functional logic for monitoring states of the functional logic. The anti-noise machine includes indicia defining noise precursor states for the functional logic, and recognition logic coupled to the state monitoring points. The anti-noise machine is operable to generate anti-noise responsive to the recognition logic detecting in the functional logic noise precursor states matching the indicia.
摘要:
A clock distribution network, structure, and method for providing balanced loading is disclosed. In particular, a clock distribution network may be formed of one or more clock fanout distribution levels. Each respective distribution level may include an equal number of buffer circuits and wiring routes that have substantially identical physical and electrical properties. Additionally, a final distribution level may include wiring routes that have substantially identical physical and electrical properties connecting buffer circuits to one or more logic leaf connection nodes.