Proof testing brittle components of electronic devices

    公开(公告)号:US10408722B2

    公开(公告)日:2019-09-10

    申请号:US15280514

    申请日:2016-09-29

    Applicant: Apple Inc.

    Abstract: Methods and a system for proof testing brittle components of electronic devices are disclosed. The method may include positioning the brittle component relative to a probe of a testing system, contacting the probe to a surface of the brittle component at a first location, and applying a first force at the first location using the probe to create a first localized tensile band below the surface of the brittle component. The method may also include contacting the probe to the surface of the brittle component at a second location, distinct from the first location, and applying a second force at the second location using the probe to create a second localized tensile band below the surface of the brittle component.

    Segmented Glass for Foldable Devices

    公开(公告)号:US20240370058A1

    公开(公告)日:2024-11-07

    申请号:US18596261

    申请日:2024-03-05

    Applicant: Apple Inc.

    Abstract: An electronic device may have a display and may be configured to fold about a bend axis that overlaps the display. The display may have a display cover layer having first, second, and third portions that are joined side-by-side. The second portion may have a strip shape that extends along the bend axis and may be configured to bend as the first and third portions are folded towards each other. The second portion may be formed from a different material than the first and third portions to facilitate bending. The second portion may also be characterized by a compressive stress layer that is shallower than compressive stress layers on the first and third portions.

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