3D touch
    13.
    发明授权
    3D touch 有权

    公开(公告)号:US11036327B2

    公开(公告)日:2021-06-15

    申请号:US16708350

    申请日:2019-12-09

    Applicant: Apple Inc.

    Abstract: An electronic device can include a housing and an interface component. The interface component can at least partially define an interface surface, and the interface component and the housing can define an internal volume. A force sensor assembly can be disposed in the internal volume to detect an amount of force applied to the interface surface. The force sensor assembly can include a pressure decay sensor and a gap distance sensor disposed opposite a surface of the interface component.

    Flexible Printed Circuit Structures for Electronic Device Antennas

    公开(公告)号:US20210075090A1

    公开(公告)日:2021-03-11

    申请号:US16563760

    申请日:2019-09-06

    Applicant: Apple Inc.

    Abstract: An electronic device may have peripheral conductive housing structures divided into first and second segments. First and second antennas may be formed from the segments and may be fed using a flexible printed circuit structure. The structure may include a first substrate attached to the first segment, a second substrate soldered to the first substrate and attached to the second segment, and a third substrate soldered to the second substrate. Third and fourth antennas may be formed on the first substrate whereas fifth and sixth antennas are be formed on the second substrate. The second substrate may be folded and may have a lateral area oriented perpendicular to the third, fourth, fifth, and sixth antennas. Modularly forming the structure in this way may maximize the flexibility with which the structure can accommodate other components, thereby minimizing the space consumption associated with mounting and feeding the antennas without sacrificing wireless performance.

    Electronic Device Having a Composite Structure

    公开(公告)号:US20200007670A1

    公开(公告)日:2020-01-02

    申请号:US16569525

    申请日:2019-09-12

    Applicant: Apple Inc.

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Electronic Device Having a Composite Structure

    公开(公告)号:US20180084653A1

    公开(公告)日:2018-03-22

    申请号:US15606920

    申请日:2017-05-26

    Applicant: Apple Inc.

    Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

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