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11 条记录 (耗时 0.015 秒)

    Electronic Device Having a Composite Structure
    2.
    发明申请
    Electronic Device Having a Composite Structure 审中-公开

    公开(公告)号：US20200007670A1

    公开(公告)日：2020-01-02

    申请号：US16569525

    申请日：2019-09-12

    申请人： Apple Inc.

    发明人： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

    IPC分类号： H04M1/18

    摘要： Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Electronic Device Having a Composite Structure
    3.
    发明申请
    Electronic Device Having a Composite Structure 审中-公开

    公开(公告)号：US20180084653A1

    公开(公告)日：2018-03-22

    申请号：US15606920

    申请日：2017-05-26

    申请人： Apple Inc.

    发明人： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

    IPC分类号： H05K5/00 ,  H05K5/04

    CPC分类号： H04M1/185 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/1656 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/0283

    摘要： Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Electronic device having a composite structure
    5.
    发明授权
    Electronic device having a composite structure 有权

    公开(公告)号：US10447834B2

    公开(公告)日：2019-10-15

    申请号：US15606920

    申请日：2017-05-26

    申请人： Apple Inc.

    发明人： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

    IPC分类号： H05K5/00 ,  H04M1/18 ,  G06F1/16 ,  H04M1/02

    摘要： Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Electronic device having a composite structure
    6.
    发明授权
    Electronic device having a composite structure 有权

    公开(公告)号：US11418638B2

    公开(公告)日：2022-08-16

    申请号：US16569525

    申请日：2019-09-12

    申请人： Apple Inc.

    发明人： Abhijeet Misra ,  Steven J. Osborne ,  Ian A. Spraggs ,  Marwan Rammah ,  William A. Counts

    IPC分类号： G06F1/16 ,  H04M1/18 ,  H04M1/02

    摘要： Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

    Sparse laser etch anodized surface for cosmetic grounding
    7.
    发明授权
    Sparse laser etch anodized surface for cosmetic grounding 有权

    公开(公告)号：US10999917B2

    公开(公告)日：2021-05-04

    申请号：US16409455

    申请日：2019-05-10

    申请人： Apple Inc.

    发明人： Rhett D. Gentile ,  Peter N. Jeziorek ,  Sunita Venkatesh ,  Lauren M. Farrell ,  Steven J. Osborne

    IPC分类号： H05F3/02 ,  H05K5/02 ,  H05K5/00

    摘要： A aesthetically appealing mounting system for an electronic device capable of forming a semi-conductive path for electro-static discharge. The mounting system can include an electrically conductive layer covered by a cosmetic anodized layer with multiple micro-perforations formed through the anodized layer exposing a small portion of the electrically conductive layer. The micro-perforations can be formed by laser-etching the cosmetic anodized layer to provide a grounding path while the micro-perforations remain visually undetectable. A semi-conductive wear layer can be configured to couple with the anodized layer. In some embodiments, the semi-conductive wear layer is in a recess on an electronic device. In some embodiments, the semi-conductive wear layer is comprised of a conformal conductive rubber.

    SPARSE LASER ETCH ANODIZED SURFACE FOR COSMETIC GROUNDING
    9.
    发明申请
    SPARSE LASER ETCH ANODIZED SURFACE FOR COSMETIC GROUNDING 审中-公开

    公开(公告)号：US20200100349A1

    公开(公告)日：2020-03-26

    申请号：US16409455

    申请日：2019-05-10

    申请人： Apple Inc.

    发明人： Rhett D. Gentile ,  Peter N. Jeziorek ,  Sunita Venkatesh ,  Lauren M. Farrell ,  Steven J. Osborne

    IPC分类号： H05F3/02 ,  H05K5/00 ,  H05K5/02

    摘要： A aesthetically appealing mounting system for an electronic device capable of forming a semi-conductive path for electro-static discharge. The mounting system can include an electrically conductive layer covered by a cosmetic anodized layer with multiple micro-perforations formed through the anodized layer exposing a small portion of the electrically conductive layer. The micro-perforations can be formed by laser-etching the cosmetic anodized layer to provide a grounding path while the micro-perforations remain visually undetectable. A semi-conductive wear layer can be configured to couple with the anodized layer. In some embodiments, the semi-conductive wear layer is in a recess on an electronic device. In some embodiments, the semi-conductive wear layer is comprised of a conformal conductive rubber.