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公开(公告)号：US11811133B2
公开(公告)日：2023-11-07
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US11728569B2
公开(公告)日：2023-08-15
申请号：US17111131
申请日：2020-12-03
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew D. Hill , Mattia Pascolini
CPC classification number: H01Q9/0485 , H01Q1/243 , H01Q21/0075
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.
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公开(公告)号：US11700035B2
公开(公告)日：2023-07-11
申请号：US16920297
申请日：2020-07-02
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Bilgehan Avser , David Garrido Lopez , Forhad Hasnat , Mattia Pascolini , Mikal Askarian Amiri , Rodney A. Gomez Angulo , Thomas W. Yang , Jiechen Wu , Eric N. Nyland , Simone Paulotto , Jennifer M. Edwards , Matthew D. Hill , Ihtesham H. Chowdhury , David A. Hurrell , Siwen Yong , Jiangfeng Wu , Daniel C. Wagman , Soroush Akbarzadeh , Robert Scritzky , Subramanian Ramalingam
CPC classification number: H04B3/52 , G01R31/2822 , H01Q1/2283 , H01Q13/24 , H04B3/54
Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.
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公开(公告)号：US11139588B2
公开(公告)日：2021-10-05
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20210265745A1
公开(公告)日：2021-08-26
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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Patent Agency Ranking
公开(公告)号：US10686252B2
公开(公告)日：2020-06-16
申请号：US14306024
申请日：2014-06-16
Applicant: Apple Inc.
Inventor： Siwen Yong , Qingxiang Li , Yi Jiang , Robert W. Schlub , Umar Azad , Rodney A. Gomez Angulo , Enrique Ayala Vazquez
Abstract: An electronic device may be provided with wireless circuitry that includes a radio-frequency transceiver circuit and an antenna. The antenna may be a patch antenna formed from a patch antenna resonating element and an antenna ground. The patch antenna resonating element may be formed from a metal patch on a printed circuit board. The antenna ground may be formed from a metal housing having a planar rear wall that lies in a plane parallel to the metal patch. The radio-frequency transceiver circuit may be coupled to the metal patch through traces on the printed circuit and may be coupled to rear wall of the housing through a screw and a screw boss in the housing. Buttons and other electrical components may be mounted on the printed circuit board and may be coupled to control circuitry on the printed circuit board through the metal patch.
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公开(公告)号：US20200021019A1
公开(公告)日：2020-01-16
申请号：US16036770
申请日：2018-07-16
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Travis A. Barbieri , Georgios Atmatzakis , Matthew A. Mow
Abstract: An electronic device may be provided with antenna structures that convey radio-frequency signals greater than 10 GHz. The antenna structures may include overlapping first and second patches. The first patch may include a hole. A transmission line for the second patch may include a conductive via extending through the hole. The via may be coupled to a first end of a trace. A second end of the trace may be coupled to a feed terminal on the second patch over an additional via. The hole may be located within a central region of the first patch to allow the via to pass through the hole without electromagnetically coupling to the first patch. If desired, adjustable impedance matching circuits may be used to couple selected impedances to the antenna feeds that help ensure that the first and second patch antennas are sufficiently isolated from each other.
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公开(公告)号：US20190319367A1
公开(公告)日：2019-10-17
申请号：US15950677
申请日：2018-04-11
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US20190312347A1
公开(公告)日：2019-10-10
申请号：US15950072
申请日：2018-04-10
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
Abstract: An electronic device may be provided with a dielectric cover layer and a conductive layer on the dielectric cover layer. The conductive layer may define an opening. A dielectric spacer may be mounted to the cover layer within the opening. A substrate may be mounted to the spacer. Vertical conductive structures may extend from the conductive layer to the substrate and may laterally surround the spacer. A phased antenna array may be formed on the substrate and aligned with the opening. The cover layer may have a dielectric constant and thickness that are selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The spacer and the conductive structures may exhibit a cavity resonance at the wavelength. The array and the conductive structures may radiate radio-frequency signals at millimeter wave frequencies through the dielectric cover layer.
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公开(公告)号：US10164679B1
公开(公告)日：2018-12-25
申请号：US15717367
申请日：2017-09-27
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Umar Azad , Pietro Romano , David Garrido Lopez , Lu Zhang , Rodney A. Gomez Angulo , Mattia Pascolini
IPC: H04B1/44 , H04M1/02 , H04B1/3827 , H04B7/0413
Abstract: An electronic device may have conductive housing structures and first, second, third, and fourth slot antennas having respective first, second, third, and fourth slot elements in the conductive housing structures. The third slot element may be interposed between the first and second slot elements and the second slot element may be interposed between the third and fourth slot elements. Switching circuitry may be coupled between a transceiver and the slot elements. Control circuitry may control the switching circuitry to activate a selected pair of the slot antennas based on an orientation of the device or other data. The active pair of antennas may convey radio-frequency signals at the same frequencies using a multiple-input and multiple-output (MIMO) communications scheme. In this way, the device may perform wireless communications at relatively high data throughputs regardless of how the device is being held by a user.
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