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公开(公告)号:US20250143089A1
公开(公告)日:2025-05-01
申请号:US18690574
申请日:2023-12-13
Applicant: Applied Materials, Inc.
Inventor: Yu-Hsin LIN , Takashi ANJIKI , Chung-chia CHEN , Jae Wook JEONG , Ji Young CHOUNG , Jungmin LEE
IPC: H10K59/122 , H10K59/12 , H10K59/80 , H10K102/00
Abstract: Embodiments described herein relate to a device. The device includes a substrate, overhang structures disposed over the substrate, and a plurality of sub-pixels. Each overhang structure has a second structure disposed over a first structure. The second structure has an overhang extension extending laterally past the first structure. The first structure includes a first sidewall opposing a second sidewall. The first sidewall and the second sidewall are connected to each other. The plurality of sub-pixels each include an organic light-emitting diode (OLED) material, and a cathode disposed over the OLED material. The cathode extends under the overhang extension such that the cathode contacts the first sidewall and the second sidewall of the first structure under the overhang extension.
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公开(公告)号:US20240065043A1
公开(公告)日:2024-02-22
申请号:US18498140
申请日:2023-10-31
Applicant: Applied Materials, Inc.
Inventor: Ji-young CHOUNG , Jungmin LEE , Chung-chia CHEN , Yusin LIN , Dieter HAAS , Si Kyoung KIM
IPC: H10K59/122 , H10K50/822 , H10K59/173
CPC classification number: H10K59/122 , H10K50/822 , H10K59/173
Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.
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公开(公告)号:US20240023379A1
公开(公告)日:2024-01-18
申请号:US18352802
申请日:2023-07-14
Applicant: Applied Materials, Inc.
Inventor: Ji Young CHOUNG , Chung-chia CHEN , Yu-hsin LIN , Jungmin LEE , Dieter HAAS , Si Kyoung KIM
IPC: H10K59/122 , H10K50/84 , H10K71/16
CPC classification number: H10K59/122 , H10K50/84 , H10K71/16 , H10K2102/103
Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.
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公开(公告)号:US20230354649A1
公开(公告)日:2023-11-02
申请号:US18065124
申请日:2022-12-13
Applicant: Applied Materials, Inc.
Inventor: Ji-young CHOUNG , Jungmin LEE , Chung-chia CHEN , Yusin LIN , Dieter HAAS , Si Kyoung KIM
IPC: H10K59/122 , H10K50/822 , H10K59/173
CPC classification number: H01L27/3246 , H01L51/5225 , H01L27/3283
Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.
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公开(公告)号:US20230263014A1
公开(公告)日:2023-08-17
申请号:US18183822
申请日:2023-03-14
Applicant: Applied Materials, Inc.
Inventor: Yu-hsin LIN , Ji Young CHOUNG , Chung-chia CHEN , Jungmin LEE , Wen-Hao WU , Takashi ANJIKI , Takuji KATO , Dieter HAAS , Si Kyoung KIM , Stefan KELLER
IPC: H10K59/122 , H10K59/173
CPC classification number: H10K59/122 , H10K59/173 , H10K71/16
Abstract: Embodiments described herein relate to a device including a substrate, a plurality of adjacent pixel-defining layer (PDL) structures disposed over the substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent first overhangs, adjacent second overhangs, an anode, a hole injection layer (HIL) material, an additional organic light emitting diode (OLED) material, and a cathode. Each first overhang is defined by a body structure disposed on and extending laterally past a base structure disposed on the PDL structure. Each second overhang is defined by a top structure disposed on and extending laterally past the body structure. The HIL material is disposed over and in contact with the anode and disposed under the adjacent first overhangs. The additional OLED material is disposed on the HIL material and extends under the first overhang.
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公开(公告)号:US20240268205A1
公开(公告)日:2024-08-08
申请号:US18431001
申请日:2024-02-02
Applicant: Applied Materials, Inc.
Inventor: Ji Young CHOUNG , Chung-chia CHEN , Jungmin LEE , Yu-hsin LIN , Takuji KATO
IPC: H10K59/80 , H10K59/12 , H10K59/122
CPC classification number: H10K59/8794 , H10K59/1201 , H10K59/122 , H10K59/80521
Abstract: Devices with sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, a plurality of pixel-defining layer (PDL) structures disposed over the substrate, each PDL structure having an upper PDL surface, and a plurality of heat absorbent structures disposed on the upper PDL surface of the plurality PDL structures. Each adjacent heat absorbent structure includes a top surface and two sidewalls. Adjacent heat absorbent structures define sub-pixels of the device, each sub-pixel includes an anode, an OLED material disposed over the anode, a cathode disposed over the OLED material, and an encapsulation layer disposed over the cathode and over a first portion of the top surface of the first heat absorbent structure and a second portion of the top surface of the second heat absorbent structure.
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公开(公告)号:US20240147825A1
公开(公告)日:2024-05-02
申请号:US17974385
申请日:2022-10-26
Applicant: Applied Materials, Inc.
Inventor: Chung-chia CHEN , Yu-Hsin LIN , Ji Young CHOUNG , Jungmin LEE , Wen-Hao WU , Dieter HAAS
CPC classification number: H01L51/56 , H01L27/3246 , H01L51/5253 , H01L2227/323 , H01L2251/5315
Abstract: Examples disclosed herein relate to device. The device includes a substrate, a plurality of adjacent pixel-defining layer (PDL structures disposed over the substrate, and a plurality of sub-pixels. The PDL structure have a top surface coupled to adjacent sidewalls of the PDL structure. The plurality of sub-pixels are defined by the PDL structures. Each sub-pixel includes an anode, an organic light emitting diode (OLED), a cathode, and an encapsulation layer. The organic light emitting diode (OLED) material disposed over the anode. The OLED material extends over the top surface of the PDL structure past the adjacent sidewalls. The cathode is disposed over the OLED material. The cathode extends over the top surface of the PDL structure past the adjacent sidewalls. The encapsulation layer is disposed over the cathode. The encapsulation layer has a first sidewall and a second sidewall.
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公开(公告)号:US20240121995A1
公开(公告)日:2024-04-11
申请号:US18545709
申请日:2023-12-19
Applicant: Applied Materials, Inc.
Inventor: Jungmin LEE , Chung-chia CHEN , Ji Young CHOUNG , Yu-hsin LIN
IPC: H10K59/122 , H10K59/12 , H10K59/80
CPC classification number: H10K59/122 , H10K59/1201 , H10K59/80521
Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.
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公开(公告)号:US20240107819A1
公开(公告)日:2024-03-28
申请号:US18528906
申请日:2023-12-05
Applicant: Applied Materials, Inc.
Inventor: Jungmin LEE , Chung-chia CHEN , Ji Young CHOUNG , Yu-hsin LIN
IPC: H10K59/122 , H10K59/12 , H10K59/80
CPC classification number: H10K59/122 , H10K59/1201 , H10K59/80521
Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.
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公开(公告)号:US20240040831A1
公开(公告)日:2024-02-01
申请号:US18363574
申请日:2023-08-01
Applicant: Applied Materials, Inc.
Inventor: Chung-chia CHEN , Jungmin LEE , Yu-hsin LIN , Ji Young CHOUNG , Wen-Hao WU , Dieter HAAS , Si Kyoung KIM
IPC: H10K59/121 , H10K59/65 , H10K59/12
CPC classification number: H10K59/121 , H10K59/65 , H10K59/1201
Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein, include the sub-pixel circuits and at least one sensor opening adjacent to the overhang structure and an adjacent sub-pixel circuit. The at least one sensor opening includes a sensor disposed thereunder. Other configurations displays described herein, include sub-pixel circuits including OLED sub-pixels and a transparent sub-pixel such that a sensor is disposed thereunder. The configurations described herein utilize sensors that are integrated to increase the transmittance of the display while eliminating the need for bezels and reducing dead zones in the display.
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