公开(公告)号：US20250169326A1

公开(公告)日：2025-05-22

申请号：US18949389

申请日：2024-11-15

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Jungmin LEE ,  Yu-Hsin LIN ,  Ji Young CHOUNG ,  Wen-Hao WU

IPC: H10K59/60 ,  H10K59/12 ,  H10K59/70 ,  H10K65/00 ,  H10K102/10

Abstract: Embodiments described herein relate to sub-pixel circuits, displays including sub-pixel circuits, and a method of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. Some configurations of the displays described herein include a backplane and a plurality of sub-pixel circuits separated by adjacent overhang structures disposed over the backplane. The at least one sub-pixel circuit has sub-pixels surrounded by adjacent overhang structures. The sub-pixel circuit includes one or more organic light-emitting diode (OLED) sub-pixels and an organic photodiode (OPD) sub-pixel. The OLED sub-pixels include a transistor disposed in the backplane, an electrode disposed over the transistor, an OLED material disposed over the electrode. The electrode is connected to the transistor of the backplane. The OPD sub-pixel includes an electrode and an organic photodiode (OPD) material disposed over the electrode.

公开(公告)号：US20240114727A1

公开(公告)日：2024-04-04

申请号：US18528888

申请日：2023-12-05

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20250048845A1

公开(公告)日：2025-02-06

申请号：US18774523

申请日：2024-07-16

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Dieter HAAS ,  Yu-hsin LIN ,  Chung-chia CHEN ,  Ji Young CHOUNG

IPC: H10K59/122

Abstract: The present disclosure provides sub-pixels. The sub-pixels include a plurality of pixel structures separating a plurality of anodes. The plurality of pixel structures are disposed over a substrate. A plurality of overhang structures are disposed over the plurality of pixel structures. Each overhang structure of the plurality of overhang structures include an upper portion including amorphous silicon disposed over a lower portion including germanium. A bottom surface of the upper portion extends laterally past an upper surface of the lower portion. An organic light emitting diode (OLED) material is disposed over an upper surface of the plurality of anodes and an upper surface of the plurality of pixel structures. A cathode is disposed over the OLED material and the upper surface of the plurality of pixel structures.

公开(公告)号：US20240341127A1

公开(公告)日：2024-10-10

申请号：US18746413

申请日：2024-06-18

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-Hsin LIN

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/80521

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20230013772A1

公开(公告)日：2023-01-19

申请号：US17935770

申请日：2022-09-27

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Chung-chia CHEN ,  Yu-hsin LIN ,  Jungmin LEE ,  Dieter HAAS ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

公开(公告)号：US20250048844A1

公开(公告)日：2025-02-06

申请号：US18771267

申请日：2024-07-12

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Dieter HAAS ,  Yu-Hsin LIN ,  Chung-chia CHEN ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/12

Abstract: Embodiments described herein relate to a method of forming a sub-pixel. The method includes depositing a first structure material over a substrate and an anode. The anode is disposed over the substrate. An interlayer dielectric (ILD) material is deposited over the first structure material. An ILD material is patterned. An intermediate structure material is deposited over the ILD material and the first structure material. A second structure material is deposited over the intermediate structure material. A portion of the second structure material is removed to form a second structure. A portion of the intermediate structure material disposed over the ILD material is removed to form an intermediate structure. A portion of the first structure material is removed to form a first structure of an overhang structure. The overhang structure comprises the first structure, the second structure, and the intermediate structure.

公开(公告)号：US20250008823A1

公开(公告)日：2025-01-02

申请号：US18594527

申请日：2024-03-04

Applicant: Applied Materials, Inc.

Inventor： Zongkai WU ,  Pei Chia CHEN ,  Wen-Hao WU ,  Jungmin LEE ,  Chung-chia CHEN ,  Yu-Hsin LIN ,  Kevin CHEN ,  Wenhui LI ,  Yu-Min WANG ,  Lai ZHAO ,  Soo Young CHOI

IPC: H10K59/80 ,  H10K59/12 ,  H10K59/122

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display, such as an organic light-emitting diode (OLED) display, are provided. In one example, a sub-pixel includes a substrate, adjacent overhang structures, an anode, an OLED material, a cathode, an encapsulation layer stack. The encapsulation layer stack includes a first layer, a second layer disposed over the first layer, and a third layer. The first layer and the second layer have a first portion disposed over the cathode, a second portion disposed over a sidewall of each overhang structure, and a third portion disposed under an underside surface of an extension of each overhang structure. A gap is defined by contact of the first portion of the second layer and the third portion of the second layer. The third layer is disposed over the second layer outside of the gap.

公开(公告)号：US20240315086A1

公开(公告)日：2024-09-19

申请号：US18601566

申请日：2024-03-11

Applicant: Applied Materials, Inc.

Inventor： Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-Hsin LIN ,  Jungmin LEE

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/873

Abstract: Embodiments described herein generally relate to a device. The device includes a substrate, and a plurality of sub-pixels. Each sub-pixel includes adjacent overhangs disposed over the substrate. Each overhang includes two or more overhang structures, an organic light emitting diode (OLED) material, and a cathode. The overhang structures include a first overhang defined by a first overhang structure outer extension of a second structure extending laterally past a first structure. The first structure is disposed over the substrate. The second structure is disposed over the first structure. The second structure of a first overhang structure is separated from the second structure of a second overhang structure by a structure gap. The OLED material is disposed over an anode. The cathode is disposed over the OLED material.

公开(公告)号：US20230371315A1

公开(公告)日：2023-11-16

申请号：US18315362

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Chung-chia CHEN ,  Ji Young CHOUNG ,  Yu-hsin LIN

IPC: H10K59/122 ,  H10K59/80 ,  H10K59/12

CPC classification number: H10K59/122 ,  H10K59/80521 ,  H10K59/1201

Abstract: Embodiments described herein relate to a sub-pixel. The sub-pixel includes an anode, overhang structures, separation structures, an organic light emitting diode (OLED) material, and a cathode. The anode is defined by adjacent first pixel isolation structures (PIS) and adjacent second PIS. The overhang structures are disposed on the first PIS. The overhang structures include a second structure disposed over the first structure and an intermediate structure disposed between the second structure and the first structure. A bottom surface of the second structure extends laterally past an upper surface of the first structure. The first structure is disposed over the first PIS. Separation structures are disposed over the second PIS. The OLED material is disposed over the anode and an upper surface of the separation structures. The cathode disposed over the OLED material and an upper surface of the separation structures.

公开(公告)号：US20230320139A1

公开(公告)日：2023-10-05

申请号：US18021856

申请日：2020-09-21

Applicant: Applied Materials, Inc. ,  National Taiwan Universtiy

Inventor： Chung-chia CHEN ,  Wan-Yu LIN ,  Hyunsung BANG ,  Lisong XU ,  Gang YU ,  Byung-Sung KWAK ,  Robert Jan VISSER ,  Chung-Chih WU ,  Hoang Yan LIN ,  Guo-Dong SU ,  Wei-Kai LEE ,  Yi-Jiun CHEN ,  Ting-Sheng HSU ,  Po-Hsiang LIAO ,  Wei-Cheng LIN

IPC: H10K59/122 ,  H10K59/80 ,  H10K59/131

CPC classification number: H10K59/122 ,  H10K59/879 ,  H10K59/80524 ,  H10K59/131 ,  H10K2102/101

Abstract: Embodiments of the present disclosure generally relate to electroluminescent devices, such as organic light-emitting diodes, and displays including electroluminescent devices. In an embodiment is provided an electroluminescent device that includes a pixel defining layer, an organic emitting unit disposed over at least a portion of the pixel defining layer, and a filler layer disposed over at least a portion of the organic emitting unit, wherein a refractive index of the pixel defining layer is lower than a refractive index of the filler layer, and wherein the refractive index of the pixel defining layer is lower than a refractive index of one or more layers of the organic emitting unit. In another embodiment is provided a display device that includes a substrate, a thin film transistor formed on the substrate, an interconnection electrically coupled to the thin film transistor, and an electroluminescent device electrically coupled to the interconnection.